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Heat transfer device and method of making same

  • US 20050022976A1
  • Filed: 04/21/2004
  • Published: 02/03/2005
  • Est. Priority Date: 06/26/2003
  • Status: Abandoned Application
First Claim
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1. A capillary structure for a heat transfer device comprising:

  • a plurality of particles comprising a first species of particle and a second species of particle, said plurality of particles being joined together by a brazing compound such that fillets of said brazing compound are formed between adjacent ones of said plurality of particles so as to form a network of capillary passageways between said particles;

    wherein said first species of particle and said second species of particle are each disposed within said capillary structure in homogenous layers.

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