Compact imaging module

• US 20050035421A1
• Filed: 08/12/2004
• Published: 02/17/2005
• Est. Priority Date: 08/13/2003
• Status: Active Grant

• Current Assignee: Citizen Electronics Company Limited
• Original Assignee: Citizen Electronics Company Limited, Kawaguchiko Seimitsu Co., Ltd. (Citizen Electronics Company Limited)
• Inventors: Kayanuma, Yasuaki, Watanabe, Akihito
• Granted Patent: US 7,019,374 B2
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A compact imaging module comprising a case having a lens holding barrel portion, an optical system member housed in the lens holding barrel portion, a circuit substrate having a wiring pattern and disposed in an image side of the optical system member, a plurality of electrodes disposed on the circuit substrate, an imaging sensor mounted on a surface of the circuit substrate, an opposite side of the contained optical system member, and a frame member provided on a periphery of the circuit substrate, the case including a substrate mounting surface having a sensor window, the circuit substrate being attached to the substrate mounting surface of the case, the frame member including conductive electrodes to guide out a signal of the imaging sensor mounted on the circuit substrate.

Claims

1. A compact imaging module, comprising:

a case;

an optical system member attached to said case;

a circuit substrate having a wiring pattern and disposed adjacent to said optical system member in an image side of the optical system member and attached to the case;

a plurality of electrodes disposed on the circuit substrate; and

an imaging sensor mounted on the circuit substrate to connect the electrodes to guide out a signal of the imaging sensor.

3. The compact imaging module according to claim 1, wherein a plurality of electrodes comprise land electrodes and connecting electrodes.

4. The compact imaging module according to claim 1 or 2, wherein said circuit substrate comprises a flexible printed circuit.

5. The compact imaging module according to claim 1 or 2, wherein said conductive electrodes of the frame member comprise through-hole electrodes or side electrodes, which are formed on an outer peripheral portion of the frame member.

6. The compact imaging module according to claim 1, wherein a shielding film is provided on an inner peripheral portion of the frame member to shield the imaging sensor.

7. The compact imaging module according to claim 6, wherein said shielding film is a metallic film which is connected with a power terminal of the imaging sensor.

8. The compact imaging module according to claim 1 or 2, wherein said circuit substrate is adhered through an adhesive sheet to the substrate mounting surface of the case.

9. The compact imaging module according to claim 1 or 2, wherein said frame member has an outer end surface projecting outwardly from an outer end surface of the imaging sensor, and

one end of each conductive electrode is disposed in the outer end surface of the frame member.

10. The compact imaging module according to claim 9, wherein when the compact imaging module is mounted on a mother board, the conductive electrodes disposed on the outer end surface of the frame member are connected to a wiring pattern of the mother board.

11. An optical apparatus comprising the compact imaging module according to claim 1 or 2.

2. A compact imaging module, comprising:

a case having a lens holding barrel portion;

an optical system member contained in said lens holding barrel portion;

a circuit substrate having a wiring pattern disposed in an image side of the optical system member;

a plurality of electrodes disposed on the circuit substrate;

an imaging sensor mounted on a surface of the circuit substrate, an opposite side of the contained optical system member to connect the electrodes disposed on the circuit substrate; and

a frame member provided on a periphery of the circuit substrate,

said case including a substrate-mounting surface having a sensor window,

said circuit substrate being attached to the substrate-mounting surface of the case,

said frame member including conductive electrodes to guide out a signal of the imaging sensor mounted on the circuit substrate through the electrodes disposed on the circuit substrate.