Vertical system integration
First Claim
1. A stacked integrated circuit comprising:
- a first integrated circuit layer; and
a second integrated circuit layer overlying the first integrated circuit layer;
wherein at least one of the first and second integrated circuit layers is fabricated according to a completed physical IC design or fabricated IC selected from a design library of completed physical IC designs or fabricated ICs.
1 Assignment
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Accused Products
Abstract
The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs.
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Citations
102 Claims
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1. A stacked integrated circuit comprising:
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a first integrated circuit layer; and
a second integrated circuit layer overlying the first integrated circuit layer;
wherein at least one of the first and second integrated circuit layers is fabricated according to a completed physical IC design or fabricated IC selected from a design library of completed physical IC designs or fabricated ICs. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56)
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57. A method of making a stacked integrated circuit comprising:
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providing a design library comprising multiple completed physical IC designs or fabricated ICs; and
using at least one completed physical IC design or fabricated IC from the design library to fabricate the stacked integrated circuit. - View Dependent Claims (58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98)
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99. A method of using a stacked integrated circuit comprising:
placing the stacked integrated circuit in proximity to at least one other stacked integrated circuit, thereby causing wireless communication between the stacked integrated circuits to occur. - View Dependent Claims (100, 101, 102)
Specification