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Apparatus and method for packaging circuits

  • US 20050029668A1
  • Filed: 08/30/2004
  • Published: 02/10/2005
  • Est. Priority Date: 10/08/2001
  • Status: Active Grant
First Claim
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1. An electrical system, comprising:

  • a first circuit having first contacts, and a die having an integrated circuit formed therein, wherein the die includes;

    a main body including a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer;

    a bond pad on the main body;

    an edge contact at the peripheral edge surface, the edge contacts being in electrical communication with the first contacts; and

    a line connecting the bond pad to the edge contact.

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