Apparatus and method for force mounting semiconductor packages to printed circuit boards

• US 20050039330A1
• Filed: 09/30/2004
• Published: 02/24/2005
• Est. Priority Date: 08/02/2002
• Status: Active Grant

• Current Assignee: National Semiconductor Corporation (Texas Instruments, Inc.)
• Original Assignee: National Semiconductor Corporation (Texas Instruments, Inc.)
• Inventors: Mostafazadeh, Shahram, Smith, Joseph O.
• Granted Patent: US 7,171,745 B2
• Time in Patent Office: Days
• US Class Current: 29/832
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 2201/10234 Metallic balls
• CPC Class Codes: H05K 2201/10719 Land grid array [LGA]
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49208 by assembling plural parts
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/53183 : Multilead component

Abstract

An apparatus and method for force mounting semiconductor packages onto printed circuit boards without the use of solder. The apparatus includes a substrate, a first integrated circuit die mounted onto the substrate, a housing configured to house the first integrated circuit die mounted onto the substrate, and a force mechanism configured to force mount the housing including the integrated circuit die and substrate onto a printed circuit board. The method includes mounting a first integrated circuit die onto a first surface of a substrate, housing the first integrated circuit die mounted onto the substrate in a housing, and using a force mechanism to force mount the housing including the first integrated circuit die mounted on the substrate onto a printed circuit board. According to various embodiments, the force mechanism includes one of the following types of force mechanisms clamps, screws, bolts, adhesives, epoxy, or Instrument housings or heat stakes.

Claims

1. A method comprising:

mounting a first integrated circuit die onto a first surface of a substrate;

housing the first integrated circuit die mounted onto the substrate in a housing; and

using a force mechanism to force mount the housing including the first integrated circuit die mounted on the substrate onto a printed circuit board.

2. The method of claim 1, wherein the force mechanism includes one of the following types of force mechanisms:

clamps, screws, epoxy, adhesives, or Instrument housings, or heat stakes.

3. The method of claim 1, further comprising forming contacts on the substrate, the contacts being configured to provide electrical contacts between the substrate and the printed circuit board when the housing is force mounted onto the printed circuit board.

4. The method of claim 3, wherein the method of forming contacts further comprising forming wire ball bonds onto the substrate.

5. The method of claim 1, further comprising forming a first set of contact pads on the first surface of the substrate, a second set of contact pads on a second surface of the substrate, and vias through the substrate to electrically couple the first set of contact pads and the second set of contact pads respectively.

6. The method of claim 5, further comprising electrically coupling the first integrated circuit die to the first set of contacts on the first surface of the substrate.

7. The method of claim 1, further comprising mounting a second integrated circuit die onto the substrate.

8. The method of claim 7, wherein the second integrated circuit is mounted onto the first integrated circuit die within the housing.

9. The method of claim 8, wherein the second integrated circuit die is an imaging sensing chip and the first integrated circuit die is imaging processing chip.