Substrate with multiple conductive layers and methods for making and using same
First Claim
Patent Images
1. A method for fabricating an electrical circuit, comprising the steps of:
- depositing a layer of a first conductive material onto a surface of a substrate;
depositing a layer of a second conductive material onto said layer of a first conductive material;
selectively etching a portion of said layer of a second conductive material; and
selectively etching a portion of said layer of a first conductive material.
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Abstract
A layer of transparent conductive material is disposed on a surface of a substrate. Further layers of conductive material are deposited on the layer of transparent conductive material or on an opposite surface of the substrate. The layers are selectively etched to yield a layout of pads for mounting electrical components and conductive traces forming an electrical circuit.
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Citations
25 Claims
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1. A method for fabricating an electrical circuit, comprising the steps of:
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depositing a layer of a first conductive material onto a surface of a substrate;
depositing a layer of a second conductive material onto said layer of a first conductive material;
selectively etching a portion of said layer of a second conductive material; and
selectively etching a portion of said layer of a first conductive material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for fabricating an electrical circuit, comprising the steps of:
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depositing a layer of a first conductive material onto a surface of a substrate;
depositing a layer of a second conductive material onto said layer of a first conductive material;
selectively etching a first portion of said layer of a second conductive material and a portion of said layer of first conductive material; and
selectively etching a second portion of said layer of a second conductive material. - View Dependent Claims (16, 17, 18)
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19. A method for fabricating an electrical circuit, comprising the steps of:
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depositing a layer of a first conductive material onto a first surface of a substrate;
depositing a layer of a second conductive material onto a second surface of said substrate;
selectively etching a portion of said layer of a first conductive material;
selectively etching a portion of said layer of a second conductive material;
perforating said substrate at a predetermined location; and
electrically coupling said layer of a first conductive material with said layer of a second conductive material.
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20. An electrical circuit platform having transparent and conventional circuit portions, comprising:
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a substrate, at least a portion of which is transparent;
a layer of a first conductive material disposed on said substrate in a first predetermined pattern; and
a layer of second conductive material disposed on said first conductive material in a second predetermined pattern. - View Dependent Claims (21, 22, 23, 24, 25)
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Specification