Surface treatment system and method

• US 20050016455A1
• Filed: 12/30/2002
• Published: 01/27/2005
• Est. Priority Date: 03/29/2002
• Status: Active Grant

• Current Assignee: LG Electronics, Inc. (LG Corporation)
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: Cho, Cheon-Soo, Youn, Dong-Sik, Ha, Samchul, Lee, Hyun-Wook
• Granted Patent: US 7,677,199 B2
• Time in Patent Office: Days
• US Class Current: 118/723.E
• CPC Class Codes: C23C 16/4411 Cooling of the reaction chamber walls C23C16/45572 takes precedence
• CPC Class Codes: C23C 16/50 using electric discharges generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34

Abstract

A surface treatment system is disclosed to form a deposition layer at a surface of an object of surface treatment by using a deposition reaction in which an electrode (110) for applying power to form a deposition reaction in the deposition chamber (100) is installed between an inner wall (120) of the deposition chamber (100) and an object of surface treatment (900) and further includes a cooling unit (200) installed at the inner wall (120) of the deposition chamber (100) facing the electrode (110) and cooling ambient thereof.

Claims

1. A surface treatment system for forming a deposition layer at a surface of an object of surface treatment by using a deposition reaction in which electrode unit for applying power to form a deposition reaction in the deposition chamber is installed between an inner wall of the deposition chamber and an object of surface treatment, further comprising:

a cooling unit installed at the inner wall of the deposition chamber facing the electrode and cooling ambient thereof.

2. The system of claim 1, wherein the cooling unit has a water-cooling structure.

3. The system of claim i, wherein the cooling unit comprises:

a cooling plate unit installed at an inner wall of the deposition chamber; and

a heat-releasing unit connected to the cooling plate unit and releasing heat generated in the deposition chamber.

4. The system of claim 3, wherein the cooling plate unit is installed integrally at the inner wall of the deposition chamber facing the electrode.

5. The system of claim 3, wherein a gas injection unit for injecting gas for deposition reaction is installed together with the cooling plate unit in the deposition chamber.

6. The system of claim 3, wherein the cooling plate unit comprises:

a refrigerant passage formed for letting refrigerant to flow therein; and

a refrigerant inlet through which the refrigerant is introduced into the refrigerant passage and a refrigerant outlet through which the refrigerant is discharged from the refrigerant passage, the refrigerant inlet and the refrigerant outlet being connected to the heat-releasing unit.

7. The system of claim 6, wherein the cooling plate unit includes a plurality of slots for receiving the gas injection unit, and the refrigerant passage is formed around the slots.

8. A surface treatment system in which gas for deposition reaction is injected into a deposition chamber and power is applied to form a deposition reaction to form a deposition layer at a surface of an object of surface treatment, comprising:

a gas injection unit installed at both sides of the deposition chamber, through which gas for the deposition reaction is injected into a deposition space;

a gas discharge unit disposed at the center of the deposition chamber to divide the deposition space into two areas and discharging the deposition reaction-finished gas outwardly of the deposition chamber;

a plurality of electrodes installed with a deposition space therebetween and applying power to the deposition chamber; and

a cooling unit installed at both sides of the deposition chamber and cooling the ambient.

9. The system of claim 8, wherein the cooling unit comprises:

a cooling plate unit installed at an inner wall of the deposition chamber; and

a heat-releasing unit connected to the cooling plate unit and releasing heat generated in the deposition chamber.

10. The system of claim 9, wherein the cooling plate unit is installed integrally at the inner wall of the deposition chamber.

11. The system of claim 9, wherein the gas injection unit is installed together with the cooling plate unit.

12. The system of claim 9, wherein the cooling plate unit comprises:

a refrigerant passage formed for letting refrigerant to flow therein; and

a refrigerant inlet through which the refrigerant is introduced into the refrigerant passage and a refrigerant outlet through which the refrigerant is discharged from the refrigerant passage, the refrigerant inlet and the refrigerant outlet being connected to the heat releasing unit.

13. The system of claim 12, wherein the cooling plate unit includes a plurality of slots for receiving the gas injection unit, and the refrigerant passage is formed around the slots.

14. The system of claim 8, wherein the cooling unit has a water-cooling structure.