Formation of metallic thermal barrier alloys

• US 20050013723A1
• Filed: 02/11/2004
• Published: 01/20/2005
• Est. Priority Date: 02/11/2003
• Status: Abandoned Application

• Current Assignee: Daniel James Branagan
• Original Assignee: Daniel James Branagan
• Inventors: Branagan, Daniel James
• Application Number:
  US10/776,473
• Publication Number:
  US 20050013723A1
• Time in Patent Office: Days
• US Class Current: 420/121
• CPC Class Codes: B22F 2009/088 Fluid nozzles, e.g. angle, distance
• CPC Class Codes: B22F 9/082 atomising using a fluid using centrifugal force B22F9/10
• CPC Class Codes: C22C 33/0278 with at least one alloying element having a minimum content above 5%
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

Metal alloys having low electrical and thermal conductivity including relatively large fractions of P-Group element additions. The P-Group elements may be selected from the group including phosphorous, carbon, boron, and silicon. The resultant alloys do not exhibit significantly increased brittleness, and are applied as a coating that provides a metallic thermal barrier coating.

Claims

1. A metal alloy comprising an alloy metal and greater than about 4 atomic % of at least one P-group alloying element.

2. A metal alloy of claim 1 wherein the P-group alloying element is present at a level of 4 atomic % to 50 atomic %.

3. The metal alloy of claim 1 wherein said P-group alloying element is selected from the group consisting of carbon, nitrogen, phosphorous, silicon, boron, and mixtures thereof.

4. A metal alloy according to claim 1, wherein said at least one P-group alloying element comprises 16.0 atomic % B, 4.0 atomic % C, and 5.0 atomic % Si.

5. A metal alloy according to claim 1 wherein the alloy metal is selected from the group consisting of iron, chrome, molybdenum, tungsten, manganese, cobalt, nickel, copper, and mixtures thereof.

6. A method for reducing the thermal and/or electrical conductivity of a metal alloy composition comprising:

(a) supplying a metal alloy composition; and

(b) supplying a P-group alloying element;

(c) mixing said metal alloy composition and said P-group alloying element wherein said P-group alloying element is present at a level to reduce the thermal/and or electrical conductivity of said metal alloy composition.

7. A method of reducing the thermal and/or electrical conductivity of a metal alloy composition comprising:

(a) supplying a base metal with a free electron density

(b) supplying a P-group alloying element

(c) combining said P-group alloying element with said base metal and decreasing the free electron density of the base metal.

8. The method of claim 7 wherein the free electron density of the base metal is reduced from its base metal value, and wherein said free electron density is generally representative of a fully filled outer shell after combination with said P-group alloying element.

9. The method of claim 7 wherein said P-group alloying element is selected from the group consisting of carbon, nitrogen, phosphorous, silicon, boron, and mixtures thereof.

10. The method of claim 7 wherein the base metal is selected from the group consisting of iron, nickel, cobalt, aluminum, copper, zinc. titanium, zirconium, niobium, molybdenum, tantalum, vanadium, hafnium, tungsten, manganese, and combinations thereof.