Module for an analysis device, applicator as an exchange part of the analysis device and analysis device associated therewith

• US 20050031490A1
• Filed: 03/08/2002
• Published: 02/10/2005
• Est. Priority Date: 03/09/2001
• Status: Abandoned Application

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Wossler, Manfred, Gumbrecht, Walter, Stanzel, Manfred, Zapf, Jorg
• Application Number:
  US10/471,167
• Publication Number:
  US 20050031490A1
• Time in Patent Office: Days
• US Class Current: 422/63
• CPC Class Codes: B01L 2200/027 for microfluidic devices
• CPC Class Codes: B01L 2300/0645 Electrodes
• CPC Class Codes: B01L 2300/1805 Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: G01N 27/128 Microapparatus
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1815 Shape

Abstract

An analysis device that may be used in biochemical analyses includes a module in a first housing, including a chip support, a sensor chip and electrical contacts between the chip and the chip support. The chip is encapsulated so that the electrical contacts are insulated and the sensitive surface of the sensor chip remains accessible to a fluid to be tested. The module and the first housing form an exchangeable applicator or chip card with mocrofluidic components or functions and is inserted into a second housing that has an evaluation unit for reading and analyzing measured data.

Claims

1-34. -34. (canceled)

35. A module for a decentralized biochemical analysis device, comprising:

a sensor chip having a sensitive area and electrical contacts; and

a carrier having contact zones associated with the electrical contacts of said sensor chip and an encapsulation with contact connection between the contact zones and the electrical contacts of said sensor chip to provide electrical access from outside said module, the encapsulation allowing access by a fluid to the sensitive area of said sensor chip.

36. The module as claimed in claim 35, wherein a ratio of height of the encapsulation above an upper edge of said sensor chip to a largest diameter of the sensitive area of said sensor chip is less than 1 to 5.

37. The module as claimed in claim 35, wherein the encapsulation of said sensor chip has a defined lateral extent to seal fluidic inflow and outflow.

38. The module as claimed in claim 35, wherein the encapsulation includes an elastic material, whereby the fluidic inflow and fluid outflow can be sealed without aid of further means.

39. The module as claimed in claim 35, wherein the electrical contacts of said sensor chip are bonding pads in corners of said sensor chip.

40. The module as claimed in claim 36, wherein the encapsulation has at least one of a substantially planar surface and a radially symmetrical surface.

41. The module as claimed in claim 40, wherein said module is a chip card.

42. The module as claimed in claim 35, wherein said carrier is a metallic carrier strip having a thickness of less than 100 μ

m and the contact zones are plastic-reinforced metal contacts.

43. The module as claimed in claim 42, wherein said sensor chip is mounted on the metallic carrier strip by wire bonding.

44. The module as claimed in claim 42, wherein said sensor chip is mounted on the carrier strip as a flip-chip.

45. An applicator as an exchangeable part of an analysis device, comprising:

a first housing, including

a module, including

a sensor chip having a sensitive area and electrical contacts; and

a carrier having contact zones associated with the electrical contacts of said sensor chip and an encapsulation with contact connection between the contact zones and the electrical contacts of said sensor chip to provide electrical access from outside said module, the encapsulation allowing access by a fluid to the sensitive area of said sensor chip; and

means for inflow and outflow of fluids to the sensitive area of said sensor chip.

46. The applicator as claimed in claim 45, wherein said first housing includes a gap filled with fluids during operation over the sensitive area of said sensor chip and a ratio of a height of the gap to a largest diameter of the sensitive area of said sensor chip is less than 1 to 5.

47. The applicator as claimed in claim 45, wherein said first housing includes a gap of less than 200 μ

m filled with fluids during functional operation over the sensitive area of said sensor chip.

48. The applicator as claimed in claim 45, wherein said module and said first housing are formed as a chip card with microfluidic components and functions integrated in therein.

49. The applicator as claimed in claim 45, wherein said sensor chip is provided with microfluidic components that feed and carry away at least one of liquids and gases respectively to and from the sensitive area of said sensor chip.

50. The applicator as claimed in claim 45, further comprising storage for at least one of solids, liquids and gases.

51. The applicator as claimed in claim 50, wherein said means for inflow and outflow of fluids include a microfluidic connection between said storage and the sensitive area of said sensor chip.

52. The applicator as claimed in claim 51, wherein said first housing is a card having at least one layer.

53. The applicator as claimed in claim 52, wherein said first housing is a card made of multiple materials.

54. The applicator as claimed in claim 52, wherein said first housing further includes an integrated voltage source, evaluation electronics and display.

55. An analysis device, comprising:

an applicator for decentralized measurements, including a first housing having an interior and a surface, including

a module, including

a sensor chip having a sensitive area and electrical contacts; and

a carrier having contact zones associated with the electrical contacts of said sensor chip and an encapsulation with contact connection between the contact zones and the electrical contacts of said sensor chip to provide electrical access from outside said module, the encapsulation allowing access by a fluid to the sensitive area of said sensor chip; and

means for inflow and outflow of at least one of liquids and gases to the sensitive area of said sensor chip via one of the interior and on the surface of said first housing; and

a second housing, including an evaluation unit, into which said applicator can be introduced, to perform analysis and read out measurement data.

56. The analysis device as claimed in claim 55,

wherein said applicator is a chip card;

and

wherein said second housing carries out the analysis and reads out the measurement data after said chip card is pushed into said second housing.

57. The analysis device as claimed in claim 56, wherein when said second housing carries out the analysis and reads out the measurement data, at least one of liquids and gases are transferred between said applicator and said second housing.

58. The analysis device as claimed in claim 55,

wherein said first housing includes clearances,

wherein the encapsulation includes an elastic material, and

wherein said second housing further comprises means for pressing the elastic encapsulation of said module against the clearances in said first housing.

59. The analysis device as claimed in claim 58, further comprising temperature control means for setting a defined temperature at the sensitive area of said sensor chip by cooling.

60. The analysis device as claimed in claim 59, wherein said temperature control means comprises a Peltier element in said second housing for the sensor chip.

61. The analysis device as claimed in claim 55, wherein the analysis device performs biochemical analytics.

62. The analysis device as claimed in claim 61, wherein the analysis device performs DNA analysis.

63. The analysis device as claimed in claim 61, wherein the analysis device uses a Polymer Chain Reaction and said analysis device speeds cooling during the Polymer Chain Reaction.

64. The analysis device as claimed in claim 55, wherein the analysis device performs food monitoring.

65. The analysis device as claimed in claim 55, wherein the analysis device performs environmental measuring.

66. The analysis device as claimed in claim 55, wherein the analysis device performs forensics analysis.

67. The analysis device as claimed in claim 55, wherein the analysis device performs medical diagnostics.

68. The analysis device as claimed in claim 65, wherein the analysis device performs blood gas/blood electrolyte analysis.