Method for analyzing fail bit maps of wafers
First Claim
1. A method of detecting a fabrication apparatus generating a wafer failure using process history information, the method comprising:
- providing a plurality of sections in each of wafers;
inputting a lot ID of a target lot;
extracting a wafer ID of a target wafer among a plurality of wafers in the target lot from the lot ID and the process history information;
extracting a failure location information in the target wafer from the wafer ID and test information configured to extract the failure location information in the wafers;
calculating a to-be-quantified first wafer feature amount for unevenness of a wafer failure distribution based on the sections for the target wafer;
calculating a first lot feature amount for the target lot from the first wafer feature amount calculated for the target wafer;
extracting a fabrication process for the target lot and fabrication apparatuses used in the extracted fabrication process from the process history information using the lot ID of the target lot as an extraction condition;
carrying out significant tests for the fabrication apparatuses used in the extracted fabrication process based on the first lot feature amount; and
detecting a fabrication apparatus with a significant difference as a first abnormal apparatus.
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Abstract
A method of detecting a wafer failure includes extracting the wafer ID of a target wafer in the target lot from the lot ID, extracting the location information of a failure in the target wafer, calculating a to-be-quantified first wafer feature amount for unevenness of a wafer failure distribution, calculating a first lot feature amount for each target lot, extracting a fabrication process for the target lot and a fabrication apparatus, carrying out a significant test for the fabrication apparatus used in each fabrication process, and detecting the fabrication apparatus with a significant difference as a first abnormal apparatus.
28 Citations
20 Claims
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1. A method of detecting a fabrication apparatus generating a wafer failure using process history information, the method comprising:
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providing a plurality of sections in each of wafers;
inputting a lot ID of a target lot;
extracting a wafer ID of a target wafer among a plurality of wafers in the target lot from the lot ID and the process history information;
extracting a failure location information in the target wafer from the wafer ID and test information configured to extract the failure location information in the wafers;
calculating a to-be-quantified first wafer feature amount for unevenness of a wafer failure distribution based on the sections for the target wafer;
calculating a first lot feature amount for the target lot from the first wafer feature amount calculated for the target wafer;
extracting a fabrication process for the target lot and fabrication apparatuses used in the extracted fabrication process from the process history information using the lot ID of the target lot as an extraction condition;
carrying out significant tests for the fabrication apparatuses used in the extracted fabrication process based on the first lot feature amount; and
detecting a fabrication apparatus with a significant difference as a first abnormal apparatus. - View Dependent Claims (2, 3, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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4. A method of detecting a wafer failure using process history information, the method comprising:
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providing a plurality of sections in each of wafers;
inputting a lot ID of a target lot;
extracting a wafer ID of a target wafer among a plurality of wafers in the target lot from the lot ID and the process history information;
extracting the location information of a failure in the target wafer from the wafer ID and test information configured to extract a failure location information in the wafers;
calculating a to-be-quantified first wafer feature amount for unevenness of the wafer failure distribution based on the sections for the target wafer;
representing similarity among wafers by a correlation coefficient in terms of the first wafer feature amount;
grouping the wafers based on whether the similarity is equal to or greater than a predetermined correlation coefficient threshold as a first abnormal wafer ID;
extracting the failure location information with the first abnormal wafer ID from the test information; and
generating a plurality of wafer failure distribution maps as first abnormal wafer failure distribution maps from the failure location information with the first abnormal wafer ID.
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19. An apparatus for detecting a fabrication apparatus generating a wafer failure using process history information, the apparatus comprising:
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a section setting unit providing a plurality of sections in each of wafers;
an input unit to input a lot ID of a target lot;
a wafer ID extraction unit to extract a wafer ID of a target wafer among a plurality of wafers in the target lot from the lot ID and the process history information;
a location information extraction unit to extract the location information of the failure in the target wafer found through a test, from the wafer ID and test information configured to extract a failure location information in the wafers;
a wafer feature amount calculation unit to calculate a to-be-quantified first wafer feature amount corresponding to unevenness of the wafer failure distribution based on the sections for the target wafer;
a lot feature amount calculation unit to calculate a first lot feature amount for the target lot from the first wafer feature amount calculated for the target wafer;
a fabrication apparatus extraction unit to extract a fabrication process for the target lot and a fabrication apparatus used in that fabrication process from the process history information using the lot ID of the target lot as an extraction condition;
a significant test unit conducting a significant test for the fabrication apparatus in each fabrication process based on the first lot feature amount; and
an abnormal apparatus detection unit to detect the fabrication apparatus with a significant difference as a first abnormal apparatus.
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20. A computer program product for detecting a fabrication apparatus generating a wafer failure using process history information, the computer program comprising:
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an instruction to provide a plurality of sections in each of wafers;
an instruction to input a lot ID of a target lot;
an instruction to extract a wafer ID of a target wafer among a plurality of wafers in the target lot from the lot ID and the process history information;
an instruction to extract the location information of the failure in the target wafer from the wafer ID and test information configured to extract a failure location information in the wafers;
an instruction to calculate a to-be-quantified first wafer feature amount corresponding to unevenness of the wafer failure distribution based on sections for the target wafer;
an instruction to calculate the first lot feature amount for the target lot from the first wafer feature amount calculated for the target wafer;
an instruction to extract a fabrication process for the target lot and fabrication apparatuses used in the extracted fabrication process from the process history information using the lot ID of the target lot as an extraction condition;
an instruction to carry out significant tests for fabrication apparatuses in the extracted fabrication process based on the first lot feature amount; and
an instruction to detect a fabrication apparatus with a significant difference as a first abnormal apparatus.
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Specification