High efficiency silicon light emitting device and modulator

• US 20050017257A1
• Filed: 05/30/2002
• Published: 01/27/2005
• Est. Priority Date: 05/30/2001
• Status: Abandoned Application

• Current Assignee: Unisearch Limited (University Of New South Wales)
• Original Assignee: Unisearch Limited (University Of New South Wales)
• Inventors: Zhao, Jianhua, Green, Martin Andrew
• Application Number:
  US10/479,654
• Publication Number:
  US 20050017257A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: G02F 1/015 based on semiconductor elements having potential barriers, e.g. having a PN or PIN junction G02F1/03 takes precedence
• CPC Class Codes: G02F 2202/105 single crystal Si
• CPC Class Codes: H01L 33/34 containing only elements of Group IV of the Periodic Table

Abstract

The present invention provides a high performance silicon light emitting device. A method and device providing both emission and modulation from a single device is provided, with modulation of the emission characteristics being achieved by application of an electric field across the device, so as to induce quantum confined Stark effects, Franz-Keldysh effects or the like.

Claims

1. A light emitting device with alterable emission characteristics, the device comprising:

a light emitting portion comprising a pn junction for emission of light by application of current to flow through the pn junction; and

means for applying an electric field across the light emitting portion by applying a voltage to one or more contacts that are electrically isolated from the pn junction in order to alter a light emission characteristic of the light emitting portion.

2. The light emitting device as claimed in claim 1 wherein the light emitting portion and pn junction comprise silicon.

3. The light emitting device as claimed in claim 2 wherein the light emitting portion and pn junction comprise crystalline silicon.

4. The light emitting device as claimed in claim 1 wherein the light emitting portion and pn junction comprise SiGe.

5. The light emitting device as claimed in claim 1, wherein the light emitting portion of the device comprises a thin layer which has a sufficiently small thickness to allow quantum confinement effects to occur.

6. The light emitting device as claimed in claim 5 wherein the thin layer comprises a quantum well.

7. The light emitting device as claimed in claim 5, wherein the layer has a thickness less than 20 nm.

8. The light emitting device as claimed in claim 7 wherein the layer has a thickness of substantially 2 nm.

9. The light emitting device as claimed in claim 1, wherein the light emitting portion of the device comprises a layer which has a thickness greater than a maximum thickness which can achieve quantum confined Stark effects.

10. The light emitting device as claimed in claim 1, wherein the means for applying an electric field across the light emitting portion is arranged such that the electric field is applied across the layer substantially normal to a plane defined by the layer.

11. The light emitting device as claimed in claim 1, wherein the device is integrated in an integrated circuit.

12. The light emitting device as claimed in claim 1, wherein the light emitting portion of the device is formed of a material having high excited carrier lifetimes.

13. The light emitting device as claimed in claim 1, wherein the means for applying the electric field across the light emitting portion is operable to repeatedly apply the electric field at a switching rate greater than substantially ten GHz.

14. The light emitting device as claimed in claim 1, wherein the light emitting device is a waveguide edge emitting device.

15. The light emitting device as claimed in claim 14 wherein the waveguide is formed by layers having a lower refractive index than the light emitting portion positioned either side of the light emitting portion, such that light generated within the light emitting portion travels within the light emitting portion to emerge laterally from the light emitting portion.

16. The light emitting device as claimed in claim 15, wherein the light emitting portion comprises silicon, and the layers having a lower refractive index comprise silicon oxide.

17. The light emitting device as claimed in claim 14, wherein the dimensions of the light emitting portion are smaller than a typical diffusion length of the material of the light emitting portion.

18. The light emitting device as claimed in claim 14, wherein a thickness of the light emitting portion is chosen in order to optimise the performance of the waveguide at a desired frequency of emission.

19. The light emitting device as claimed in claim 1, wherein the light emitting device is a surface emitting device.

20. The light emitting device as claimed in claim 19 wherein the surface emitting device is in bulk form.

21. The light emitting device as claimed in claim 19 wherein the surface emitting device is in integrated form.

22. The light emitting device as claimed in claim 19, further comprising transparent layers between the light emitting portion of the device and the region into which the light is to be emitted.

23. The light emitting device as claimed in claim 22, wherein the means for applying the electric field comprises a transparent electrode positioned over the light emitting portion, and wherein a transparent dielectric is positioned between the transparent electrode and the light emitting portion.

24. The light emitting device as claimed in claim 19, wherein the means for applying the electric field comprises an electrode positioned over the light emitting portion in a grid pattern for limiting shading, and wherein a transparent dielectric is positioned between the electrode and the light emitting portion.

25. The light emitting device as claimed in claim 1, wherein the light emitting portion comprises a layer, wherein contacts are provided for biasing the p and n regions of the pn junction, and wherein said contacts are positioned at opposed lateral edges of the layer.

26. The light emitting device as claimed in claim 25, wherein a heavily doped p+ region is provided close to the p contact.

27. The light emitting device as claimed in claim 25, wherein a region of p+ or p+/intrinsic amorphous silicon is provided close to the p contact.

28. The light emitting device as claimed in claim 25, wherein a heavily doped n+ region is provided close to the n contact.

29. The light emitting device as claimed in claim 25, wherein a region of n+ or n+/intrinsic amorphous silicon is provided close to the n contact.

30. The light emitting device as claimed in claim 25, wherein said contacts contact the layer only at discrete spaced positions along the lateral edges of the layer.

31. The light emitting device as claimed in claim 25, wherein the surfaces of the layer of the light emitting portion are passivated in regions where the contacts do not contact the layer.

32. The light emitting device as claimed in claim 31, wherein the surfaces of the layer of the light emitting portion are passivated by a silicon oxide layer formed over the surfaces.

33. The light emitting device as claimed in claim 31, wherein the surfaces of the layer of the light emitting portion are passivated by a polycrystalline layer.

34. The light emitting device as claimed in claim 31, wherein the surfaces of the layer of the light emitting portion are passivated by a microcrystalline layer.

35. The light emitting device as claimed in claim 31, wherein the surfaces of the layer of the light emitting portion are passivated by an amorphous silicon layer.

36. The light emitting device as claimed in claim 1, wherein a layer below the light emitting portion is formed of a material having a lower refractive index than the light emitting portion, so as to internally reflect light.

37. The light emitting device as claimed in claim 36, wherein the layer below the light emitting portion comprises a dielectric/metal reflecting layer combination.

38. The light emitting device as claimed in claim 1, wherein an anti-reflective coating is provided over a surface from which the device emits light.

39. The light emitting device as claimed in claim 1, wherein at least one dimension of the light emitting portion is a significant fraction of a diffusion length of the material of the light emitting portion.

40. The light emitting device as claimed in claim 1, comprising a plurality of light emitting portions.

41. The light emitting device of claim 40 wherein the light emitting device comprises alternating layers of dielectrics and light emitting portions.

42. The light emitting device as claimed in claim 1, wherein the light emitting portion comprises a bulk region being only relatively lightly doped, and comprises only relatively small amounts of relatively heavily doped silicon.

43. The light emitting device as claimed in claim 1, wherein the light emitting portion comprises a bulk region with introduced defects for enhancing sub-bandgap absorption.

44. The light emitting device as claimed in claim 43, wherein the introduced defects comprise Ge.

45. The light emitting device as claimed in claim 43, wherein the introduced defects comprise dopants from Groups III or V of the periodic table.

46. The light emitting device as claimed in claim 43, wherein the introduced defects give rise to states relatively deeply within the bandgap.

47. The light emitting device as claimed in claim 46, wherein the introduced defects comprise indium dopants.

48. The light emitting device as claimed in claim 46, wherein the introduced defects comprise thallium dopants.

49. The light emitting device as claimed in claim 43, wherein the introduced defects more tightly bind electrons.

50. The light emitting device as claimed in claim 49, wherein the introduced defects comprise rare earth metals.

51. The light emitting device as claimed in claim 50, wherein the introduced defects comprise Er or Yb.

52. The light emitting device as claimed in claim 43, wherein the introduced defects comprise dislocations.

53. The light emitting device as claimed in claim 1, wherein an emitting surface of the device is of a geometry which directs emissions in a predetermined direction.

54. The light emitting surface as claimed in claim 53, wherein the emitting surface of the device is bevelled.

55. The light emitting device as claimed in claim 53, wherein the device comprises a periodic structure to produce a diffraction effect.

56. The light emitting device as claimed in claim 1, wherein the emitting surface comprises a textured geometry comprising (111) equivalent crystallographic planes present in a (100) oriented wafer surface plane.

57. The light emitting device as claimed in claim 53, wherein the emitting surface is textured by anisotropic etching.

58. A method of altering light emissions from a light emitting diode, the method comprising the step of:

applying a current across a pn junction of the light emitting diode to cause the light emitting diode to emit light; and

applying an electric field across the light emitting diode portion by applying a voltage to one or more contacts that are electrically isolated from the pn junction so as to alter light emission characteristics of the light emitting diode.

59. The method as claimed in claim 58 wherein the light emitting diode comprises silicon.

60. The method as claimed in claim 59 wherein the light emitting diode comprises crystalline silicon.

61. The method as claimed in claim 58 wherein the light emitting diode comprises SiGe.

62. The method as claimed in claim 58, wherein the light emitting diode comprises a thin layer which has a sufficiently small thickness to allow quantum confinement effects to occur, such that application of the electric field causes the quantum confined Stark effect to occur.

63. The method as claimed in claim 62 wherein the thin layer comprises a quantum well.

64. The method as claimed in claim 58, wherein the step of applying the electric field across the light emitting diode comprises applying the electric field across the diode substantially normal to a plane defined by a layer of the diode.

65. The method as claimed in claim 58, wherein the diode is integrated in an integrated circuit.

66. The method as claimed in claim 58, wherein the step of applying the electric field across the light emitting diode comprises repeatedly applying the electric field at a switching rate greater than substantially ten GHz.

67. The method as claimed in claim 58, wherein the light emitting diode is a waveguide edge emitting device.

68. The method as claimed in claim 58, wherein the step of applying the electric field serves to encode data on a light signal produced by the diode, for transmission through an optical transmission system.

69. A silicon light emitting device comprising an emitting surface having geometry for directing emissions in a predetermined direction.

70. The silicon light emitting device as claimed in claim 69, wherein the emitting surface geometry is implemented by bevelling of the emitting surface.

71. The silicon light emitting device as claimed in claim 69, wherein the emitting surface geometry is implemented by a periodic structure which produces a diffraction effect.

72. A silicon light emitting device with surface geometry adapted to control the passage of light in the device so as to improve absorption.

73. The silicon light emitting device as claimed in claim 72 wherein the surface geometry is created by texturing one or more surfaces of the device.

74. The silicon light emitting device as claimed in claim 73 wherein the textured surface geometry comprises (111) equivalent crystallographic planes present in a (100) orientated wafer surface plane, exposed by anisotropic etching.

75. A method of design of a silicon light emitting diode, comprising the step of designing a silicon device having high light absorption, for reverse operation as a light emitting diode.

76. A light modulator comprising:

a layer of silicon, to be positioned in the path of light to be modulated; and

means to apply an electric field across the silicon layer so as to alter the bandgap of the silicon layer, thus controlling whether light is absorbed by the silicon layer or transmitted through the silicon layer.

77. The modulator of claim 76, wherein the silicon layer is of a sufficiently small thickness to exhibit quantum confinement effects, such that application of the electric field induces bandgap alterations by way of the quantum confined Stark effect.

78. The modulator of claim 76 wherein the silicon layer is of a thickness to exhibit Franz-Keldysh effects upon application of the electric field.

79. The modulator of claim 76 wherein the modulator is in integrated form on a silicon integrated circuit.

80. The modulator of claim 76 wherein the modulator is in bulk form on a silicon integrated circuit.

81. A method of modulating light, the method comprising the steps of:

positioning a layer of silicon in the path of the light; and

applying an electric field across the thin silicon layer so as to alter the bandgap of the silicon layer, thus controlling whether light is absorbed by the silicon layer or transmitted through the silicon layer.

82. The method of claim 81, wherein the silicon layer is of a sufficiently small thickness to exhibit quantum confinement effects, such that application of the electric field induces bandgap alterations by way of the quantum confined Stark effect.

83. The method of claim 81 wherein the silicon layer is of a thickness to exhibit Franz-Keldysh effects upon application of the electric field.

84. The method of claim 81, wherein the step of applying the electric field comprises repeatedly applying the electric field at a switching rate greater than substantially 10 GHz.

85. The method of claim 81, wherein the step of applying the electric field causes modulation of data onto a light signal for transmission in an optical transmission system.