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Hybrid integrated circuit

  • US 20050012192A1
  • Filed: 06/09/2004
  • Published: 01/20/2005
  • Est. Priority Date: 06/30/2003
  • Status: Abandoned Application
First Claim
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1. A hybrid integrated circuit comprising:

  • a first wiring substrate comprising a plurality of signal line layers and a plurality of ground conductive layers, each of the signal line layers and a corresponding one of the ground conductive layers making up a microstrip line;

    a cavity formed in the first wiring substrate to expose one of the ground conductive layers at a bottom of the cavity;

    a semiconductor chip mounted in the cavity and having a bottom surface fixed to the one of the ground conductive layers; and

    a mounting component mounted to an upper surface of the first wiring substrate but not above the cavity.

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