×

Resonant impedance matching in microwave and RF device

  • US 20050017816A1
  • Filed: 06/03/2004
  • Published: 01/27/2005
  • Est. Priority Date: 06/03/2003
  • Status: Active Grant
First Claim
Patent Images

1. A device, comprising:

  • a microstrip line having a length of one half of one wavelength of a microwave or RF signal;

    a first conductive pad connected to a center of the microstrip line to supply a DC bias to the microstrip line;

    a second conductive pad connecting a load to a selected contact location on the microstrip line; and

    a conductive feed line that is insulated from the microstrip line and is electrically coupled to supply the microwave or RF signal to or to receive the microwave or RF signal from the microstrip line, wherein the selected contact location on the microstrip line is selected to provide an impedance matching condition for transferring the microwave or RF signal between the conductive feed line and the second conductive pad.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×