Integrated circuit with test pad structure and method of testing
First Claim
1. An integrated circuit comprising:
- a functional block of active circuitry formed within a die and configured to perform a function;
a passivation layer overlying a portion of a top surface of the die; and
a test pad structure for receiving test probes substantially disposed within a center region of the die, wherein the test pad structure includes a first portion not overlying the passivation layer that directly accesses the functional block and a second portion overlying the passivation layer configured for being probed during a testing of the functional block.
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Accused Products
Abstract
A semiconductor device has a large number of bond pads on the periphery for wirebonding. The semiconductor device has a module as well as other circuitry, but the module takes significantly longer to test than the other circuitry. A relatively small number of the bond pads, the module bond pads, are required for the module testing due, at least in part, to the semiconductor device having a built-in self-test (BIST) circuitry. The functionality of these module bond pads is duplicated on the top surface of and in the interior of the semiconductor device with module test pads that are significantly larger than the bond pads on the periphery. Having large pads for testing allows longer probe needles, thus increasing parallel testing capability. Duplicating the functionality is achieved through a test pad interface so that the module bond pads and the module test pads do not have to be shorted together.
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Citations
38 Claims
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1. An integrated circuit comprising:
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a functional block of active circuitry formed within a die and configured to perform a function;
a passivation layer overlying a portion of a top surface of the die; and
a test pad structure for receiving test probes substantially disposed within a center region of the die, wherein the test pad structure includes a first portion not overlying the passivation layer that directly accesses the functional block and a second portion overlying the passivation layer configured for being probed during a testing of the functional block. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. An integrated circuit comprising:
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a functional block of circuitry formed within a die and configured to perform a function;
a passivation layer overlying a portion of a top surface of the die; and
a plurality of bond pads disposed on a periphery region of the die configured for a first set of functions and a second set of functions, wherein the first set of functions is exclusively for the bond pads; and
a plurality of test pads overlying a portion of the passivation layer and disposed within a center region of the die, wherein the plurality of test pads are for the second set of functions and wherein the second set of functions is for testing the functional block. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. A method of making an integrated circuit comprising:
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forming a functional block of active circuitry within a die, the functional block of active circuitry configured to perform a function;
forming a passivation layer overlying a portion of a top surface of the die; and
forming a test pad structure substantially overlying a portion of the passivation layer and disposed within a center region of the die, wherein forming the test pad structure includes forming a first portion of the test pad structure that directly accesses the functional block and forming another portion of the test pad structure for being probed during a testing of the functional block. - View Dependent Claims (38)
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Specification