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Methods for reducing cell pitch in semiconductor devices

  • US 20050020043A1
  • Filed: 07/25/2003
  • Published: 01/27/2005
  • Est. Priority Date: 07/25/2003
  • Status: Abandoned Application
First Claim
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1. A method, comprising:

  • providing a substrate having a plurality of features comprising a first material;

    forming a layer over the substrate and the plurality of features, the layer comprising a second material;

    removing the layer down to upper surfaces of the plurality of features, thereby exposing the plurality of features; and

    removing the plurality of features.

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