Apparatus and method for electromechanical testing and validation of probe cards
First Claim
Patent Images
1. A method of testing a probe card comprising the steps of:
- positioning the probe card in a prober over a verification wafer;
bringing the probe card in contact with a contact region on the verification wafer, the verification wafer including a shorting plane surrounding the contact region;
sending a test signal through the contact region to the probe card; and
receiving a response signal from the probe card through the verification wafer.
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Abstract
A method of testing a probe card includes the step of positioning the probe card in a prober over a verification wafer that is placed on a stage. The probe card is brought in contact with a contact region on the verification wafer. The verification wafer includes a shorting plane surrounding the contact region. A test signal is sent through the verification wafer to the probe card. A response signal from the probe card is received and analyzed.
21 Citations
28 Claims
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1. A method of testing a probe card comprising the steps of:
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positioning the probe card in a prober over a verification wafer;
bringing the probe card in contact with a contact region on the verification wafer, the verification wafer including a shorting plane surrounding the contact region;
sending a test signal through the contact region to the probe card; and
receiving a response signal from the probe card through the verification wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of testing a probe card comprising the steps of:
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positioning the probe card having probes in a prober over a blank wafer;
bringing the probe card in contact with the blank wafer;
making scrub marks on the blank wafer with the probes by moving the blank wafer in an X, Y plane; and
examining the scrub marks on the blank wafer to determine location of the probes.
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13. A method of testing a probe card comprising the steps of:
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placing a verification wafer in a prober, the verification wafer having a contact region, a shorting plane surrounding the contact region, and an electrical connection to a tester;
positioning the probe card in the prober over the verification wafer;
bringing the probe card in contact with the contact region;
generating a test signal in the tester;
transmitting the test signal to the probe card through the contact region; and
receiving a response signal from the probe card over the electrical connection. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A system for testing a probe card comprising:
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a prober including means for moving a verification wafer in at least a vertical direction;
a verification wafer positioned on means for moving and having a contact region surrounded by a shorting plane;
an electrical connection from the contact region to a test signal generator, wherein signals generated by the test signal generator are transmitted to a probe on a probe card under test. - View Dependent Claims (25, 26, 27, 28)
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Specification