Hermetic sealing cap and method of manufacturing the same

• US 20050023661A1
• Filed: 08/26/2004
• Published: 02/03/2005
• Est. Priority Date: 02/06/2003
• Status: Active Grant

• Current Assignee: Neomax Materials Co., Ltd. (Proterial Ltd.)
• Original Assignee: Neomax Co., Ltd. (Proterial Ltd.)
• Inventors: Matsubara, Shigeji, Fukusako, Toshiaki, Tagashira, Yoshito, Yamamoto, Masaharu
• Granted Patent: US 7,173,331 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/1617 Cavity coating
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/163 Connection portion, e.g. seal
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap

Abstract

A hermetic sealing cap member capable of suppressing deterioration of characteristics of an electronic component resulting from a sealant such as solder coming into contact with the electronic component in a package is obtained. This hermetic sealing cap, which is a hermetic sealing cap employed for an electronic component storing package for storing an electronic component (5, 34), comprises a hermetic sealing cap member (11, 41), a first plating layer (12, 42) formed at least on a region other than a region of the hermetic sealing cap member formed with a sealant (3, 32) and a second plating layer (13, 43), formed on the region of the hermetic sealing cap member on which the sealant is arranged, containing a material superior in wettability with the sealant to the first plating layer.

Claims

1. A hermetic sealing cap employed for an electronic component storing package for storing an electronic component (5, 34), comprising:

a hermetic sealing cap member (11, 41);

a first plating layer (12, 42) formed at least on a region other than a region of said hermetic sealing cap member formed with a sealant (3, 32); and

a second plating layer (13, 43), formed on the region of said hermetic sealing cap member on which the sealant is arranged, containing a material superior in wettability with said sealant to said first plating layer.

2. The hermetic sealing cap according to claim 1, wherein said electronic component storing package includes:

a ceramic substrate (1), and

a ceramic frame body (2) formed to constitute a storage space on a prescribed region of the surface of said ceramic substrate, and

said hermetic sealing cap member (11) is mounted on the surface of said ceramic frame body through said sealant (3).

3. The hermetic sealing cap according to claim 1, wherein

said hermetic sealing cap member (41) includes:

a recess portion (60), and

flange portions (41a) provided on both ends of said recess portion, and

the radius of curvature of sealing side inner corner portions of said flange portions is larger than 0 mm and not more than 0.1 mm.

4. The hermetic sealing cap according to claim 1, wherein

said hermetic sealing cap member (41) includes:

a recess portion (60), and

flange portions (41a) provided on both ends of said recess portion, and

sealing side inner corner portions of said flange portions are substantially right-angled.

5. The hermetic sealing cap according to claim 3, wherein

said electronic component storing package includes a ceramic substrate (31), and

the hermetic sealing cap member (41) having said recess portion (60) is mounted on the surface of said ceramic substrate through said sealant (32).

6. The hermetic sealing cap according to any of claims 1 to 5, wherein

said first plating layer is a nickel plating layer (12, 42), and

said second plating layer is a gold plating layer (13, 43).

7. The hermetic sealing cap according to any of claims 1 to 5, wherein

said first plating layer (12, 42) has a larger thickness than said second plating layer (13, 43).

8. The hermetic sealing cap according to any of claims 1 to 5, wherein

said sealant (3, 32) includes gold-tin solder.

9. The hermetic sealing cap according to any of claims 1 to 5, wherein

said hermetic sealing cap member (11, 41) consists of an Fe—

Ni—

Co alloy.

10. A hermetic sealing cap employed for an electronic component storing package for storing an electronic component, comprising:

a recess portion (60); and

flange portions (41a) provided on both ends of said recess portion, wherein

the radius of curvature of sealing side inner corner portions of said flange portions is not more than 0.1 mm.

11. The hermetic sealing cap according to claim 10, wherein

said hermetic sealing cap consists of an Fe—

Ni—

Co alloy.

12. A method of manufacturing a hermetic sealing cap employed for an electronic component storing package for storing an electronic component, comprising steps of:

forming a hermetic sealing cap member (11, 41);

forming a first plating layer (12, 42) and a second plating layer (13, 43) containing a material superior in wettability with a sealant to said first plating layer substantially on the overall surface of said hermetic sealing cap member; and

removing said portion of said second plating layer located on a region other than a region on which the sealant is arranged.

14. The method of manufacturing a hermetic sealing cap according to claim 12 or 13, wherein

the step of forming said hermetic sealing cap member (41) includes:

a first drawing step of forming a recess portion (60) so that no flange portions are formed on the platelike hermetic sealing cap member, and

a second drawing step of coining both ends of said recess portion thereby forming said flange portions (41a) on both ends of said recess portion while setting the radius of curvature of sealing side inner corner portions of said flange portions to not more than 0.1 mm.

15. The method of manufacturing a hermetic sealing cap according to 14claim 12 or 13, wherein

said first plating layer is a nickel plating layer (12, 42), and

said second plating layer is a gold plating layer (13, 43).

16. The method of manufacturing a hermetic sealing cap according to claim 12 or 13, wherein

said sealant (3, 32) includes gold-tin solder.

17. The method of manufacturing a hermetic sealing cap according to claim 12 or 13, wherein

said hermetic sealing cap member (11, 41) consists of an Fe—

Ni—

Co alloy.

13. A method of manufacturing a hermetic sealing cap employed for an electronic component storing package for storing an electronic component, comprising steps of:

forming a hermetic sealing cap member (41);

forming a first plating layer (42) substantially on the overall surface of said hermetic sealing cap member; and

forming a second plating layer (43) containing a material superior in wettability with a sealant to said first plating layer on a region of said hermetic sealing cap member on which the sealant is arranged.

18. A method of manufacturing a hermetic sealing cap employed for an electronic component storing package for storing an electronic component, comprising:

a first drawing step of forming a recess portion (60) so that no flange portions are formed on a platelike hermetic sealing cap member (41); and

a second drawing step of coining both ends of said recess portion thereby forming said flange portions (41a) on both ends of said recess portion while setting the radius of curvature of sealing side inner corner portions of said flange portions to not more than 0.1 mm.

19. The method of manufacturing a hermetic sealing cap according to claim 18, wherein

said hermetic sealing cap consists of an Fe—

Ni—

Co alloy.