Optoelectronic module with transmitter chip and connecting piece for the module with respect to an optical fiber and with respect to a circuit board, and methods for producing the same

• US 20050018977A1
• Filed: 07/14/2004
• Published: 01/27/2005
• Est. Priority Date: 07/14/2003
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Beer, Gottfried, Schunk, Nikolaus
• Granted Patent: US 7,048,450 B2
• Time in Patent Office: Days
• US Class Current: 385/88
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05008 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body, e.g.
• CPC Class Codes: H01L 2224/05024 the internal layer being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05026 the internal layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05099 Material
• CPC Class Codes: H01L 2224/05548 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05569 the external layer being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24195 the item being a discrete passive component
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12043 : Photo diode
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

An optoelectronic module and a connecting piece for the module with respect to an optical fiber and with respect to a circuit board can have a semiconductor chip in the form of an optical transmitter chip, which has a light-wave-emitting top side and has a rear side contact as a cathode on its rear side. Further semiconductor chips are embedded in a plastics composition with the optical transmitter chip in such a way that a coplanar overall top side is formed from the plastics composition and the active top side.

Claims

1. An optoelectronic module, comprising:

a semiconductor chip, the semiconductor chip including an optical transmitter chip having

a light-wave-emitting top side, the light-wave-emitting top side having a top side contact for an anode,

a rear side having a rear side contact for a cathode;

further semiconductor chips for optical reception and/or for signal amplification and/or for driving of the semiconductor chip, the further semiconductor chips having contact areas on their active top sides; and

passive components for impedance matching with electrodes,

wherein the active top side of the semiconductor chips with contact areas and the electrodes of the passive components with a plastics composition form a coplanar overall top side and the overall top side having a contact pad of a connecting element, the connecting element connecting the rear side contact to the contact pad.

2. The optoelectronic module according to claim 1, wherein the optical transmitter chip is one of an LED or an RCLED (Resonant Cavity LED) or a VCSE laser diode (Vertical Cavity Surface Emitting Laser Diode), the optical transmitter chip having a light-wave-emitting top side having a vertical cavity, a top side contact adapted to be an anode, and a rear side contact adapted to be a cathode.

3. The optoelectronic module according to claim 1, wherein the connecting element has a base embedded in the plastics composite with the contact pad, the contact pad being accessible from the overall top side.

4. The optoelectronic module according to claim 1, wherein the connecting element is L-shaped and overlaps the rear side contact of the transmitter chip with a first limb of the L, a second limb of the L having the contact pad.

5. The optoelectronic module according to claim 1, wherein the connecting element has a bonding connection between the base and the rear side contact.

6. The optoelectronic module according to claim 1, wherein a rewiring stratum is arranged on the overall top side, the rewiring stratum alternately having transparent insulation layers with through contact openings and patterned rewiring layers with rewiring lines, external contact areas, and through-contact areas.

7. The optoelectronic module according to claim 1, wherein the module is arranged on a first region of a connecting piece with respect to an optical fiber and a superordinate circuit board such that an optical axis of optoelectronic components is oriented substantially parallel to the superordinate circuit board, and a second region of the connecting piece has plug contact areas, the plug contact areas adapted to be plugged into a plug socket of the circuit board.

8. The optoelectronic module according to claim 7, wherein the first and second regions are arranged in angled fashion with respect to one another and the second region can be plugged into a plug socket of the circuit board with its plug contact areas parallel to the circuit board.

9. The optoelectronic module according to claim 7, wherein the connecting piece has a moulded interconnect device having a three-dimensional wiring.

10. The optoelectronic module according to claim 7, wherein the connecting piece is a circuit carrier, the circuit carrier capable of being divided into the first and second regions, the first and second regions being connected to one another by a flexible conductor track sheet.

11. The optoelectronic module according to claim 7, wherein the connecting piece is a circuit carrier having the first and second regions, the circuit carrier being bent in angled fashion, and a first limb of the angled portion having the first region and a second limb of the angled portion having the second region.

12. The optoelectronic module according to claim 7, wherein the optical module is arranged with the connecting piece at a header, the header having a plug-in region for one end of an optical waveguide and a locking means, the locking means adapted to fix the waveguide end in the header and fixedly clamp the header on the superordinate circuit board.

13. The optoelectronic module according to claim 11, wherein the angled second region of the connecting piece has plug contact pins perpendicular to the top side of the second angled region.

14. The optoelectronic module according to claim 13, wherein the plug contact pins have elastic spreaders, the elastic spreaders adapted to latch into through-contact openings of the superordinate circuit board.

16. A method for producing an optoelectronic module, comprising:

providing of a panel with module positions arranged in rows and columns in accordance with claim 14;

applying external contacts on external contact areas; and

separating the panel into individual modules.

20. The optoelectronic module according to claim 7, wherein the optical module is arranged with the connecting piece at a header, the header having a plug-in region for one end of an optical waveguide and a lock, the lock adapted to fix the waveguide end in the header and fixedly clamp the header on the superordinate circuit board.

15. A method for producing a panel for a plurality of optoelectronic modules, which has module positions arranged in rows and columns, the method comprising:

applying an optical transmitter chip with its light-wave-emitting top side onto a single-sided adhesive carrier, a rear side contact initially remaining freely accessible on its rear side;

applying a contact pad of a connecting element on the carrier;

connection of the connecting element to the rear side contact of the transmitter chip;

applying further semiconductor chips for optical reception and/or for signal amplification and/or for driving of the semiconductor chips, the further semiconductor chips being arranged with their contact areas on their active top sides on the carrier in the module positions provided;

applying passive components for impedance matching with their electrodes on the carrier;

applying a plastics composition on the carrier with the semiconductor chips and the components being embedded in the plastics composition and with the formation of a coplanar overall top side on the carrier;

curing the plastics compositions to form a composite board including plastics compositions with semiconductor chips and passive components;

removing the carrier; and

applying of a rewiring stratum onto the freed overall top side of the composite board.

17. A method for producing a connecting piece between an optoelectronic module, an optical fiber of an optical waveguide and a superordinate circuit board, which receives and wires the optoelectronic module in a first region, and which has plug contact areas, which can be plugged into a plug socket of the circuit board in a second region, the method comprising:

producing a circuit carrier with receptacle positions for an optoelectronic module in a first region and with plug contact areas in a second region;

incorporating of a boundary groove into the circuit carrier along the boundary between the two regions while retaining the electrical wiring between the regions; and

heating of the boundary groove with the two regions being angled with respect to one another.

18. A method according to claim 17, wherein prior to the angling of the two regions, the circuit carrier is reinforced by application of a sheet on a wiring side of the circuit carrier.

19. A method for producing a connecting piece between an optoelectronic module, an optical fiber of an optical waveguide and a superordinate circuit board, which, in a first region receives an optoelectronic module, which is wired with a second region having plug contact areas which can be plugged into a plug socket of a circuit board, the method comprising:

producting of a circuit carrier with receptacle positions for an optoelectronic module in a first region and with plug contact areas in a second region, with the formation of conductor tracks between the regions;

separating the two regions along a boundary line with the conductor tracks being separated;

applying of a flexible conductor track sheet onto opposite edge sides of the separated regions with connection of the separated conductor tracks by the conductor track sheet; and

angling of the two regions with respect to one another with bending of the flexible conductor track sheet.