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Method of manufacturing semiconductor device and display device

  • US 20050026410A1
  • Filed: 05/13/2004
  • Published: 02/03/2005
  • Est. Priority Date: 05/16/2003
  • Status: Active Grant
First Claim
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1. A method of manufacturing a semiconductor device comprising steps of:

  • forming an insulating film over a substrate;

    forming an opening in the insulating film;

    dropping a liquid droplet containing a conductive composition by droplet discharging method over the substrate, thereby a wiring is formed on a position including at least the opening; and

    performing a heat treatment, thereby a surface of the wiring on the opening and a surface of the wiring other than the wiring on the opening are approximately leveled over the substrate.

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