Combined structure of a thermal chamber and a thermal tower

• US 20050028965A1
• Filed: 08/07/2003
• Published: 02/10/2005
• Est. Priority Date: 08/07/2003
• Status: Abandoned Application

• Current Assignee: Hotmon International Corporation
• Original Assignee: Hotmon International Corporation
• Inventors: Chen, Ching-Chih
• Application Number:
  US10/635,558
• Publication Number:
  US 20050028965A1
• Time in Patent Office: Days
• US Class Current: 165/104.210
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/0283 Means for filling or sealing heat pipes
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A combined structure of a thermal chamber and a thermal tower, the structure suits heat generating products such as a CPU of a computer, a projector, an LCD color monitor, a TV set etc., and comprises: a hollow vacuum thermal chamber or vapor chamber forming a base, of which the upper surface has at least an opening; and at least a vacuum thermal tower or heat pipe combined with the opening of the vacuum thermal chamber, the inner spaces of the thermal chamber (or vapor chamber) and the thermal tower (or heat pipe) are communicated with each other. Thereby, heat can be fast conducted and scattered through the vacuum thermal chamber or vapor chamber and the vacuum thermal tower or heat pipe.

Claims

1. A combined structure of a thermal chamber and a thermal tower, said structure comprises:

a hollow vacuum thermal chamber forming a base, of which an upper surface is provided at least with an opening; and

at least a vacuum thermal tower combined with said opening of said vacuum thermal chamber, the inner spaces of said thermal chamber and said thermal tower are communicated with each other;

thereby, heat is conducted and scattered through said thermal chamber and said thermal tower.

2. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:

said vacuum thermal tower has on an upper end thereof a vacuum sealed-opening.

3. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:

a vacuum sealed-opening is provided on a side of said vacuum thermal chamber.

4. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:

the bottom of said vacuum thermal chamber is connected with a heat generating body in use.

5. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:

said vacuum thermal tower is upright and is provided at the periphery thereof with a plurality of heat sinking fins to increase heat sinking function.

6. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:

said vacuum thermal tower is a vacuum thermal tower or a vacuum thermal column having air therein drawn to make a vacuum.

7. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:

said vacuum thermal tower is an inversed “

U”

shaped vacuum thermal tower.

8. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:

said thermal tower includes a plurality of heat pipes all of a smaller diameter.

9. The combined structure of a thermal chamber and a thermal tower as in claim 8, wherein:

said heat pipes are embedded in a plurality of heat sinking fins with an opening provided centrally thereof.