Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same

• US 20050024553A1
• Filed: 08/31/2004
• Published: 02/03/2005
• Est. Priority Date: 08/28/2000
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Fukuta, Kazuhiko, Iwane, Tomohiko, Monzen, Masahiko
• Granted Patent: US 7,271,860 B2
• Time in Patent Office: Days
• US Class Current: 349/58
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: G02B 6/0083 Details of electrical connections of light sources to drivers, circuit boards, or the like
• CPC Class Codes: G02F 1/133615 Edge-illuminating devices, i.e. illuminating from the side
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 2201/055 Folded back on itself
• CPC Class Codes: H05K 2201/10681 Tape Carrier Package [TCP]; Flexible sheet connector
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits

Abstract

A semiconductor device of the present invention includes a film-like flexible substrate having formed thereon a wiring pattern, external connection terminals formed at both end portions of the flexible substrate; and a semiconductor element mounted on a surface side of the flexible substrate, wherein a folded part, which is folded down in U-shape to a back surface side of the flexible substrate, is formed in a fixed state at least at one end portion of the flexible substrate. With this structure, the semiconductor device is COF mounted, and, for example, in its application to a liquid crystal module wherein the semiconductor device is provided so as to face a liquid crystal panel, the external connection terminals of the flexible substrate can be connected to an inner surface of a module main body for a liquid crystal panel in a state the semiconductor element of the semiconductor device faces the inside of the module main body. As a result, since the semiconductor element can be mounted without being projected to the outside of the module main body, the liquid crystal module can be made thinner for the thickness of the semiconductor element.

Claims

1. (Cancelled)

2. (Cancelled)

3. (Cancelled)

4. (Cancelled)

5. (Cancelled)

6. (Cancelled)

10. A liquid crystal module, comprising:

a semiconductor device, a liquid crystal panel, and a printed wiring substrate which are mounted in flat,

wherein said semiconductor device includes;

a film-like flexible substrate having formed thereon a wiring pattern;

external connection terminals formed at both end portions of said flexible substrate; and

a semiconductor element mounted on a surface side of said flexible substrate,

wherein a folded part, which is folded down in U-shape to a back surface side of said flexible substrate, is formed in a fixed state at least at one end portion of said flexible substrate.

7. A liquid crystal module, comprising:

said semiconductor device of claim 10;

a liquid crystal panel as a member to be connected; and

a printed wiring substrate,

wherein one of said external connection terminals of said semiconductor device is connected to said liquid crystal panel, while an other of said external connection terminals is connected to said printed wiring substrate.

8. The liquid crystal module as set forth in claim 7, wherein:

said flexible substrate is provided so as to have a cross section of substantially S-shape in an inside of a module main body.

9. The liquid crystal module as set forth in claim 8, further comprising:

lighting means provided between said liquid crystal panel and said flexible substrate,

wherein said semiconductor element mounted on said flexible substrate is provided so as to face inside of said module main body.

11. A method of manufacturing a liquid crystal module which comprises i) a semiconductor device, ii) a liquid crystal panel as a member to be connected and iii) a printed wiring substrate, wherein i) said semiconductor device includes a film-like flexible substrate having formed thereon a wiring pattern, external connection terminals formed at both end portions of said flexible substrate, and a semiconductor element mounted on a surface side of said flexible substrate, and a folded part, which is folded down in U-shape to a back surface side of said flexible substrate, is formed in a fixed state at least at one end portion of said flexible substrate;

and one of said external connection terminals is connected to said liquid crystal panel, while an other of said external connection terminals is connected to said printed wiring substrate, said method comprising the steps of;

(a) after bonding a spacer to a back surface of the end portion of said film-like flexible substrate having the wiring pattern formed on the surface thereof, folding the end portion down to the back surface side of said flexible substrate in substantially U-shape and fixing a resulting folded end portion to the spacer; and

(b) after said step (a), connecting the external connection terminals of said flexible substrate to said liquid crystal panel or said printed wiring substrate.

12. A method of manufacturing a liquid crystal module which comprises i) a semiconductor device, ii) a liquid crystal panel as a member to be connected and iii) a printed wiring substrate, wherein i) said semiconductor device includes a film-like flexible substrate having formed thereon a wiring pattern, external connection terminals formed at both end portions of said flexible substrate, and a semiconductor element mounted on a surface side of said flexible substrate, and a folded part, which is folded down in U-shape to a back surface side of said flexible substrate, is formed in a fixed state at least at one end portion of said flexible substrate;

and one of said external connection terminals is connected to said liquid crystal panel, while an other of said external connection terminals is connected to said printed wiring substrate, said method comprising the steps of;

i) after slightly folding down an end portion of the film-like flexible substrate having formed thereon the wiring pattern to the back surface side, connecting external connection terminals of said flexible substrate to said liquid crystal panel or said printed wiring substrate; and

ii) after said step i) fixing the end portion of said flexible substrate to a spacer by folding down the end portion in substantially U-shape to the back surface side after bonding the spacer to the back surface of the end portion of said flexible substrate.

13. (Cancelled)

14. A liquid crystal module, comprising:

a semiconductor device; and

a liquid crystal panel as a member to be connected,

wherein said semiconductor device includes;

a wiring pattern formed on a surface side of a film-like flexible substrate;

a semiconductor element and external connection terminals which are connected to the wiring pattern,

wherein a folded part, which is folded down to a back surface side of said flexible substrate, is formed in a fixed state at least at one end portion of said flexible substrate; and

said external connection terminals are connected to said liquid crystal panel in such a manner that said semiconductor element faces said liquid crystal panel.

15. An electronic equipment, comprising a liquid crystal module which includes:

a semiconductor device;

a liquid crystal panel as a member to be connected; and

a printed wiring substrate,

wherein said semiconductor device includes;

a film-like flexible substrate having formed thereon a wiring pattern;

external connection terminals formed at both end portions of said flexible substrate; and

a semiconductor element mounted on a surface side of said flexible substrate,

wherein a folded part, which is folded down to a back surface side of said flexible substrate, is formed in a fixed state at least at one end portion of said flexible substrate; and

one of said external connection terminals of said semiconductor device is connected to said liquid crystal panel, while an other of said external connection terminals is connected to said printed wiring substrate.