Light-emitting semiconductor device packaged with light-emitting diode and current-driving integrated circuit

• US 20050012457A1
• Filed: 09/02/2003
• Published: 01/20/2005
• Est. Priority Date: 07/15/2003
• Status: Abandoned Application

• Current Assignee: Macroblock, Inc.
• Original Assignee: Macroblock Incorporated MACR
• Inventors: Wu, Chung Yu
• Application Number:
  US10/651,987
• Publication Number:
  US 20050012457A1
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H05B 45/20 Controlling the colour of the light
• CPC Class Codes: H05B 45/40 Details of LED load circuits
• CPC Class Codes: H05B 45/46 having LEDs disposed in parallel lines

Abstract

The present invention discloses a device for generating combining light of desired colors. This device includes at least three light emitting diodes and a current-driving integrated circuit chip encapsuled integrally. The driver chip provides constant current outputs to light emitting diodes of different colors, which are preset based on respective characteristics thereof. As a result, the current input and brightness of each light emitting diode is adjustable and thus combining light of expected color is generated, such as white light of color temperature 6,500˜8,000° K.

Claims

1. A light-emitting semiconductor device, comprising:

at least two terminals;

a plurality of LED dice of at least red, green and blue colors, and each of said LED dice comprising two electrode contacts;

a driver IC chip comprising a contact and at least three output ports;

an insulating substrate attached beneath said LED dice and said driver IC chip; and

a refractive encapsulation material for integrally encapsulating said LED dice and said driver IC chip, and refracting light emitted from said LED dice toward a predetermined direction;

wherein;

one of said electrode contacts of each LED die is connected to a common node by an electrically conducting means, and said common node is further connected to one of said terminals of said light-emitting semiconductor device;

said contact of said driver IC chip is connected to another terminal of said light-emitting semiconductor device;

said LED dice are lit by applying voltage or current to said terminals of said light-emitting semiconductor device; and

said light-emitting semiconductor device is attached on an application circuit board by adhering said terminals thereon with surface mount technology.

2. A light-emitting semiconductor device, comprising:

at least two terminals;

a plurality of LED dice of at least red, green and blue colors, and each of said LED dice comprising two electrode contacts;

a driver IC chip comprising a contact and at least three output ports;

an insulating substrate attached beneath said LED dice and said driver IC chip; and

a refractive encapsulation material for integrally encapsulating said LED dice and said driver IC chip, and refracting light emitted from said LED dice toward a predetermined direction;

wherein;

one of said electrode contacts of each LED die is connected to a respective output port of said driver IC chip by an electrically conducting means;

another electrode contact of each LED die is connected to a common node by an electrically conducting means, and said common node is further connected to one of said terminals of said light-emitting semiconductor device;

said contact of said driver IC chip is connected to another terminal of said light-emitting semiconductor device; and

said LED dice are lit by applying voltage or current to said terminals of said light-emitting semiconductor device.

3. A light-emitting semiconductor device, comprising:

at least two terminals;

a plurality of LED dice of at least red, green and blue colors, and each of said LED dice comprising two electrode contacts;

a driver IC chip comprising a contact and at least three output ports;

an insulating substrate attached beneath said LED dice and said driver IC chip; and

a refractive encapsulation material for integrally encapsulating said LED dice and said driver IC chip, and refracting light emitted from said LED dice toward a predetermined direction;

wherein;

one of said electrode contacts of each LED die is connected to a respective output port of said driver IC chip by an electrically conducting means;

another electrode contact of each LED die is connected to a common node by an electrically conducting means, and said common node is further connected to one of said terminals of said light-emitting semiconductor device;

said contact of said driver IC chip is connected to another terminal of said light-emitting semiconductor device;

said LED dice are lit by applying voltage or current to said terminals of said light-emitting semiconductor device; and

brightness of each LED die is adjusted by setting output of the respective output port of said driver IC chip, whereby a combining light of desired color is generated.

6. The light-emitting semiconductor device as claimed in claim 3, wherein said combining light is white light of color temperature 6,500˜

8,000°

K.

7. The light-emitting semiconductor device as claimed in claim 6, wherein said outputs of the output ports of said driver IC chip are preset at a ratio of red:

green;

blue=(0.8˜

1.2);

(0.8˜

1.2);

(0.8˜

1.2).

4. A light-emitting semiconductor device, comprising:

at least two terminals;

a plurality of LED dice of at least red, green and blue colors, and each of said LED dice comprising two electrode contacts;

a driver IC chip comprising a contact and at least three output ports, and providing a constant current unaffected by deviation of forward voltages of said LED dice;

an insulating substrate attached beneath said LED dice and said driver IC chip; and

a refractive encapsulation material for integrally encapsulating said LED dice and said driver IC chip, and refracting light emitted from said LED dice toward a predetermined direction;

wherein;

one of said electrode contacts of each LED die is connected to a respective output port of said driver IC chip by an electrically conducting means;

another electrode contact of each LED die is connected to a common node by an electrically conducting means, and said common node is further connected to one of said terminals of said light-emitting semiconductor device;

said contact of said driver IC chip is connected to another terminal of said light-emitting semiconductor device; and

said LED dice are lit by applying voltage or current to said terminals of said light-emitting semiconductor device.

5. A light-emitting semiconductor device, comprising:

at least three terminals;

a plurality of LED dice in of at least red, green and blue colors, and each of said LED dice comprising two electrode contacts;

a driver IC chip comprising at least two contacts and at least three output ports;

an insulating substrate attached beneath said LED dice and said driver IC chip; and

a refractive encapsulation material for integrally encapsulating said LED dice and said driver IC chip, and refracting light emitted from said LED dice toward a predetermined direction;

wherein;

one of said electrode contacts of each LED die is connected to a respective output port of said driver IC chip by an electrically conducting means;

another electrode contact of each LED die is connected to a common node by an electrically conducting means, and said common node is further connected to one of said terminals of said light-emitting semiconductor device;

two contacts of said driver IC chip are respectively connected to another two terminals of said light-emitting semiconductor device, and one of said terminals provides a voltage or current for controlling outputs of said driver IC chip; and

said LED dice are lit by applying voltage or current to said terminals of said light-emitting semiconductor device.

8. The light-emitting semiconductor device as claimed in claim 5, wherein said outputs of said driver IC chip controlled by one of said terminals vary brightness of said LED dice and thus generate a combining light of desired color.

9. The light-emitting semiconductor device as claimed in claim 8, wherein said combining light is white light of color temperature 6,500˜

8,000°

K.