Surface-mounted LED and light emitting device

• US 20050023538A1
• Filed: 07/27/2004
• Published: 02/03/2005
• Est. Priority Date: 07/29/2003
• Status: Active Grant

• Current Assignee: Citizen Electronics Company Limited
• Original Assignee: Citizen Electronics Company Limited
• Inventors: Imai, Sadato, Ishii, Hirohiko
• Granted Patent: US 7,078,728 B2
• Time in Patent Office: Days
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

A surface-mounted LED including a base having heat conductivity, an insulative wiring board fixed to the base and including a conductive pattern and a mounting hole, a light emitting element chip mounted on a mounting area exposed by the mounting hole of the wiring board, and a reflective frame having heat conductivity and fixed to the base and thermally coupled therewith, to surround the light emitting element chip, heat generation from the light emitting element chip being released through both the base and the reflective frame, or either one thereof.

Claims

1. A surface-mounted LED, comprising:

a base having heat conductivity;

an insulative wiring board fixed to said base and including conductive patterns and a mounting hole;

a light emitting element chip mounted on a mounting area exposed by the mounting hole of the wiring board; and

a reflective frame having heat conductivity and fixed to the base and thermally coupled therewith, to surround the light emitting element chip,

heat generation from the light emitting element chip being released through both the base and the reflective frame, or either one thereof.

2. The surface-mounted LED according to claim 1,

wherein said light emitting element chip is connected with the conductive patterns of the wiring board through electrical connection members, and

wherein the conductive patterns include at ends thereof a plurality of electrical connection surfaces comprising terminal portions to supply a driving current for driving the light emitting element chip.

3. The surface-mounted LED according to claim 2,

wherein the base is configured to release heat generated from the light emitting element chip from an outer surface of the base, and

wherein electrical connection surfaces are disposed in positions opposite to a lower surface of the base.

4. The surface-mounted LED according to claim 2,

wherein said wiring board is disposed to come around from both ends of the base to one portion of the lower surface of the base, and

wherein the electrical connection surfaces positioning at the ends of the conductive patterns provided on the wiring board and comprising the terminal portions are disposed at end surfaces and a lower surface of the base.

5. The surface-mounted LED according to claim 1,

wherein an inner surface of the reflective frame adjacent to the light emitting element chip includes a reflective surface to reflect light emitted from the light emitting element chip.

6. The surface-mounted LED according to claim 5,

wherein a bright plating is provided on the reflective surface of the reflective frame.

7. A light emitting device, comprising:

the surface-mounted LED according to any one of claims 1 to 6; and

a printed-circuit board including conductive patterns,

said conductive patterns of the printed-circuit board and electrical connection surfaces provided on the surface-mounted LED being connected mechanically and electrically by a fixing structure.

8. The light emitting device according to claim 7,

further comprising a heat release member having heat conductivity,

said heat release member being fixed and thermally coupled with a heat releasing part of a base of the surface-mounted LED so that heat generated from the surface-mounted LED is released through the heat releasing part of the base by the heat release member.

9. The light emitting device according to claim 7,

further comprising a heat release member having heat conductivity,

said heat release member being fixed and thermally coupled with a heat releasing part of a base of the surface-mounted LED so that heat generated from the surface-mounted LED is released through the heat releasing part of the base by the heat release member.

10. The light emitting device according to claim 7,

further comprising a heat release member having heat conductivity,

said heat release member being fixed and thermally coupled with a heat releasing part of a base of the surface-mounted LED so that heat generated from the surface-mounted LED is released through the heat releasing part of the base by the heat release member.