Interface unit, lithographic projection apparatus comprising such an interface unit and a device manufacturing method

• US 20050030511A1
• Filed: 08/06/2004
• Published: 02/10/2005
• Est. Priority Date: 08/07/2003
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Marius Van Groos, Pieter Johannes, Auer-Jongepier, Suzan Leonie
• Granted Patent: US 7,145,643 B2
• Time in Patent Office: Days
• US Class Current: 355/72
• CPC Class Codes: G03F 7/70733 Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
• CPC Class Codes: G03F 7/7075 Handling workpieces outside exposure position, e.g. SMIF box

Abstract

An interface unit for transferring objects, such as substrates, is presented. The interface unit includes a first object transfer path to transfer objects between a track configured to process objects and a lithographic exposure unit configured to expose objects, wherein the interface unit is also provided with a second object transfer path extending through a closable transfer opening to an external space to transfer objects between the external space and the lithographic exposure unit. Furthermore, the invention relates to a lithographic apparatus provided with a lithographic exposure unit and an interface unit according to the invention.

Claims

1. An interface unit comprising:

a first object transfer path to transfer objects between a track configured to process objects and a lithographic exposure unit configured to expose objects, and

a second object transfer path that extends through a closable transfer opening to an external space, the second object transfer path configured to facilitate the transfer of objects between the external space and the lithographic exposure unit.

2. The interface unit of claim 1, wherein the first object transfer path is coupled to the second object transfer path.

3. The interface unit of claim 1, wherein the closable transfer opening comprises a front opening universal pod interface configured to engage with a front opening universal pod.

4. The interface unit of claim 1, wherein the interface unit is configured to be coupled to a Load Lock of said lithographic exposure unit having an enclosed vacuum space provided with a second opening closable by the Load Lock, wherein the first object transfer path extends through the second opening into the vacuum space.

5. The interface unit of claim 1, wherein the interface unit is configured to be coupled to the lithographic exposure unit and the track.

6. The interface unit of claim 1, further comprising a robot handler configured to transfer the objects.

7. The interface unit of claim 1, further comprising at least one station configured to hold the objects in the interface unit.

8. The interface unit of claim 7, wherein the at least one station comprises a buffer station configured to temporarily store one of said objects.

9. The interface unit of claim 7, wherein the at least one station comprises a cleaning station configured to clean one of said objects.

10. The interface unit of claim 7, wherein the at least one station comprises a pre-treatment station configured to treat one of said objects before exposing the object in the lithographic exposure unit.

11. The interface unit of claim 7, wherein the at least one station comprises a post-treatment station configured to treat one of said objects after the object is transferred from the lithographic exposure unit to the interface unit.

12. The interface unit of claim 1, further comprising a control unit configured to communicate with a control unit of the lithographic exposure unit and/or a control unit of the track.

13. A lithographic apparatus comprising:

(a) a lithographic exposure unit including;

a radiation system configured to provide a beam of radiation;

a support structure configured to support a patterning device that imparts a desired pattern to the beam of radiation;

a substrate holder configured to hold a substrate; and

a projection system configured to project the patterned beam of radiation onto a target portion of the substrate, and

(b) an interface unit coupled to the lithographic exposure unit, the interface unit including;

a first object transfer path to transfer the substrate between a track configured to process substrates and the lithographic exposure unit configured to expose substrates, and

a second object transfer path that extends through a closable transfer opening to an external space, the second object transfer path configured to facilitate the transfer of the substrate between the external space and the lithographic exposure unit.

14. A device manufacturing method comprising:

transferring a substrate to an exposure unit or a track unit via separate paths of an interface unit coupled to said exposure unit and said track unit;

providing a beam of radiation using a radiation system;

patterning the beam of radiation with a pattern in its cross-section; and

projecting the patterned beam of radiation onto a target portion of a layer of radiation-sensitive material on said substrate.

15. The device manufacturing method of claim 14, further comprising pre-processing said substrate in said interface unit before projecting the patterned beam of radiation.

16. The device manufacturing method of claim 14, further comprising post-processing said substrate in said interface unit after projecting the patterned beam of radiation.

17. A lithographic system comprising:

a lithographic exposure unit configured to expose a substrate;

a track unit comprising a plurality of processing stations configured to process said substrate; and

an interface unit operatively associated with said lithographic exposure unit and said track unit, said interface unit being configured to transfer said substrate between said lithographic exposure unit and said track unit, said interface unit being further capable of receiving a substrate from a structure other than said lithographic exposure unit or said track unit and further capable of transferring said substrate from said other structure to said lithographic exposure unit and/or said track unit.

18. The lithographic system of claim 17, wherein said interface unit comprises a first object path to transfer said substrate between said lithographic exposure unit and said track unit and a second object path configured to transfer said substrate between said lithographic exposure unit and said position.

19. The lithographic system of claim 18, wherein said interface unit includes a closable opening through which said second object path extends.

20. The lithographic system of claim 17, further comprising a load lock unit arranged between said lithographic exposure unit and said interface unit.

21. The lithographic system of claim 17, wherein said interface unit includes at least one exchange station configured to transfer said substrate between said position and said interface unit and at least one processing station configured to process said substrate.

22. The lithographic system of claim 21, wherein said at least one processing station is a cleaning station, a pre-exposure station, or a post-exposure station.

23. The lithographic system of claim 21, wherein said interface unit further comprises at least one buffer station.