Reconnectable chip interface and chip package
First Claim
1. A integrated circuit device package comprising:
- an integrated circuit device having an active side with at least one electrical connection pad thereon;
an interconnect substrate for mounting said integrated circuit device on an electronic circuit substrate, said interconnect substrate having a first side adapted to mate with the active side of the integrated circuit device to form an enclosed space and a second side adapted for electrical and mechanical connection to the electronic circuit substrate, the interconnect substrate having at least one set of electrical connection pads, each set comprising a first electrical connection pad on the first side of the interconnect substrate adapted for electrical connection to the at least one electrical connection pad on the integrated circuit device and a second electrical connection pad on the second side of the interconnect substrate electrically connected to the first connection pad, said second electrical connection pad on the second side of the interconnect substrate being adapted for electrical and mechanical connection to the electronic circuit substrate.
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Abstract
An assembly of the present invention has a substrate and an integrated circuit device adapted to be electrically and mechanically connected to the substrate. Electrical connection pads on the circuit device and on the substrate contact one another when the circuit device and the substrate are connected. At least one first projection on one of the device and on the substrate and at least two second projections on the other of the device and the substrate each have a respective axial length and are sized and shaped for a close friction fit along their axial lengths when the projections are interdigitated relative to one another. An integrated circuit device package of the present invention includes an integrated circuit device and an interconnect substrate for mounting the circuit device on an electronic circuit substrate. The interconnect substrate mates with the active side of the circuit device to form an enclosed space.
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Citations
30 Claims
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1. A integrated circuit device package comprising:
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an integrated circuit device having an active side with at least one electrical connection pad thereon;
an interconnect substrate for mounting said integrated circuit device on an electronic circuit substrate, said interconnect substrate having a first side adapted to mate with the active side of the integrated circuit device to form an enclosed space and a second side adapted for electrical and mechanical connection to the electronic circuit substrate, the interconnect substrate having at least one set of electrical connection pads, each set comprising a first electrical connection pad on the first side of the interconnect substrate adapted for electrical connection to the at least one electrical connection pad on the integrated circuit device and a second electrical connection pad on the second side of the interconnect substrate electrically connected to the first connection pad, said second electrical connection pad on the second side of the interconnect substrate being adapted for electrical and mechanical connection to the electronic circuit substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A process for forming an integrated circuit device package, the process comprising the steps of:
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fabricating an integrated circuit device wafer having an active side;
fabricating an interconnect substrate wafer such that said wafer has electrical connection pads on opposite sides thereof and a recessed surface;
electrically and mechanically connecting the integrated circuit device wafer and interconnect substrate wafer such that the two wafers form an enclosed space between the active side of said integrated circuit device wafer and the recessed surface of the interconnect substrate wafer; and
dicing the integrated circuit device wafer and interconnect substrate wafer to form one or more individual integrated circuit device packages. - View Dependent Claims (22, 23)
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24. An interconnect substrate for mounting an integrated circuit device on an electronic circuit substrate, said interconnect substrate comprising:
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a first side adapted to mate with an active side of the integrated circuit device to form an enclosed space and a second side adapted for electrical and mechanical connection to the electronic substrate, a first electrical connection pad on the first side of the interconnect substrate adapted for electrical connection to the integrated circuit device, and a second electrical connection pad on the second side of the interconnect substrate electrically connected to the first connection pad, said second electrical connection pad on the second side of the interconnect substrate being adapted for electrical and mechanical connection to the electronic circuit substrate. - View Dependent Claims (25, 26, 27, 28, 29, 30)
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Specification