Packaging of electronic chips with air-bridge structures
First Claim
1. An integrated circuit assembly comprising:
- an electronic chip; and
a conductive structure including copper embedded in a plurality of materials, each of the plurality of materials having a different vaporization temperature, the plurality of materials is formed on the electronic chip and the conductive structure is coupled to the electronic chip.
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0 Petitions
Accused Products
Abstract
A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structure embedded in a plurality of materials having a plurality of vaporization temperatures. The plurality of materials is formed on the electronic chip and the conductive structure is coupled to the electronic chip. To fabricate the circuit assembly, a support structure, including interstices, is formed on an electronic chip. The interstices of the support structure are filled with a material having a vaporization temperature that is less than the vaporization temperature of the support structure. Conductive structures are embedded in the support structure and the material, and a connective structure is mounted on the support structure. Finally, the material is removed from the interstices by heating the circuit assembly.
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Citations
73 Claims
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1. An integrated circuit assembly comprising:
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an electronic chip; and
a conductive structure including copper embedded in a plurality of materials, each of the plurality of materials having a different vaporization temperature, the plurality of materials is formed on the electronic chip and the conductive structure is coupled to the electronic chip. - View Dependent Claims (2, 3, 4)
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5. An integrated circuit assembly comprising:
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an electronic chip; and
a conductive structure including copper embedded in a material layer having a structural component having a structural vaporization temperature and a non-structural component having a non-structural vaporization temperature less than the structural vaporization temperature, the material layer is formed on the electronic chip and the conductive structure is coupled to the electronic chip. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12)
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13. An integrated circuit assembly comprising:
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an electronic chip;
a support structure mounted on the electronic chip, the support structure having an interstice and a vaporization temperature;
a material filling the interstice, the material having a vaporization temperature that is less than the vaporization temperature of the support structure;
a connective structure mounted on the support structure; and
a conductive structure capable of coupling the electronic chip to the connective structure, the conductive structure embedded in the support structure and the material. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. An integrated circuit assembly comprising:
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an electronic chip; and
a conductive structure including a support structure, the conductive structure having a vaporization temperature and the conductive structure including the support structure is embedded in a material layer having a vaporization temperature less than the vaporization temperature of the conductive structure, the material layer is formed on the electronic chip and the conductive structure is coupled to the electronic chip. - View Dependent Claims (21)
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22. An integrated circuit memory device comprising:
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an electronic memory chip; and
a ribbed structure mounted on the electronic memory chip and capable of protecting an air-bridge structure and supporting a C4 structure. - View Dependent Claims (23, 24, 25)
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26. An integrated circuit assembly comprising:
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an electronic chip; and
a post structure mounted on the electronic chip and capable of protecting an air-bridge structure and supporting a C4 structure. - View Dependent Claims (27, 28, 29, 30, 31, 32)
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33. An integrated circuit assembly comprising:
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an electronic chip including a plurality of electronic devices;
a plurality of conductive segments capable of interconnecting the plurality of electronic devices, each of the plurality of conductive segments having a surface area in contact with a material having a dielectric constant of about 1;
a C4 connection coupled to the electronic chip through the plurality of conductive segments; and
a substrate coupled to the C4 connection. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40, 41)
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42. A computer system comprising:
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a processor;
a memory device having a plurality of circuit devices, the memory device coupled to the processor; and
an air-bridge structure and a support structure fabricated on the memory device, the air-bridge structure capable of coupling at least two of the plurality of circuit devices and the support structure capable of supporting the memory device mounted as a flip chip. - View Dependent Claims (43, 44)
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45. A method of constructing an integrated circuit comprising:
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fabricating a plurality of electronic devices on a substrate;
embedding a wiring structure in a plurality of materials having a plurality of vaporization temperatures, the plurality of materials is located on the substrate and the wiring structure interconnects the plurality of electronic devices;
mounting the integrated circuit on a packaging substrate; and
removing at least one of the plurality of materials after the integrated circuit is mounted on the packaging substrate. - View Dependent Claims (46, 47, 48)
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49. A method of forming an air bridge structure comprising:
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forming a support structure having a support structure vaporization temperature and having interstices on an electronic chip;
filling the interstices of the support structure with a fill material having a vaporization temperature that is less than the support structure vaporization temperature;
embedding a conductive structure in the support structure and the material;
mounting a connective structure on the support structure; and
removing the fill material. - View Dependent Claims (50)
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51. A method of forming an air bridge structure comprising:
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forming a support structure having interstices on an electronic chip;
filling the interstices of the support structure with a fill material having a vaporization temperature that is less than the vaporization temperature of the support structure;
embedding a conductive structure in the fill material;
mounting a connective structure on the support structure; and
vaporizing the fill material. - View Dependent Claims (52, 53, 54)
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55. A method of forming an air bridge structure comprising:
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forming a material layer on an electronic chip;
embedding a conductive structure and a conductive support structure in the material layer, the conductive structure is capable of electronically coupling to the electronic chip; and
removing the material layer. - View Dependent Claims (56, 57, 58)
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59. A method of forming an air bridge structure comprising:
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forming a material layer on an electronic chip;
embedding a conductive structure and a conductive support structure in the material layer, the conductive structure is capable of being electronically coupled to the electronic chip;
mounting a connective structure on the support structure; and
removing the layer material. - View Dependent Claims (60)
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61. A method of packaging an integrated circuit comprising:
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fabricating an integrated circuit structure including a conductive structure and a ribbed support structure embedded in a fill material;
mounting C4 pads on the integrated circuit structure;
mounting the integrated circuit structure on a substrate;
removing the fill material; and
backfilling with a gas and hermetically sealing the substrate. - View Dependent Claims (62, 63, 64, 65, 66, 67, 68, 69)
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70. An integrated circuit assembly comprising:
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an electronic chip;
a material layer having a plurality of vaporization temperatures, wherein the material layer includes a support structure having a number of support members that are approximately the length of one of the sides of the electronic chip; and
a conductive structure embedded in the material layer, the material layer is formed on the electronic chip and the conductive structure is coupled to the electronic chip.
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71. An integrated circuit assembly comprising:
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an electronic chip;
a plurality of material that includes a support structure having a number of support members that are approximately parallel to one of the sides of the electronic chip; and
a conductive structure embedded in the plurality of materials, each of the plurality of materials having a different vaporization temperature, the plurality of materials is formed on the electronic chip and the conductive structure is coupled to the electronic chip.
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72. An integrated circuit assembly comprising:
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an electronic chip; and
a conductive structure embedded in a material layer having a structural component having a structural vaporization temperature and a non-structural component having a non-structural vaporization temperature less than the structural vaporization temperature, wherein the structure component has a number of support members that are approximately the length of one of the sides of the electronic chip and are approximately parallel to one of the sides of the electronic chip, wherein the number of support members are arranged to create a number of interstices.
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73. An integrated circuit assembly comprising:
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an electronic chip;
a ribbed support structure mounted on the electronic chip, the ribbed support structure having a vaporization temperature, wherein the ribbed support structure comprises a number of support members, wherein the number of support members are parallel to one of the sides of the electronic chip and are approximately the length of the electronic chip, the number of support members arranged to create an interstice;
a material filling the interstice, the material having a vaporization temperature that is less than the vaporization temperature of the ribbed support structure;
a controlled collapse chip connection (C4) connective structure mounted on the ribbed support structure, wherein the C4 structure is to mount on a silicon substrate; and
a conductive structure capable of coupling the electronic chip to the connective structure, the conductive structure embedded in the ribbed support structure and the material.
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Specification