Chip light emitting diode and fabrication method thereof

• US 20050017259A1
• Filed: 01/09/2004
• Published: 01/27/2005
• Est. Priority Date: 07/25/2003
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Kim, Do-Hyung, Kim, Hong-San, Park, Kwang-Il, Lee, Chung-Hoon, Yang, Seung-Man, Han, Kwan-Young
• Granted Patent: US 7,042,022 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

A chip light emitting diode having a wide viewing angle, and a fabrication method thereof. The chip light emitting diode has a resin package sealing a light emitting chip which has at least one curved projecting part. The curved projecting part has a cross section which is substantially semicircular, or substantially or partially elliptical or parabolic. The curved projecting part preferably has a cross section which is comprised of a plurality of straight lines, an angle being formed between adjacent lines. The cross section is elongated to form a cylindrical outer surface of the resin package.

Claims

1. A chip light emitting diode comprising:

a metal pad and a lead spaced away from each other on a printed circuit board;

a light emitting chip mounted on the metal pad;

a wire connecting the light emitting chip and the lead; and

a resin package sealing the light emitting chip and at least a part of the metal pad, lead, and the wire, the resin package having at least one curved projecting part.

2. A chip light emitting diode as recited in claim 1, wherein the curved projecting part has a cross section which is substantially semicircular, or substantially or partially elliptical or parabolic.

3. A chip light emitting diode as recited in claim 1, wherein the curved projecting part has a cross section which is comprised of a plurality of straight lines with an angle formed between adjacent lines.

4. A chip light emitting diode as recited in claim 1, wherein at least one stepped part is formed at an outer edge of the resin package.

5. A chip light emitting diode as recited in claim 1, wherein the surface of the resin package has fine striations to scattering light emitted from the light emitting chip.

6. A chip light emitting diode as recited in claim 1, wherein the resin package has one projecting part.

7. A chip light emitting diode as recited in claim 1, wherein the resin package has two projecting parts which are spaced away from each other by a predetermined interval,

wherein the predetermined interval ranges from 0.1 to 0.4 times a bottom length of the resin package

8. A fabrication method of a chip light emitting diode, comprising the steps of:

mounting a light emitting chip on a metal pad formed on a printed circuit board;

connecting the light emitting chip to a lead formed on the printed circuit board;

providing the printed circuit board within a mold having a cavity, the cavity corresponding to at least one projecting part of the chip light emitting diode; and

forming a resin package sealing the light emitting chip and at least a part of the metal pad and lead by injecting resin material into the cavity of the mold, the resin package having at least one curved projecting part.