Wafer-level burn-in and test
1 Assignment
0 Petitions
Accused Products
Abstract
Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring contact elements effecting interconnections between the ASICs and a plurality of devices-under-test (DUTs) on a wafer-under-test (WUT), all disposed in a vacuum vessel so that the ASICs can be operated at temperatures independent from and significantly lower than the burn-in temperature of the DUTs. The spring contact elements may be mounted to either the DUTs or to the ASICs, and may fan out to relax tolerance constraints on aligning and interconnecting the ASICs and the DUTs. Physical alignment techniques are also described.
102 Citations
77 Claims
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1-60. -60. (Canceled)
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61. A method for exercising an electronic device, said method comprising:
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bringing a test substrate into contact with said electronic device, said test substrate including active electronics;
receiving at said test substrate exercise data from a controller;
processing said received exercise data with said active electronics; and
exercising said electronic device in accordance with said processed exercise data, wherein said test substrate comprises a semiconductor material on which said active electronics are fabricated. - View Dependent Claims (62, 63)
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64. A method for exercising an electronic device, said method comprising:
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bringing a test substrate into contact with said electronic device, said test substrate including active electronics;
receiving at said test substrate exercise data from a controller;
processing said received exercise data with said active electronics;
testing said electronic device in accordance with said processed exercise data; and
analyzing results of said testing with said active electronics. - View Dependent Claims (65)
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66. A method for exercising an electronic device, said method comprising:
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bringing a test substrate into contact with said electronic device, said test substrate including active electronics;
receiving at said test substrate exercise data from a controller;
processing said received exercise data with said active electronics;
exercising said electronic device in accordance with said processed exercise data; and
burning in said electronic device while exercising said electronic device. - View Dependent Claims (67, 68)
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69. A method for exercising a semiconductor die, said method comprising:
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bringing a test substrate into contact with said semiconductor die, said test substrate including active electronics;
receiving at said test substrate exercise data from a controller;
processing said received exercise data with said active electronics; and
exercising said semiconductor die in accordance with said processed exercise data. - View Dependent Claims (70)
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71. An apparatus comprising:
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a substrate comprising a semiconductor material; and
active electronics formed as an integrated circuit on said semiconductor material of said substrate, said active electronics configured to process exercise data received from a controller and output said processed exercise data for exercising an electronic device. - View Dependent Claims (72, 73)
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74. An apparatus comprising:
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a substrate; and
active electronics disposed on said substrate, said active electronics configured to;
process exercise data received from a controller and output said processed exercise data for exercising an electronic device, and monitor results of testing of said electronic device. - View Dependent Claims (75)
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76. An apparatus comprising:
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interconnection means for providing an interface between a controller and an electronic device;
data processing means for processing exercise data received from said controller and outputting said processed exercise data for exercising said electronic device, said data processing means disposed on said interconnection means; and
monitoring means for monitoring results of testing of said electronic device, said monitoring means disposed on said interconnection means. - View Dependent Claims (77)
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Specification