Solder interface locking using unidirectional growth of an intermetallic compound
First Claim
Patent Images
1. A ball grid array device comprising:
- a substrate, further including;
a first major surface; and
a second major surface; and
an array of pads positioned on one of the first major surface or the second major surface, at least some of the pads including a barrier layer.
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Accused Products
Abstract
A ball grid array device includes a substrate, further including a first major surface and a second major surface. An array of pads is positioned on one of the first major surface or the second major surface. At least some of the pads include a barrier layer having pores or openings therein. When solder is placed on the pad, the barrier layer forms an intermetallic compound at a rate different from the rate of the intermetallic compound formed between the pad and the solder. The result is a solder ball on a pad that has a first intermetallic compound and a second intermetallic compound.
17 Citations
37 Claims
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1. A ball grid array device comprising:
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a substrate, further including;
a first major surface; and
a second major surface; and
an array of pads positioned on one of the first major surface or the second major surface, at least some of the pads including a barrier layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
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14-26. -26. (Canceled)
Specification