Low cost RFID antenna manufactured from conductive loaded resin-based materials

• US 20050024290A1
• Filed: 09/02/2004
• Published: 02/03/2005
• Est. Priority Date: 02/15/2001
• Status: Active Grant

• Current Assignee: Integral Technologies, Inc.
• Original Assignee: Integral Technologies, Inc.
• Inventors: Aisenbrey, Thomas
• Granted Patent: US 7,017,822 B2
• Time in Patent Office: Days
• US Class Current: 343/873
• CPC Class Codes: B29C 45/0001 characterised by the choice of material
• CPC Class Codes: B29C 45/0013 using fillers dispersed in the moulding material, e.g. metal particles
• CPC Class Codes: B29K 2995/0005 Conductive
• CPC Class Codes: B29L 2031/3456 Antennas, e.g. radomes
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G08B 21/0297 Robbery alarms, e.g. hold-up alarms, bag snatching alarms
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/364 using a particular conducting material, e.g. superconductor
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/0281 Conductive fibers
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2203/0113 Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
• CPC Class Codes: H05K 3/101 by casting or moulding of conductive material
• CPC Class Codes: H05K 3/107 by filling grooves in the support with conductive material H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence

Abstract

RFID antennas are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Claims

1. A RFID device comprising:

an identifier circuit; and

an antenna connected to said identifier circuit wherein said antenna comprises a conductive loaded, resin-based material comprising conductive materials in a base resin host.

2. The device according to claim 1 wherein the percent by weight of said conductive materials is between about 20% and about 50% of the total weight of said conductive loaded resin-based material.

3. The device according to claim 1 wherein the percent by weight of said conductive materials is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.

4. The device according to claim 1 wherein the percent by weight of said conductive materials is between about 25% and about 35% of the total weight of said conductive loaded resin-based material.

5. The device according to claim 1′

wherein said conductive materials comprise metal powder.

6. The device according to claim 5 wherein said metal powder is nickel, copper, or silver.

7. The device according to claim 5 wherein said metal powder is a non-conductive material with a metal plating.

8. The device according to claim 7 wherein said metal plating is nickel, copper, silver, or alloys thereof.

9. The device according to claim 5 wherein said metal powder comprises a diameter of between about 3 μ

m and about 12 μ

m.

10. The device according to claim 1 wherein said conductive materials comprise non-metal powder.

11. The device according to claim 10 wherein said non-metal powder is carbon, graphite, or an amine-based material.

12. The device according to claim 1 wherein said conductive materials comprise a combination of metal powder and non-metal powder.

13. The device according to claim 1 wherein said conductive materials comprise micron conductive fiber.

14. The device according to claim 13 wherein said micron conductive fiber is nickel plated carbon fiber, or stainless steel fiber, or copper fiber, or silver fiber or combinations thereof.

15. The device according to claim 13 wherein said micron conductive fiber has a diameter of between about 3 μ

m and about 12 μ

m and a length of between about 2 mm and about 14 mm.

16. The device according to claim 13 wherein the percent by weight of said micron conductive fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.

17. The device according to claim 13 wherein said micron conductive fiber is stainless steel and wherein the percent by weight of said stainless steel fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.

18. The device according to claim 17 wherein said stainless steel fiber has a diameter of between about 3 μ

m and about 12 μ

m and a length of between about 2 mm and about 14 mm.

19. The device according to claim 1 wherein said conductive materials comprise a combination of conductive powder and conductive fiber.

20. The device according to claim 19 wherein said conductive fiber is stainless steel.

21. The device according to claim 1 wherein said base resin and said conductive materials comprise flame-retardant materials.

22. The device according to claim 1 wherein said identifier circuit comprises an integrated circuit device.

23. The device according to claim 1 wherein said antenna is spiral or serpentine shaped.

24. The device according to claim 1 wherein said connection of said antenna and said identifier circuit comprises bonding by a conductive epoxy.

25. The device according to claim 1 wherein said connection of said antenna and said identifier circuit comprises direct contact between said antenna and said identifier by molding.

26. The device according to claim 1 wherein said connection of said antenna and said identifier circuit comprises a metal layer between said antenna and said identifier circuit.

27. The device according to claim 1 wherein said connection of said antenna and said identifier circuit comprises a flexible circuit wherein said identifier circuit is attached to said flexible circuit and wherein said flexible circuit is molded into said antenna.

28. The device according to claim 1 further comprising a substrate wherein said antenna said identifier chip are molded to said substrate.

29. The device according to claim 28 wherein said substrate is not conductive.

30. The device according to claim 28 wherein said conductive loaded resin-based material is molded onto top and bottom sides of said substrate.

31. The device according to claim 30 wherein said substrate comprises through holes for connecting said top and bottom side conductive loaded resin-based material.

33. The device according to claim 28 wherein said substrate is a printable label.

34. The device according to claim 28 wherein said substrate is a badge blank.

35. The device according to claim 28 wherein said substrate is a key chain blank.

36. The device according to claim 1 further comprising an encapsulating layer containing said antenna and said identifier device.

37. The device according to claim 36 wherein said encapsulating layer is biocompatible for insertion into an animal body or a human body.

38. The device according to claim 1 further comprising a substrate wherein said antenna and said identifier device are adhered to said substrate.

39. The device according to claim 38 wherein said substrate is printable.

40. The device according to claim 1 further comprising a false tooth wherein said antenna and said identifier device are adhered to said false tooth.

41. The device according to claim 1 further comprising a bracelet device wherein said antenna and said identifier device are fixably mounted onto said bracelet device.

42. A RFID device comprising:

an identifier circuit; and

an antenna connected to said identifier circuit wherein said antenna comprises a conductive loaded, resin-based material comprising conductive materials in a base resin host and wherein the percent by weight of said conductive materials is between about 20% and about 50% of the total weight of said conductive loaded resin-based material.

43. The device according to claim 42 wherein the percent by weight of said conductive materials is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.

44. The device according to claim 42 wherein the percent by weight of said conductive materials is between about 25% and about 35% of the total weight of said conductive loaded resin-based material.

45. The device according to claim 42 wherein said conductive materials comprise metal powder.

46. The device according to claim 45 wherein said metal powder is a non-conductive material with a metal plating.

47. The device according to claim 45 wherein said metal powder comprises a diameter of between about 3 μ

m and about 12 μ

m.

48. The device according to claim 42 wherein said conductive materials comprise non-metal powder.

49. The device according to claim 42 wherein said conductive materials comprise a combination of metal powder and non-metal powder.

50. The device according to claim 42 wherein said conductive materials comprise micron conductive fiber.

51. The device according to claim 50 wherein said micron conductive fiber has a diameter of between about 3 μ

m and about 12 μ

m and a length of between about 2 mm and about 14 mm.

52. The device according to claim 50 wherein the percent by weight of said micron conductive fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.

53. The device according to claim 50 wherein said micron conductive fiber is stainless steel and wherein the percent by weight of said stainless steel fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.

54. The device according to claim 53 wherein said stainless steel fiber has a diameter of between about 3 μ

m and about 12 μ

m and a length of between about 2 mm and about 14 mm.

55. The device according to claim 42 wherein said conductive materials comprise a combination of conductive powder and conductive fiber.

56. The device according to claim 55 wherein said conductive fiber is stainless steel.

57. The device according to claim 42 wherein said base resin and said conductive materials comprise flame-retardant materials.

58. The device according to claim 42 wherein said connection of said antenna and said identifier circuit comprises bonding by a conductive epoxy.

59. The device according to claim 42 wherein said connection of said antenna and said identifier circuit comprises direct contact between said antenna and said identifier circuit by molding.

60. The device according to claim 42 wherein said connection of said antenna and said identifier circuit comprises a metal layer between said antenna and said identifier circuit.

61. The device according to claim 42 further comprising a substrate wherein said antenna is molded to said substrate.

62. The device according to claim 61 wherein said substrate is not conductive.

63. The device according to claim 61 wherein said conductive loaded resin-based material is molded onto top and bottom sides of said substrate.

64. The device according to claim 61 wherein said substrate comprises through holes for connecting said top and bottom side conductive loaded resin-based material.

65. The device according to claim 61 wherein said substrate is a printable label.

66. The device according to claim 61 wherein said substrate is a badge blank.

67. The device according to claim 61 wherein said substrate is a key chain blank.

68. The device according to claim 42 further comprising an encapsulating layer containing said antenna and said identifier device.

69. The device according to claim 68 wherein said encapsulating layer is biocompatible for insertion into an animal body or a human body.

70. The device according to claim 42 further comprising a substrate wherein said antenna and said identifier device are adhered to said substrate.

71. The device according to claim 70 wherein said substrate is printable.

72. The device according to claim 42 further comprising a false tooth wherein said antenna and said identifier device are adhered to said false tooth.

73. The device according to claim 42 further comprising a bracelet device wherein said antenna and said identifier device are fixably mounted onto said bracelet device.

74. A method to form a RFID device, said method comprising:

providing an identifying device;

providing a conductive loaded, resin-based material comprising conductive materials in a resin-based host;

molding said conductive loaded, resin-based material to form an antenna device; and

connecting said antenna device to said identifying device.

75. The method according to claim 74 wherein the percent by weight of said conductive materials is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.

76. The method according to claim 74 wherein said conductive materials comprise micron conductive fiber.

77. The method according to claim 76 wherein said micron conductive fiber is nickel plated carbon fiber, or stainless steel fiber, or copper fiber, or silver fiber or combinations thereof.

78. The method according to claim 76 wherein said micron conductive fiber has a diameter of between about 3 μ

m and about 12 μ

m and a length of between about 2 mm and about 14 mm.

79. The method according to claim 76, wherein the percent by weight of said micron conductive fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.

80. The method according to claim 76 wherein said micron conductive fiber is stainless steel and wherein the percent by weight of said stainless steel fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.

81. The method according to claim 80 wherein said stainless steel fiber has a diameter of between about 3 μ

m and about 12 μ

m and a length of between about 2 mm and about 14 mm.

82. The method according to claim 74 wherein said conductive materials comprise conductive powder.

83. The method according to claim 74 wherein said conductive materials comprise a combination of conductive powder and conductive fiber.

84. The method according to claim 74 wherein said step of connecting occurs during said step of molding.

85. The method according to claim 74 wherein said step of connecting comprises:

soldering said identifier device to a flexible circuit; and

molding said flexible circuit into said antenna device.

86. The method according to claim 74 wherein said step of connecting comprises:

forming a metal layer overlying said antenna device; and

soldering said identifier circuit to said antenna device.

87. The method according to claim 74 wherein said molding comprises:

injecting said conductive loaded, resin-based material into a mold;

curing said conductive loaded, resin-based material; and

removing said RFID device from said mold.

88. The method according to claim 74 wherein said molding comprises:

loading said conductive loaded, resin-based material into a chamber;

extruding said conductive loaded, resin-based material out of said chamber through a shaping outlet; and

curing said conductive loaded, resin-based material to form said antenna device.

89. The method according to claim 74 further comprising providing a substrate wherein said antenna device is molded to said substrate.

90. The method according to claim 89 wherein said substrate is non-conductive.

91. The method according to claim 90 wherein said conductive loaded resin-based material is molded to top and bottom sides of said substrate.

92. The method according to claim 89 further comprising printing onto said substrate.

93. The method according to claim 89 mounting a picture on said substrate.

94. The method according to claim 74 further comprising forming an encapsulating layer to contain said antenna and said identifier device.

95. The method according to claim 94 wherein said encapsulating layer is biocompatible for insertion into an animal body or a human body.

96. The method according to claim 74 further comprising adhering said antenna and said identifier device to a substrate.

97. The method according to claim 96 further comprising printing onto said substrate.

98. The method according to claim 74 further comprising adhering said antenna and said identifier device to said false tooth.

99. The method according to claim 74 further comprising fixably mounting said antenna and said identifier device onto a bracelet device.