Arrangement for authentication of a person
First Claim
1. A fingerprint sensor arrangement comprising at least one driver electrode and at least one sensor electrode for a capacitive measurement, and an integrated signal processing circuit for the measurement of signals from the electrodes, and interconnecting wiring between the electrodes and the integrated circuit, characterized in that the at least one driver electrode, the at least one sensor electrode, said signal integrated circuit and said interconnecting wiring are embedded within an integrated module.
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Accused Products
Abstract
A capacitive fingerprint sensor is fabricated on a plastic substrate (363) with an embedded integrated circuit chip (380). The invention describes a way to create two or three dimensional forms for electrode structures (321, 322, 325, 365, 366) that can be used to optimize the performance of the sensor. When the three dimensional structure is designed to follow the shape of a finger, a very small pressure is required when sliding the finger along the sensor surface. This way the use of the sensor is ergonomic and the measurement is made very reliable. The inventive fabrication method describes the way, how to connect and embed an integrated circuit containing measurement electronics with a batch processed larger scale electrode configuration that is used for capturing the capacitive image of the fingerprint.
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Citations
44 Claims
- 1. A fingerprint sensor arrangement comprising at least one driver electrode and at least one sensor electrode for a capacitive measurement, and an integrated signal processing circuit for the measurement of signals from the electrodes, and interconnecting wiring between the electrodes and the integrated circuit, characterized in that the at least one driver electrode, the at least one sensor electrode, said signal integrated circuit and said interconnecting wiring are embedded within an integrated module.
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24. A method for producing a fingerprint sensor, characterized in that the method comprises the following steps:
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providing a signal processing integrated circuit, providing at least one driver electrode, providing at least one sensor electrode, encapsulating said integrated circuit, said at least one driver electrode and said at least one sensing electrode into an integrated module. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44)
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Specification