Method of calibrating a lithographic apparatus, alignment method, computer program, data storage medium, lithographic apparatus, and device manufacturing method

• US 20050018159A1
• Filed: 05/14/2004
• Published: 01/27/2005
• Est. Priority Date: 05/16/2003
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Gui, Cheng-Qun, Van Buel, Henricus Wilhelmus Maria, De Vries, Alex
• Granted Patent: US 7,253,884 B2
• Time in Patent Office: Days
• US Class Current: 355/52
• CPC Class Codes: G03F 9/7003 Alignment type or strategy, e.g. leveling, global alignment
• CPC Class Codes: G03F 9/7011 Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
• CPC Class Codes: G03F 9/7019 Calibration
• CPC Class Codes: G03F 9/7084 Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels

Abstract

In one method of compensating for the distortion of front-to-backside alignment optics, a displacement vector between the estimated position of a substrate mark and the actual position of a substrate mark is calculated. An optical correction array is also calculated by moving a reference substrate by a fixed amount and comparing how far an image of a point on the back side of a reference substrate moves to how far a corresponding point on the front side of the substrate moves. The displacement vector and optical correction array may then be used to accurately calculate the position of further substrates.

Claims

1. A method of calibrating a lithographic apparatus, the method comprising:

calculating a displacement vector between (a) a position of a mark on a back side of a reference substrate as observed through a front-to-backside alignment optics of the lithographic apparatus and (b) an actual position of said mark;

moving the reference substrate a small distance relative to said front-to-backside alignment optics and comparing a resulting displacement of an image of a point on the back side of the reference substrate to a resulting displacement of a point on the front side of the reference substrate to generate a first correction vector;

repeating said moving and comparing for a different point on the reference substrate to generate a second correction vector; and

applying calibration information based on the displacement vector and the first and second correction vectors.

2. The method according to claim 1, said method comprising:

repeating said moving and comparing for a plurality of different points on the reference substrate to generate a corresponding plurality of second correction vectors, and

generating an optical correction array based on the correction vectors.

3. The method according to claim 2, wherein generating an optical correction array includes subtracting the first correction vector from each second correction vector.

4. The method according to claim 2, wherein said generating an optical correction array is based on at least four correction vectors.

5. The method according to claim 1, wherein said moving and comparing includes subtracting the displacement vector from said correction vector.

6. The method according to claim 1, wherein said point on the front side of the reference substrate corresponds to the point on the back side of the reference substrate.

7. The method according to claim 1, wherein the actual position of said mark on the back side of said reference substrate is calculated based on a measured position of a mark on the front side of said reference substrate.

8. The method of calibrating a lithographic apparatus, the method comprising:

for each of a plurality of marks arranged to be observed through a single branch of said front-to-backside alignment optics of the lithographic apparatus, calculating a first displacement vector between (a) the mark and (b) an image of the mark observed in an image window of said front-to-backside alignment optics;

for each of the plurality of marks, calculating a second displacement vector between (a) the mark and (b) an image of the mark observed in an image window of said front-to-backside alignment optics subsequent to said calculating a first displacement vector; and

comparing the first and second displacement vectors to detect a change in the front-to-backside alignment optics.

9. The method according to claim 8, wherein one of said plurality of marks is fixed within said front-to-backside alignment optics.

10. The method according to claim 8, wherein at least one of said plurality of marks is on the back side of a reference substrate.

11. The method according to claim 8, said method further comprising determining a shift in the single branch based on said comparing.

12. The method according to claim 8, said method further comprising determining a change in at least one dimension of said front-to-backside alignment optics based on said comparing.

13. The method according to claim 8, said method further comprising determining a change in an optical magnification of said front-to-backside alignment optics based on said comparing.

14. An alignment method comprising:

providing an alignment beam of radiation; and

providing an alignment system for projecting the alignment beam onto a substrate mark on the back side of a substrate and detecting said substrate mark,

wherein a position of the substrate mark is calculated using a displacement vector and a plurality of correction vectors.

15. An alignment method according to claim 14, further comprising using front-to-backside alignment optics to project an image of said substrate mark on the back side of said substrate to the front side of said substrate,

wherein said alignment system is arranged to detect said substrate mark based on said image.

16. The alignment method according to claim 14, said method further comprising:

using a radiation system to provide a beam of radiation;

using patterning structure to endow the beam of radiation with a pattern in its cross-section;

projecting the patterned beam of radiation onto a target portion of a layer of radiation-sensitive material that at least partially covers a substrate.

17. A device manufactured according to claim 16.

18. A data storage medium storing machine-executable instructions that describe a method comprising:

calculating a displacement vector between (a) a position of a mark on a back side of a reference substrate as observed through a front-to-backside alignment optics of the lithographic apparatus and (b) an actual position of said mark;

moving the reference substrate a small distance relative to said front-to-backside alignment optics and comparing a resulting displacement of an image of a point on the back side of the reference substrate to a resulting displacement of a point on the front side of the reference substrate to generate a first correction vector;

repeating said moving and comparing for a different point on the reference substrate to generate a second correction vector; and

applying calibration information based on the displacement vector and the optical correction vectors.

19. A lithographic apparatus comprising:

a radiation system configured to provide a beam of radiation;

a support structure configured to support patterning structure, the patterning structure serving to pattern the beam of radiation according to a desired pattern;

a substrate table configured to hold a substrate;

a projection system arranged to project the patterned beam onto a target portion of the substrate;

an alignment system arranged to detect alignment between a reference mark and said substrate mark using an alignment beam of radiation and front-to-backside alignment optics;

a storage device arranged to store a displacement vector and a plurality of correction vectors; and

a correction device arranged to correct an alignment error of the substrate.

20. The lithographic apparatus according to claim 19, wherein the displacement vector is based on an image observed through the front-to-backside alignment optics.

21. The lithographic apparatus according to claim 19, wherein the correction device is configured to correct an alignment error based on the displacement vector and the plurality of correction vectors.

22. A lithographic projection apparatus comprising:

a radiation system configured to provide a beam of radiation;

a support structure configured to support patterning structure, the patterning structure serving to pattern the beam of radiation according to a desired pattern;

a substrate table configured to hold a substrate;

a projection system arranged to project the patterned beam onto a target portion of the substrate;

front-to-backside alignment optics arranged to project an image of said substrate mark to the front side of said substrate; and

an alignment system arranged to detect alignment between a reference mark and said substrate mark using an alignment beam of radiation and said front-to-backside alignment optics,

wherein said front-to-backside alignment optics is configured to simultaneously project images of a plurality of marks including said substrate mark.

23. The lithographic apparatus according to claim 22, wherein an object window of the front-to-backside alignment optics has a diameter of at least one millimeter.

24. The lithographic apparatus according to claim 22, wherein an object window of the front-to-backside alignment optics has a width of at least one millimeter.

25. The lithographic apparatus according to claim 22, wherein said front-to-backside alignment optics is configured to project, together with an image of the substrate mark, an image of a mark implanted into an element of the front-to-backside alignment optics.

26. A lithographic projection apparatus comprising front-to-backside alignment optics, wherein an object window of the front-to-backside alignment optics has a diameter of at least one millimeter.