Method of forming light emitting devices with improved light extraction efficiency
First Claim
1. A method of bonding a transparent optical element to a light emitting device having a stack of layers including semiconductor layers comprising an active region, the method comprising:
- elevating a temperature of at least one of said optical element and said stack; and
applying a pressure to press said optical element and said stack together.
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Accused Products
Abstract
A method of bonding a transparent optical element to a light emitting device having a stack of layers including semiconductor layers comprising an active region is provided. The method includes elevating a temperature of the optical element and the stack and applying a pressure to press the optical element and the stack together. In one embodiment, the method also includes disposing a layer of a transparent bonding material between the stack and the optical element. The bonding method can be applied to a premade optical element or to a block of optical element material which is later formed or shaped into an optical element such as a lens or an optical concentrator.
79 Citations
37 Claims
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1. A method of bonding a transparent optical element to a light emitting device having a stack of layers including semiconductor layers comprising an active region, the method comprising:
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elevating a temperature of at least one of said optical element and said stack; and
applying a pressure to press said optical element and said stack together. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A method of creating a light emitting device comprising a stack of layers including semiconductor layers and an optical element, said method comprising:
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bonding a block of transparent optical element material onto said stack of layers including semiconductor layers; and
forming said block of transparent optical element material into said optical element. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37)
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Specification