Semiconductor light-emitting device and method of manufacturing the same and mounting plate
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Accused Products
Abstract
To offer a semiconductor light-emitting device capable of preventing a short circuit failure caused by adhesion of the solder, change of a beam shape, and decrease of a beam output. A semiconductor laser device 1 is manufactured by overlaying a laser chip having a p-side electrode and a n-side electrode in a crystalline substrate and a mounting plate having a first solder film and a second solder film in a supporting body. The laser chip has a level difference A such that the p-side electrode is projected beyond the n-side electrode. The mounting plate has a level difference B such that the first solder film is projected beyond the second solder film. The level difference B of the mounting plate is determined as higher than the level difference A of the laser chip. Therefore, when the mounting plate is overlaid to the laser chip, first, the n-side electrode contacts with the second solder film, and then, the p-side electrode contacts the first solder film. Accordingly, even if the solder is squeezed out in the vicinity of the n-side electrode, the solder is hardly squeezed out in the vicinity of the p-side electrode. The pn junction part is generally positioned in the vicinity of the p-side electrode, which controls the solder to adhesion to the pn junction part.
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Citations
17 Claims
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1-12. -12. (canceled)
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13. A semiconductor light-emitting device including a semiconductor chip having a first electrode film and a second electrode film in the same side of a base and a mounting plate having a first solder film and a second solder film in the same side of an insulating supporting body, wherein
a level difference is provided in a manner that a surface of the first electrode film is projected beyond a surface of the second electrode film therebetween in the semiconductor tip chip; -
a level difference is provided in a manner that a surface of the first solder film is projected beyond a surface of the second solder film therebetween in the mounting plate; and
a trench is formed in an opposite side of the second solder film sandwiching the first solder film in the insulating supporting body. - View Dependent Claims (14, 15)
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16. A mounting plate having a first solder film and a second solder film in the same side of an insulating supporting body, wherein:
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a level difference is provided in a manner that a surface of the first solder film is projected beyond a surface of the second solder film therebetween;
a trench is formed in an opposite side of the second solder film as sandwiching the first solder film in the insulating supporting body.
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17-39. -39. (canceled)
Specification