Apparatus and method for packaging circuits
First Claim
1. An electrical system, comprising:
- a first circuit having first contacts, and a die having an integrated circuit formed therein, wherein the die includes;
a main body including a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer;
a bond pad on the main body;
an edge contact at the peripheral edge surface, the edge contacts being in electrical communication with the first contacts; and
a line connecting the bond pad to the edge contact.
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Accused Products
Abstract
Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
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Citations
40 Claims
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1. An electrical system, comprising:
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a first circuit having first contacts, and a die having an integrated circuit formed therein, wherein the die includes;
a main body including a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer;
a bond pad on the main body;
an edge contact at the peripheral edge surface, the edge contacts being in electrical communication with the first contacts; and
a line connecting the bond pad to the edge contact. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A system comprising a land pattern, integrated circuit package and an electrical device, wherein the package includes:
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a die including a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer;
a bond pad on the die;
an edge contact at the peripheral edge surface; and
a line connecting the bond pad to the edge contact;
wherein the electrical device includes a device contact providing electrical contact between the electrical device and the die through the edge contact. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. An electrical system, comprising a first integrated circuit, a second integrated circuit, and a bus operably connecting the first integrated circuit and the second integrated circuit, wherein the first integrated circuit includes:
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a main body including a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer;
a bond pad on the main body;
an edge contact at the peripheral edge surface, the edge contact having an outer peripheral surface remote from the main body and an inner surface adjacent the main body, wherein the outer peripheral surface is essentially coplanar with the edge surface of the main body; and
a line connecting the bond pad to the edge contact. - View Dependent Claims (29, 30, 31, 32)
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33. A method, comprising:
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fabricating at least two dies on a wafer, wherein the at least two dies are joined at a saw street;
forming a recess in the saw street;
filling the recess with an electrically conducting material;
connecting a bond pad from at least one of the dies to the electrically conductive material; and
separating the at least two dies from each other along the saw street. - View Dependent Claims (34, 35, 36)
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37. A method, comprising:
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patterning a recess in a saw street intermediate adjacent dies in a wafer;
depositing an electrically conductive material in the recess to form an edge contact;
connecting a bond pad of both dies to the edge contact; and
separating the adjacent dies along the saw street such that each dies includes a part of the edge contact. - View Dependent Claims (38, 39, 40)
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Specification