Apparatus for planarizing microelectronic workpieces
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Abstract
Planarizing machines and methods for accurately planarizing microelectronic workpieces. Several embodiments of the planarizing machines produce a planar surface at a desired endpoint in the microelectronic workpieces by (a) quickly reducing variances on the surface of the workpiece using a planarizing medium that removes topographical features but has a low polishing rate on planar surfaces; and (b) subsequently planarizing the wafer on a planarizing medium that has a higher polishing rate on planar surfaces than the first polishing medium.
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Citations
61 Claims
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1-58. -58. (Cancelled)
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59. A planarizing machine for planarization of microelectronic workpieces, comprising:
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a first support plate;
a first planarizing medium having a first pad on the first support plate and an abrasive slurry on the first pad, wherein the first pad has a first surface with a first roughness;
a second support plate;
a second planarizing medium having a second pad on the second support plate and an abrasive slurry on the second pad, wherein the second pad has a second surface with a second roughness; and
a workpiece carrier assembly having a workpiece holder to move the workpiece relative to the first planarizing medium and the second planarizing medium.
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60. A planarizing machine for planarization of microelectronic workpieces, comprising:
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a first support plate;
a first planarizing medium having a first pad on the first support plate and an abrasive slurry on the first pad, wherein the first pad has a first surface with a first roughness;
a second support plate;
a second planarizing medium having a second pad on the second support plate and an abrasive slurry on the second pad, wherein the second pad has a second surface with a second roughness;
a workpiece carrier assembly having a workpiece holder to move the workpiece relative to the first planarizing medium and the second planarizing medium; and
a computer operatively coupled to the first support plate, the second support plate and the workpiece carrier assembly, the computer including a computer readable medium containing instructions to cause the workpiece carrier to press the workpiece against the first planarizing pad during a first abrasive stage of a planarizing cycle, move the workpiece from the first planarizing pad to the second planarizing pad at the end of the first abrasive stage, and press the workpiece against the second planarizing pad during a second abrasive stage of the planarizing cycle.
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61. A planarizing machine for planarization of microelectronic workpieces, comprising:
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a first support plate;
a first planarizing medium having a first pad on the first support plate and an abrasive slurry on the first pad, wherein the first pad has a first surface with a first roughness;
a second support plate;
a second planarizing medium having a second pad on the second support plate and an abrasive slurry on the second pad, wherein the second pad has a second surface with a second roughness;
a workpiece carrier assembly having a workpiece holder to move the workpiece relative to the first planarizing medium and the second planarizing medium; and
a monitoring system for determining when the workpiece has become planar.
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Specification