Reconnectable chip interface and chip package

• US 20050012212A1
• Filed: 07/17/2003
• Published: 01/20/2005
• Est. Priority Date: 07/17/2003
• Status: Abandoned Application

• Current Assignee: Alent, Inc. (Element Solutions Inc)
• Original Assignee: Alent, Inc. (Element Solutions Inc)
• Inventors: Gilleo, Kenneth B.
• Application Number:
  US10/621,773
• Publication Number:
  US 20050012212A1
• Time in Patent Office: Days
• US Class Current: 257/737
• CPC Class Codes: B81C 3/002 Aligning microparts
• CPC Class Codes: H01L 2224/05009 Bonding area integrally formed with a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/051 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/056 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/10135 Alignment aids
• CPC Class Codes: H01L 2224/16105 the bump connector connecting bonding areas being not aligned with respect to each other
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/81136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/81139 Guiding structures on the body
• CPC Class Codes: H01L 2224/81141 Guiding structures both on and outside the body
• CPC Class Codes: H01L 2224/81193 wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81194 Lateral distribution of the bump connectors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/81898 Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

An assembly of the present invention has a substrate and an integrated circuit device adapted to be electrically and mechanically connected to the substrate. Electrical connection pads on the circuit device and on the substrate contact one another when the circuit device and the substrate are connected. At least one first projection on one of the device and on the substrate and at least two second projections on the other of the device and the substrate each have a respective axial length and are sized and shaped for a close friction fit along their axial lengths when the projections are interdigitated relative to one another. An integrated circuit device package of the present invention includes an integrated circuit device and an interconnect substrate for mounting the circuit device on an electronic circuit substrate. The interconnect substrate mates with the active side of the circuit device to form an enclosed space.

Claims

1. An assembly comprising:

a substrate,

an integrated circuit device adapted to be electrically and mechanically connected to the substrate,

electrical connection pads on the integrated circuit device and on the substrate adapted to contact one another when the circuit device and the substrate are connected,

said connection pads comprising at least one first projection on one of the device and the substrate and at least two second projections on the other of the device and the substrate, each projection having a respective axial length extending from an external surface of a respective connection pad,

the at least one first projection and at least two second projections having respective external surfaces that are sized and shaped for a close friction fit along their axial lengths when interdigitated relative to one another thereby to create an axial contact area between respective projections to establish an electrical and mechanical connection between the device and the substrate.

2. An assembly as set forth in claim 1 wherein said at least one first projection is on the integrated circuit device and said at least two second projections are on the substrate.

3. An assembly as set forth in claim 1 wherein said at least one first projection comprises a headless projection.

4. An assembly as set forth in claim 1 wherein said at least one first projection comprises a solid cylindrical body.

5. An assembly as set forth in claim 1 wherein said at least one first projection is substantially rigid.

6. An assembly as set forth in claim 4 wherein said body is formed integral with said one of the circuit device or substrate.

7. An assembly as set forth in claim 6 wherein said body comprises a metal external surface for contacting said at least two second projections.

8. An assembly as set forth in claim 4 wherein said at least two second projections comprise solid cylindrical bodies and are spaced apart to form an open space for receiving said at least one first projection.

9. An assembly as set forth in claim 8 wherein said solid cylindrical bodies of the first and second projections are substantially rigid.

10. An assembly as set forth in claim 8 wherein said second projections have metal external surfaces for contact with said body of the at least one first projection.

11. An assembly as set forth in claim 1 wherein said at least one first projection comprises a frustum-shaped body.

12. An assembly as set forth in claim 1 wherein said at least one first projection and said at least two second projections have elliptical cross-sections.

13. An assembly as set forth in claim 1 wherein said at least one first projection and said plurality of second projections have polygonal cross-sections.

14. An assembly as set forth in claim 1 wherein said integrated circuit device is a MEMS device.

15. An assembly as set forth in claim 1 wherein said integrated circuit device is an optical MEMS device.

16. An assembly as set forth in claim 1 wherein said substrate is a chip carrier platform.

17. An assembly as set forth in claim 1 wherein said substrate is a circuit board.

18. An assembly comprising:

a substrate having a plurality of connection pads, each pad comprising a plurality of spaced apart electrically conductive substrate projections extending from an external surface of the pads and forming an open space therebetween, each substrate projection having a respective axial length,

an integrated circuit device adapted to be electrically and mechanically connected to the substrate, said device having a plurality of connection pads, each pad comprising at least one electrically conductive device projection extending from an external surface of the pad, each device projection having a respective axial length and being adapted for insertion into said open space such that the device and the substrate are held in electrical and mechanical connection by a friction fit between respective axial lengths of the substrate and device projections.

19. An assembly as set forth in claim 18 wherein at least one of said substrate and device projections comprises a solid cylindrical body having a metal external surface.

20. An assembly as set forth in claim 18 wherein at least one of said substrate and device projections comprises a frustum-shaped body.

21. An assembly as set forth in claim 20 wherein said frustum-shaped body comprises a head portion adapted for insertion into said open space between substrate projections.

22. An assembly as set forth in claim 18 wherein at least one of said substrate and device projections has an elliptical cross-section.

23. An assembly as set forth in claim 18 wherein at least one of said substrate and device projections has a polygonal cross-section.

24. An assembly comprising:

a substrate,

an electrical circuit device adapted to be electrically and mechanically connected to the substrate,

a first connection pad on the substrate comprising a first set of two or more electrically conductive connecting elements protruding from an external surface of one pad, each connecting element of the first set having an axial length generally perpendicular to the substrate,

a second connection pad on the circuit device comprising a second set of one or more electrically conductive connecting elements protruding from an external surface of the pad and adapted for interdigitation with the connecting elements of the first set of connecting elements, each connecting element of the second set having an axial length, said first and second sets of connecting elements having

respective external surfaces that are sized and shaped for a close friction fit along their axial lengths when interdigitated relative to one another thereby to create an axial contact area between respective projections to establish an electrical and mechanical connection between said device and the substrate.

25. An assembly as set forth in claim 24 wherein said second set of electrically conductive connecting elements comprises a solid cylindrical body having a metal external surface.

26. An assembly as set forth in claim 24 wherein said second set of electrically conductive connecting elements comprises a frustum-shaped body extending from the second connection pad.

27. An assembly as set forth in claim 24 wherein said second set of electrically conductive connecting elements have elliptical cross-sections.

28. An assembly as set forth in claim 24 wherein said second set of electrically conductive connecting elements have polygonal cross-sections.

29-58. -58. (Cancelled)