Method of transmitting data and a card for such transmission
First Claim
1. A portable article of the smart card type, the article comprising firstly a body and secondly an integrated circuit chip (9), said integrated circuit chip (9) having a central processor unit (CPU) connected via a data and address bus to memories (ROM, RAM, EEPROM), and further including at least a first contact pad (VCC) suitable for providing the chip (9) with a power supply voltage, a second contact pad (GND) suitable for grounding the chip (9), a third contact pad (D+) and a fourth contact pad (D−
- ), said contact pads (VCC, GND, D+, D−
) being electrically connected respectively to a first contact area (C1), a second contact area (C5), a third contact area (C4), and a fourth contact area (C8) of a set of eight contact areas (C1, C2, C3, C4, C5, C6, C7, C8) flush with the surface of the article body, said portable article comprising the third and fourth contacts pads (D+, D−
) connected to an interface of the chip (9) and suitable for providing data transmission under the control of the central processor unit (CPU).
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Accused Products
Abstract
A portable article of the smart card type and a method of transmitting data to such an article. The article comprises an article body and an integrated circuit chip. The integrated circuit chip comprises a central processor unit (CPU) connected via a data and address bus to memories (ROM, RAM, EEPROM), and at least four contact pads (VCC, GND, RST, VPP, CLK, I/O, D+, D−) connected to four contact areas (C1, C5, C4, C8) of a set of at least six contact areas flush with the surface of the card body. Two of the contacts pads (D+, D−) are connected to an interface of the card and are suitable for providing data transmission handled by the central processor unit (CPU) such as for transmitting data using the universal serial bus (USB) protocols and formats.
29 Citations
13 Claims
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1. A portable article of the smart card type, the article comprising firstly a body and secondly an integrated circuit chip (9), said integrated circuit chip (9) having a central processor unit (CPU) connected via a data and address bus to memories (ROM, RAM, EEPROM), and further including at least a first contact pad (VCC) suitable for providing the chip (9) with a power supply voltage, a second contact pad (GND) suitable for grounding the chip (9), a third contact pad (D+) and a fourth contact pad (D−
- ), said contact pads (VCC, GND, D+, D−
) being electrically connected respectively to a first contact area (C1), a second contact area (C5), a third contact area (C4), and a fourth contact area (C8) of a set of eight contact areas (C1, C2, C3, C4, C5, C6, C7, C8) flush with the surface of the article body, said portable article comprising the third and fourth contacts pads (D+, D−
) connected to an interface of the chip (9) and suitable for providing data transmission under the control of the central processor unit (CPU). - View Dependent Claims (2, 3, 4)
- ), said contact pads (VCC, GND, D+, D−
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5. A method of transmitting data to an integrated circuit chip (9) of a portable article of the smart card type including an article body, said integrated circuit chip (9) comprising a central processor unit (CPU) connected via a data and address bus to memories (ROM, RAM, EEPROM) and further comprising at least a first contact pad (VCC) suitable for providing the chip with a power supply voltage, a second contact pad (GND) suitable for grounding the chip (9), a third contact pad (D+) and a fourth contact pad (D−
- ), said contact pads (VCC, GND, D+, D−
) being electrically connected respectively to a first contact area (C1), a second contact area (C5), a third contact area (C4), and a fourth contact area (C8) of a set of eight contact areas (C1, C2, C3, C4, C5, C6, C7, C8) flush with the surface of the article body, wherein the data handled by the central processor unit (CPU) is transmitted via the third and fourth contact pads (D+, D−
) connected to an interface of the chip (9). - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13)
- ), said contact pads (VCC, GND, D+, D−
Specification