Method, system, and apparatus for transfer of dies using a pin plate

• US 20050015970A1
• Filed: 06/14/2004
• Published: 01/27/2005
• Est. Priority Date: 06/12/2003
• Status: Abandoned Application

• Current Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Original Assignee: Matrics Incorporated (Zebra Technologies Corporation)
• Inventors: Bandy, William R., Arneson, Michael R.
• Application Number:
  US10/866,159
• Publication Number:
  US 20050015970A1
• Time in Patent Office: Days
• US Class Current: 29/601
• CPC Class Codes: G06K 19/041 Constructional details G06K19/06 takes precedence
• CPC Class Codes: G06K 19/045 the record carrier being of the non-contact type, e.g. RFID, and being specially adapted for attachment to a disc, e.g. a CD or DVD
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 7/0095 Testing the sensing arrangement, e.g. testing if a magnetic card reader, bar code reader, RFID interrogator or smart card reader functions properly testing of electrical circuits G01R31/28
• CPC Class Codes: G11B 23/0021 discs
• CPC Class Codes: G11B 23/0042 with provision for auxiliary features sensing such features G11B17/00, G11B19/02
• CPC Class Codes: G11B 7/26 Apparatus or processes specially adapted for the manufacture of record carriers
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10S 438/976 : Temporary protective layer
• CPC Class Codes: Y10T 156/1075 : of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/1142 : Changing dimension during delaminating [e.g., crushing, expanding, warping, etc.]
• CPC Class Codes: Y10T 156/1179 : with poking during delaminating [e.g., jabbing, etc.]
• CPC Class Codes: Y10T 156/1906 : Delaminating means responsive to feed or shape at delamination
• CPC Class Codes: Y10T 156/1978 : Delaminating bending means
• CPC Class Codes: Y10T 156/1983 : Poking delaminating means
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49798 : Dividing sequentially from leading end, e.g., by cutting or breaking
• CPC Class Codes: Y10T 29/49833 : Punching, piercing or reaming part by surface of second part
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/53187 : Multiple station assembly apparatus
• CPC Class Codes: Y10T 29/5327 : Means to fasten by deforming
• CPC Class Codes: Y10T 29/53422 : by deforming

Abstract

A method and system for device assembly and a method, system, and apparatus for transfer of dies using a pin plate are described herein. A die plate is received having dies. The body of the die plate has a plurality of holes extending therethrough. Each die covers a corresponding hole on a first surface of the die plate. The die plate is positioned to be closely adjacent to the web of substrates. The punching device has a plurality of punching members extending from an outer surface. The punching device is planar or alternatively cylindrical. The punching device is applied to a second surface of the die plate to cause a set of the punching members to extend through a set of holes in the die plate, causing dies to be transferred from the die plate to one or more destination substrates or other surfaces.

Claims

1. A system for assembling a plurality of devices in parallel, the system comprising:

a pin plate having a plurality of punching members; and

a pin plate controller coupled to the pin plate,

wherein the system receives a die plate including a plurality of holes therethrough, wherein the die plate further includes a plurality of dies attached thereto, and wherein each die covers a corresponding hole through the die plate.

2. The system of claim 1, further comprising:

a die plate controller coupled to the die plate, wherein the die plate controller moves the die plate.

3. The system of claim 1, wherein the system receives a plurality of substrates, each substrate having an adhesive material coupled to the substrate at a die contact area.

4. The system of claim 1, wherein the plurality of punching members are arranged in a geometric pattern.

5. The system of claim 4, wherein the plurality of holes are arranged in a geometric pattern corresponding to the geometric pattern of the plurality of punching members.

6. The system of claim 5, wherein the geometric pattern of the plurality of punching members includes a plurality of rows and a plurality of columns.

7. The system of claim 1, further comprising:

an adhesive application module, the adhesive application module including;

an adhesive pin plate having a plurality of adhesive transfer members,

an adhesive pin plate controller coupled to the adhesive pin plate, and

an adhesive reservoir,

wherein the system receives a plurality of substrates.

8. The system of claim 1, further comprising a curing module that cures an adhesive material on each substrate to bond a die to the substrate.

9. The system of claim 1, wherein the devices are RFID tags.

10. A system for assembling a plurality of devices in parallel, the system comprising:

a pin cylinder having an outer surface, wherein the pin cylinder has a plurality of punching members extending radially from the outer surface; and

a pin cylinder controller coupled to the pin cylinder,

wherein the system receives a die plate including a plurality of holes therethrough, wherein the die plate further includes a plurality of dies attached thereto, and wherein each die covers a corresponding hole through the die plate.

11. A method for assembling devices a plurality of devices in parallel, comprising:

(a) receiving a die plate, wherein the die plate includes a plurality of dies attached to a first surface and a plurality of holes extending from the first surface to a second surface, each die covering a corresponding hole through the die plate;

(b) receiving a web of substrates having a plurality of substrates; and

(c) transferring a first plurality of dies from the die plate to a first plurality of substrates of the web of substrates, one die per substrate.

12. The method of claim 11, wherein the step (c) comprises:

(1) positioning the first plurality of substrates relative to the first surface of the die plate such that each die in the first plurality of dies is positioned adjacent to a corresponding die contact area of a substrate of the first plurality of substrates; and

(2) punching through a plurality of holes to transfer the first plurality of dies to corresponding die contact areas of the first plurality of substrates.

13. The method of claim 11, further comprising:

(d) determining whether additional dies remain to be transferred;

(e) if it is determined that additional dies remain to be transferred,

(1) moving the die plate to a subsequent position,

(2) incrementing the position of the web of substrates such that a second plurality of dies is positioned adjacent to a corresponding contact area of a second plurality of substrates of the web of substrates,

(3) transferring the second plurality of dies from the die plate to the second plurality of substrates, and

(4) repeating steps (d), (e) and (f) until the die plate is substantially depleted of dies; and

(f) if it is determined that no additional dies remain to be transferred, removing the die plate.

14. The method of claim 11, further comprising:

(d) determining whether additional dies remain to be transferred;

(e) if it is determined that additional dies remain to be transferred,

(1) moving the die plate to a subsequent position,

(2) incrementing the position of the web of substrates such that a second plurality of dies is positioned adjacent to a corresponding contact area of a second plurality of substrates of the web of substrates,

(3) transferring the second plurality of dies from the die plate to the second plurality of substrates, and

(4) repeating steps (d), (e) and (f) until the die plate is depleted of dies; and

(f) if it is determined that no additional dies remain to be transferred, removing the die plate.

15. The method of claim 11, wherein step (c) comprises:

(d) applying to the die plate, a first surface of a plate structure having a plurality of punching members extending therefrom, wherein each punching member extends through a corresponding hole of the die plate to transfer a first plurality of dies to the corresponding plurality of substrates.

16. The method of claim 15, further comprising:

(d) moving the plate structure and the die plate apart; and

(e) applying to the die plate, the first surface of a plate structure having a plurality of punching members extending therefrom, wherein each punching member extends through a corresponding hole of the die plate to transfer a second plurality of dies to the corresponding plurality of substrates

17. The method of claim 12, wherein step (c)(2) comprises:

(A) rolling a cylinder across the die plate to transfer a first plurality of dies from the die plate to a first plurality of substrates of the web of substrates, wherein the cylinder has a plurality of punching members extending radially therefrom and each of the plurality of punching members temporarily extends through one or more holes of the die plate as the cylinder is rolled across the die plate.

18. The method of claim 12, wherein step (c)(2) comprises:

(A) rolling a cylinder across the die plate in a first direction to transfer a first plurality of dies from the die plate to a first plurality of substrates of the web of substrates, wherein the cylinder has a plurality of punching members extending radially therefrom and each of the plurality of punching members temporarily extends through one or more holes of the die plate as the cylinder is rolled across the die plate; and

(B) rolling the cylinder across the die plate in a second direction to transfer a second plurality of dies from the die plate to a second plurality of substrates of the web of substrates.

19. The method of claim 11, further comprising:

(d) applying an adhesive material to a first plurality of substrates of the web of substrates.

20. The method of claim 19, wherein the step (d) comprises:

(1) receiving a plurality of substrates;

(2) applying an adhesive material to a plurality of adhesive transfer members;

(3) positioning the plurality of adhesive transfer members relative to a plurality of substrates such that each adhesive transfer member is positioned adjacent to a corresponding die contact area of a substrate of the plurality of substrates;

(4) transferring the adhesive material from the plurality of adhesive transfer members to the corresponding die contact areas of a plurality of substrates.

21. The method of claim 19, further comprising:

(e) curing the adhesive material to bond each transferred die to a substrate.

22. A method for transferring integrated circuit dies from a die receptacle structure to substrates of a web of substrates, comprising:

(a) receiving a die plate having a first and a second surface, wherein the die plate includes a plurality of dies attached to a first surface and a plurality of holes extending from the first surface to the second surface, each die covering a corresponding hole through the die plate;

(b) receiving a plurality of substrates;

(c) positioning the plurality of substrates relative to the first surface of the die plate such that each die is positioned adjacent to a corresponding die contact area of a substrate of the plurality of substrates; and

(d) punching through a plurality of holes to transfer a plurality of dies to corresponding die contact areas of a plurality of substrates.

23. The method of claim 22, further comprising:

(d) determining whether additional dies remain to be transferred;

(e) if it is determined that additional dies remain to be transferred,

(1) moving the die plate to a subsequent position,

(2) incrementing the position of the web of substrates such that a second plurality of dies is positioned adjacent to a corresponding contact area of a second plurality of substrates of the web of substrates,

(3) transferring the second plurality of dies from the die plate to the second plurality of substrates, and

(4) repeating steps (d), (e) and (f) until the die plate is depleted of dies; and

(f) if it is determined that no additional dies remain to be transferred, removing the die plate.

24. The method of claim 22, wherein each substrate of a plurality of substrates includes an adhesive material coupled to a die contact area of the substrate.

25. The method of claim 24, further comprising the step of:

curing the adhesive material to bond each transferred die to a substrate

26. A method for transferring integrated circuit dies from a die receptacle structure to substrates of a web of substrates, comprising:

(a) receiving a die receptacle structure, wherein a first surface of the die receptacle structure has an array of cells formed therein, wherein the die receptacle structure further includes a plurality of holes formed therethrough, each hole of the plurality of holes corresponding to a cell of the array of cells, each hole being open in the corresponding cell and at a second surface of the die receptacle structure opposite to the first surface, wherein a die resides in at least some of the cells of the array of cells;

(b) positioning the web of substrates relative to the first surface of the die receptacle structure such that each cell of a plurality of cells of the array of cells is positioned adjacent to a corresponding die contact area of a substrate of a plurality of substrates of the web of substrates; and

(c) punching through each hole of the plurality of cells to transfer the die from each cell of the plurality of cells to the corresponding die contact area of a substrate of the plurality of substrates.

27. The method of claim 26, further comprising:

(d) incrementing the position of the web of substrates relative to the first surface of the die receptacle structure such that each cell of a second plurality of cells of the array of cells is positioned adjacent to a corresponding die contact area of a substrate of a second plurality of substrates of the web of substrates.

28. The method of claim 27, further comprising:

(e) punching through each hole of the second plurality of cells to transfer the die from each cell of the second plurality of cells to the corresponding die contact area of a substrate of the second plurality of substrates.

29. The method of claim 26, further comprising:

(d) repeating steps (b) and (c) for subsequent pluralities of cells and corresponding subsequent pluralities of substrates until the array of cells is substantially depleted of dies.

30. The method of claim 26, further comprising:

(d) repeating steps (b) and (c) for subsequent pluralities of cells and corresponding subsequent pluralities of substrates until the array of cells is depleted of dies.

31. The method of claim 26, wherein step (c) comprises:

rolling a cylinder that has punching members extending radially therefrom across the die receptacle structure so that the punching members temporarily extend through holes of the plurality of cells to transfer dies from the cells to the corresponding die contact area of substrates of the plurality of substrates.

32. The method of claim 26, wherein the plurality of substrates are aligned in the web in a single file column of substrates, wherein step (c) comprises:

rolling a cylinder across the die receptacle structure having a column of punching members extending radially therefrom to sequentially extend through each hole of the plurality of cells to transfer the die from each cell of the plurality of cells to the corresponding die contact area of a substrate of the column of substrates.

33. The method of claim 26, wherein the plurality of substrates are aligned in the web in a plurality of parallel columns of substrates, wherein step (c) comprises:

(1) rolling a cylinder having a column of punching members extending radially therefrom across the die receptacle structure in a first direction along a first column of cells of the plurality of cells to sequentially extend through each hole of the plurality of cells in the first column to transfer the die from each cell of the plurality of cells in the first column to the corresponding die contact area of a substrate of a first column of substrates in the plurality of parallel columns of substrates;

(2) rolling the cylinder in a second direction opposite to the first direction across the die receptacle structure along a second column of cells of the plurality of cells to sequentially extend through each hole of the plurality of cells in the second column to transfer the die from each cell of the plurality of cells in the second column to the corresponding die contact area of a substrate of a second column of substrates in the plurality of parallel columns of substrates.

34. The method of claim 33, wherein step (c) further comprises:

(3) repeating steps (1) and (2) to transfer dies from cells of the plurality of cells in at least one subsequent column to the corresponding die contact areas of substrates in corresponding subsequent columns of substrates in the plurality of parallel columns of substrates.

35. The method of claim 26, wherein the plurality of substrates are aligned in the web in a plurality of parallel columns of substrates, wherein step (c) comprises:

(1) rolling a cylinder having a plurality of columns of punching members extending radially therefrom across the die receptacle structure in a first direction along a plurality of columns of cells of the plurality of cells,

wherein for each column of punching members, punching members sequentially extend through each hole of cells in a corresponding column of the plurality of columns of cells to transfer the die from each cell of the corresponding column to the corresponding die contact area of a substrate of a corresponding column of substrates in the plurality of parallel columns of substrates.

36. The method of claim 35, wherein step (c) further comprises:

(2) rolling the cylinder in a second direction opposite to the first direction across the die receptacle structure along a second plurality of columns of cells of the plurality of cells, wherein for each column of punching members, punching members sequentially extend through each hole of cells in a corresponding column of the second plurality of columns of cells to transfer the die from each cell of the corresponding column of the second plurality of columns to the corresponding die contact area of a substrate of a corresponding column of substrates in the plurality of parallel columns of substrates

37. The method of claim 36, wherein step (c) further comprises:

(3) repeating steps (1) and (2) to transfer dies from cells of the plurality of cells in at least one subsequent plurality of columns to the corresponding die contact areas of substrates in corresponding subsequent pluralities of columns of substrates in the plurality of parallel columns of substrates.

38. The method of claim 36, wherein step (c) comprises:

applying to the die receptacle structure a first surface of a plate structure having a plurality of punching members extending therefrom, wherein each punching member extends through a corresponding hole of the plurality of cells to transfer dies from the cells to the corresponding die contact area of substrates of the plurality of substrates.

39. The method of claim 38, further comprising:

(d) moving apart the plate structure and die receptacle structure; and

(e) applying to the die receptacle structure the first surface of the plate structure, wherein each punching member extends through a corresponding hole of a second plurality of cells to transfer dies from the cells of the second plurality of cells to corresponding die contact areas of substrates of a second plurality of substrates of the web of substrates.

40. The method of claim 26, wherein the plurality of cells comprises all cells of the array of cells, wherein step (c) comprises:

punching through each hole of the array of cells to transfer the die from each cell of the array of cells to the corresponding die contact area of a substrate of the plurality of substrates,

whereby the array of cells is emptied of dies.

41. The method of claim 26, wherein the plurality of cells comprises a portion of the total number of cells of the array of cells, wherein step (c) comprises:

punching through each hole of the plurality of cells to transfer the die from each cell of the plurality of cells to the corresponding die contact area of a substrate of the plurality of substrates

whereby the array of cells is not emptied of dies.

42. An apparatus for transferring dies from a die plate comprising:

a planar body having a first surface; and

a plurality of punching members extending from the first surface.

43. The apparatus of claim 42, wherein the plurality of punching members is arranged in a geometric pattern.

44. The apparatus of claim 43, wherein the geometric pattern includes a plurality of rows and a plurality of columns.

45. The apparatus of claim 43, wherein the geometric pattern is a rectangle.

46. The apparatus of claim 43, wherein the geometric pattern is a hexagon.

47. The apparatus of claim 43, wherein the geometric pattern is a cross.

48. An apparatus for transferring dies from a die plate comprising:

a first planar body having a first surface and a second surface, wherein the first planar body includes;

a plurality of cavities, wherein each cavity is open at the second surface of the first planar body and extends partially through the first planar body and wherein each cavity includes a hole extending from a bottom surface of the cavity to the first surface of the first planar body;

a plurality of punching members, each punching member having an anchor portion and a punching portion, wherein each punching member is placed in one of the plurality of cavities such that the punching portion extends through the hole and the anchor portion is substantially contained in the cavity;

a second planar body having a first surface coupled to the second surface of the first planar body.

49. The apparatus of claim 48, further comprising:

a plurality of springs, wherein each spring is placed in a cavity containing a punching member between the anchor portion of the punching member and the first surface of the second planar body.

50. The apparatus of claim 48, wherein the plurality of punching members is arranged in a geometric pattern.

51. The apparatus of claim 50, wherein the geometric pattern includes a plurality of rows and a plurality of columns.

52. The apparatus of claim 50, wherein the geometric pattern is a rectangle.

53. The apparatus of claim 50, wherein the geometric pattern is a hexagon.

54. The apparatus of claim 50, wherein the geometric pattern is a cross.

55. A method for designing a system for assembling a plurality of radio frequency identification (RFID) tags for use in a tag population, comprising:

(a) determining a required minimum read distance for tags of the tag population;

(b) selecting a tag antenna layout and corresponding tag substrate size based upon the determined required read distance;

(c) determining a number of tags to be produced for the tag population;

(d) configuring a tag substrate web, comprising a plurality of tag substrates, based upon the selected tag substrate size and the determined number of tags to be produced;

(e) determining a number of die transfer heads that are each capable of transferring a plurality of dies to corresponding substrates of the tag substrate web;

(f) designating a location for each of the determined number of die transfer heads relative to the tag substrate web; and

(g) determining a rate of tag production.

56. The method of claim 55, wherein step (d) comprises:

(1) configuring a continuous substrate web.

57. The method of claim 55, wherein step (d) comprises:

(1) configuring the substrate web as a plurality of separate substrate web sheets.

58. The method of claim 55, wherein step (d) comprises:

(1) determining a width for the substrate web.

59. The method of claim 58, wherein step (1) comprises:

(A) determining the width for the substrate web in terms of a number of substrates.

60. The method of claim 55, wherein step (g) comprises:

(1) selecting a rate of tag production based upon the determined required number of tags and a designated completion date.

61. The method of claim 55, wherein step (e) comprises:

(1) selecting a geometrical substrate pattern capable of self-interlocking for transfer of dies from each die transfer head.

62. The method of claim 61, wherein step (1) comprises:

(A) selecting the interlocking geometrical substrate pattern to be a square, a rectangle, a hexagon, or a cross.

63. The method of claim 61, wherein step (f) comprises:

(1) arranging the die transfer heads in an interlocked coverage pattern.

64. The method of claim 63, wherein step (1) comprises:

selecting the self-interlocking geometrical substrate pattern to minimize a number of dies that cannot be transferred from each die transfer head due to the selected self-interlocking geometrical substrate pattern, while covering each substrate of the tag substrate web with a die transfer head of the coverage pattern in a non-overlapping manner.

65. The method of claim 63, wherein step (f) comprises:

(1) arranging the die transfer heads in a coverage pattern such that when the tag substrate web is movable along a first direction, all substrates of the tag substrate web can be covered by at least one die transfer head of the coverage pattern.

66. The method of claim 63, wherein step (f) comprises:

(1) arranging the die transfer heads in a coverage pattern such that when the tag substrate web is movable along a first direction, all substrates of the tag substrate web can be covered by a single die transfer head of the coverage pattern.

67. A system for assembling a plurality of devices in parallel, the system comprising:

a plurality of pin plates, each pin plate having a plurality of punching members; and

a pin plate controller coupled to the plurality of pin plates,

wherein the system receives a plurality of die plates, each die plate including a plurality of holes therethrough, wherein the die plate further includes a plurality of dies attached thereto, and wherein each die covers a corresponding hole through the die plate.

68. A method for assembling devices a plurality of devices in parallel, comprising:

(a) receiving a plurality of die plates, wherein each die plate has a first surface and wherein each die plate includes a plurality of dies attached to a first surface and a plurality of holes extending from the first surface to a second surface, each die covering a corresponding hole through the die plate;

(b) receiving a web of substrates having a plurality of substrates; and

(c) transferring a plurality of dies from each die plate in parallel to a plurality of substrates, one die per substrate.

69. The method of claim 68, wherein step (c) comprises:

(1) positioning the plurality of substrates relative to the first surface of each die plate such that each die in the first plurality of dies is positioned adjacent to a corresponding die contact area of a substrate of the first plurality of substrates; and

(2) punching through a plurality of holes in each die plate in parallel to transfer the first plurality of dies to corresponding die contact areas of the first plurality of substrates.