Temperature regulated implant
First Claim
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1. An implantable medical device comprising:
- a biocompatible housing;
a power source mounted at least partially in said housing; and
a heat absorption medium occupying interstices in said housing and thermally coupled to at least said power source, wherein said heat absorption medium absorbs heat as it undergoes a state change which prevents said housing from substantially exceeding a predetermined device temperature threshold.
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Abstract
One disclosed embodiment of the present invention is a device comprising: a housing; electronic components contained within said housing; and a heat absorption medium sealed within said housing for regulating the temperature of said device, wherein said heat absorption medium undergoes a state change at a state change temperature of 36° Celsius or greater, and wherein said device is a medical implant.
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Citations
53 Claims
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1. An implantable medical device comprising:
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a biocompatible housing;
a power source mounted at least partially in said housing; and
a heat absorption medium occupying interstices in said housing and thermally coupled to at least said power source, wherein said heat absorption medium absorbs heat as it undergoes a state change which prevents said housing from substantially exceeding a predetermined device temperature threshold. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A device comprising:
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a housing;
electronic components contained at least partially within said housing; and
a heat absorption medium sealed within said housing for regulating the temperature of said device, wherein said heat absorption medium undergoes a state change at a state change temperature of approximately 36°
Celsius or greater. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44)
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45. An implantable hearing prosthesis comprising:
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a hermetically sealed, biocompatible housing having mounted therein an electronic assembly and a power source; and
a heat absorption medium disposed within said housing so as to be thermally coupled to at least said power supply, wherein said heat absorption medium absorbs heat as it undergoes a state change which prevents said housing from substantially exceeding a device temperature threshold. - View Dependent Claims (46, 47, 48, 49, 50, 51, 52, 53)
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Specification