Direct write process and apparatus
First Claim
1. A direct write process for fabricating a desired circuit component onto a substrate surface of a microelectronic device according to a computer-aided design (CAD), said process comprising:
- (a) providing a support member by which said device substrate is supported while said component is being fabricated;
(b) providing a chamber for containing a precursor fluid material under a substantially constant pressure differential relative to the ambient pressure, said precursor fluid material having a viscosity no less than 10 cps;
(c) operating an inkjet-based single-orifice or multiple-orifice dispensing head for dispensing and depositing minute droplets of said precursor fluid material through at least one discharge orifice onto said substrate surface, said dispensing head having valve means in control relation to said dispensing head for switching said head on and off on demand;
(d) operating a material treatment means to convert said deposited precursor material to said desired component; and
(e) operating machine control means for generating control signals in response to coordinates of said CAD and for controlling the position of said dispensing head relative to said support member or said substrate in response to said control signals to control dispensing and depositing of said precursor material to form said component of a desired shape and dimension on said substrate surface.
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Accused Products
Abstract
A direct write process and apparatus for fabricating a desired circuit component onto a substrate surface of a microelectronic device according to a computer-aided design (CAD). The process includes (a) providing a support member by which the device is supported while being fabricated; (b) providing a chamber for containing a precursor fluid material under a substantially constant pressure differential relative to the ambient pressure, with the precursor fluid material having a viscosity no less than 10 cps; (c) operating an inkjet-based dispensing head with a control valve or actuator for dispensing and depositing minute droplets of the precursor fluid material onto the substrate surface; (d) energy- or heat-treat the deposited precursor fluid material for converting it to the desired active or passive component; and (e) operating a machine controller for generating control signals in response to the CAD coordinates for controlling the position of the dispensing head relative to the support member in response to the control signals to control dispensing and depositing of the precursor material to form the desired component. The process is useful for depositing a wide range of component materials onto an electronic device, including conductor, resistor, capacitor, dielectric, inductor, antenna, solar cell electrode, battery electrode, interconnect, superconductor, sensor, and actuator element materials.
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Citations
47 Claims
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1. A direct write process for fabricating a desired circuit component onto a substrate surface of a microelectronic device according to a computer-aided design (CAD), said process comprising:
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(a) providing a support member by which said device substrate is supported while said component is being fabricated;
(b) providing a chamber for containing a precursor fluid material under a substantially constant pressure differential relative to the ambient pressure, said precursor fluid material having a viscosity no less than 10 cps;
(c) operating an inkjet-based single-orifice or multiple-orifice dispensing head for dispensing and depositing minute droplets of said precursor fluid material through at least one discharge orifice onto said substrate surface, said dispensing head having valve means in control relation to said dispensing head for switching said head on and off on demand;
(d) operating a material treatment means to convert said deposited precursor material to said desired component; and
(e) operating machine control means for generating control signals in response to coordinates of said CAD and for controlling the position of said dispensing head relative to said support member or said substrate in response to said control signals to control dispensing and depositing of said precursor material to form said component of a desired shape and dimension on said substrate surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 28, 29, 30, 31)
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19. A direct write process for fabricating at least one desired circuit component onto a substrate surface of a microelectronic device according to a computer-aided design (CAD), said process comprising:
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(a) providing a supply of a first precursor fluid material, with a viscosity no less than 10 cps, under a substantially constant but variable pressure differential relative to ambient pressure;
(b) dispensing said first precursor fluid material from at least an inkjet-based dispensing head onto said substrate surface of said device supported by a support member;
(c) during said dispensing step, moving said dispensing head and said support member or said substrate relative to one another in a plane defined by first and second directions to form said first precursor material into a desired pattern according to said design; and
(d) concurrent with or subsequent to said dispensing and moving steps, operate a material treatment means to convert said first deposited pattern of precursor material into at least a portion of said at least one desired circuit component. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27)
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32. A direct write apparatus for fabricating a desired circuit component onto a substrate surface of a microelectronic device according to a computer-aided design (CAD), said apparatus comprising:
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(a) a support member for supporting thereon said device substrate;
(b) a fluid material delivery assembly comprising a chamber at a distance from said support member for containing a precursor fluid material under a substantially constant but adjustable pressure differential relative to the ambient pressure;
(c) an inkjet-based dispensing head in flow communication with said chamber, said head comprising on one end at least a discharge orifice of a predetermined size and a valve means in control relation to said at least a discharge orifice for dispensing droplets of said precursor fluid material through said orifice onto said substrate surface; and
(d) machine control means in electronic communication with a computer and in control relation to both said support member and said dispensing head for generating control signals in response to coordinates of said design of the device and for controlling the position of said dispensing head relative to said support member in response to said control signals to control dispensing of said precursor material for fabricating said component. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
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43. An inkjet printhead-based fluid dispensing apparatus, comprising:
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(A) a fluid material reservoir;
(B) an inkjet printhead body comprising therein a chamber having a first end in flow communication with said reservoir and receiving a fluid material therefrom and on a second end a discharge orifice for discharging a fluid material therethrough;
(C) a valve means in control relation to said discharge orifice; and
(D) a back-flow channel having one end in flow communication with said chamber and another end in flow communication with said reservoir. - View Dependent Claims (44, 45, 46, 47)
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Specification