Edge normal process
First Claim
Patent Images
1. An edge inspection method for detecting defects on a wafer edge normal surface, the method comprising:
- acquiring a set of digital images capturing a circumference of the wafer;
determining an edge of the wafer about the circumference of the wafer;
segmenting each digital image into a plurality of horizontal bands;
combine adjacent edge clusters about the circumference of the wafer into edge pixel bins;
analyze the edge pixel bins via edge cluster analysis to identify defects; and
analyze the edge pixel bins via blob analysis to identify defects.
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Abstract
An edge inspection method for detecting defects on a wafer edge normal surface includes acquiring a set of digital images which captures a circumference of the wafer. An edge of the wafer about the circumference is determined. Each digital image is segmented into a plurality of horizontal bands. Adjacent edge clusters about the circumference of the wafer are combined into edge pixel bins. The edge pixel bins are analyzed via edge clusters analysis to identify defects. The edge pixel bins are also analyzed via blob analysis to determine defects.
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Citations
34 Claims
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1. An edge inspection method for detecting defects on a wafer edge normal surface, the method comprising:
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acquiring a set of digital images capturing a circumference of the wafer;
determining an edge of the wafer about the circumference of the wafer;
segmenting each digital image into a plurality of horizontal bands;
combine adjacent edge clusters about the circumference of the wafer into edge pixel bins;
analyze the edge pixel bins via edge cluster analysis to identify defects; and
analyze the edge pixel bins via blob analysis to identify defects. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An edge inspection method for detecting defects on a wafer edge normal surface, the method comprising:
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acquiring a set of digital images capturing a circumference of the wafer;
determining an edge of the wafer about the circumference of the wafer;
segmenting each digital image into a plurality of horizontal bands;
combine adjacent edge clusters about the circumference of the wafer into edge pixel bins; and
analyze the edge pixel bins via edge cluster analysis to identify defects. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. An edge inspection method for detecting defects on a wafer edge normal surface, the method comprising:
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acquiring a set of digital images capturing a circumference of the wafer;
determining an edge of the wafer about the circumference of the wafer;
segmenting each digital image into a plurality of horizontal bands;
combine adjacent edge clusters about the circumference of the wafer into edge pixel bins; and
analyze the edge pixel bins via blob analysis to identify defects. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification