Etchant composition for molybdenum and method of using same
First Claim
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1. An etchant composition for etching molybdenum, comprising:
- 5 to 20% by weight of hydrogen peroxide (H2O2);
75 to 94% by weight of water; and
an additive activating an etching action of the hydrogen peroxide.
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Abstract
An etchant composition for molybdenum includes: 5 to 20% by weight of hydrogen peroxide (H2O2); 75 to 94% by weight of water; and an additive including a pH controlling agent. The etching composition is particularly useful for the fabrication of semiconductor devices. Molybdenum may be etched from a substrate by applying the etchant composition, preferably by spraying or immersion, and preferably at a temperature range of 30° C. to 45° C.
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Citations
12 Claims
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1. An etchant composition for etching molybdenum, comprising:
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5 to 20% by weight of hydrogen peroxide (H2O2);
75 to 94% by weight of water; and
an additive activating an etching action of the hydrogen peroxide. - View Dependent Claims (2, 3, 4, 5, 6, 12)
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7-11. -11. (Canceled).
Specification