Silicon condenser microphone and manufacturing method
First Claim
Patent Images
1. A microphone comprising:
- a multi-layer wall housing defining an internal cavity, a first layer of the multi-layer wall housing being non-conductive and a second layer of the multi-layer wall housing being a conductive layer;
an acoustic port formed in the multi-layer wall housing; and
a transducer disposed within the cavity in communication with the acoustic port.
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Abstract
A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
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Citations
29 Claims
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1. A microphone comprising:
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a multi-layer wall housing defining an internal cavity, a first layer of the multi-layer wall housing being non-conductive and a second layer of the multi-layer wall housing being a conductive layer;
an acoustic port formed in the multi-layer wall housing; and
a transducer disposed within the cavity in communication with the acoustic port. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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- 2. The microphone of claim 2, comprising an environmental barrier secured to the housing covering the acoustic port.
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3. The microphone of claim 3, the environmental barrier being disposed between layers of the multi-layer wall housing.
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23. A method of manufacturing a microphone comprising:
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providing a first panel comprising a plurality of bottom layer portions for a corresponding plurality of microphones;
disposing a transducer on each of the plurality of bottom layer portions;
securing a second panel comprising a plurality of top layer portions for the plurality of microphones to the first panel, the top layer portion enclosing the transducer within a cavity defined by the top layer portion and the bottom layer portion; and
separating the plurality of microphones. - View Dependent Claims (24, 25, 26, 27, 28, 29)
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Specification