Tilted cavity semiconductor optoelectronic device and method of making same

• US 20050040410A1
• Filed: 09/16/2004
• Published: 02/24/2005
• Est. Priority Date: 02/12/2002
• Status: Abandoned Application

• Current Assignee: Innolume GmbH
• Original Assignee: Nl-Nanosemiconductor GmbH
• Inventors: Shchukin, Vitaly, Ledentsov, Nikolai
• Application Number:
  US10/943,044
• Publication Number:
  US 20050040410A1
• Time in Patent Office: Days
• US Class Current: 257/79
• CPC Class Codes: H01L 33/105 with a resonant cavity structure
• CPC Class Codes: H01S 5/0028 Laser diodes used as detectors
• CPC Class Codes: H01S 5/0265 Intensity modulators intra-cavity modulators H01S5/0625
• CPC Class Codes: H01S 5/028 Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
• CPC Class Codes: H01S 5/06253 Pulse modulation
• CPC Class Codes: H01S 5/0654 Single longitudinal mode emission
• CPC Class Codes: H01S 5/1071 Ring-lasers
• CPC Class Codes: H01S 5/1085 Oblique facets
• CPC Class Codes: H01S 5/141 using a wavelength selective device, e.g. a grating or etalon H01S5/146 takes precedence
• CPC Class Codes: H01S 5/162 with window regions made by diffusion or disordening of the active layer
• CPC Class Codes: H01S 5/183 having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
• CPC Class Codes: H01S 5/2004 Confining in the direction perpendicular to the layer structure
• CPC Class Codes: H01S 5/2027 Reflecting region or layer, parallel to the active layer, e.g. to modify propagation of the mode in the laser or to influence transverse modes
• CPC Class Codes: H01S 5/204 Strongly index guided structures
• CPC Class Codes: H01S 5/2231 with inner confining structure only between the active layer and the upper electrode
• CPC Class Codes: H01S 5/50 Amplifier structures not provided for in groups H01S5/02 - H01S5/30

Abstract

A novel class of semiconductor light-emitting devices, or “tilted cavity light-emitting devices” is disclosed. The device includes at least one active element, generally placed within a cavity, with an active region generating an optical gain by injection of a current and two mirrors. The device generates optical modes that propagate in directions, which are tilted with respect to both the p-n junction plane and the direction normal to this plane. A light-emitting diode is also disclosed, where the cavity and the mirrors are designed such that transmission of generated optical power within a certain spectral range and within a certain interval of angles to the substrate is minimized. Transmission of optical power within a certain spectral range, which corresponds to the emission range of the light-emitting active medium and within a certain interval of angles out of the device, is optimized to achieve a required output power level.

Claims

1. A semiconductor wavelength-selective tilted cavity light-emitting diode comprising:

a) a substrate;

b) a top coating;

c) a cavity comprising a p-n junction element and located between the top coating and the substrate wherein the p-n junction element is an active element which generates light when a forward bias is applied; and

d) a bottom mirror located between the cavity and the substrate;

wherein a direction of propagation of light within the p-n junction element and a direction normal to a plane of the p-n junction form a tilt angle; and

wherein the cavity, the bottom mirror, and the top coating are designed such that a transmission of generated optical power within a spectral range and within an interval of tilt angles through the bottom mirror to the substrate is minimized, and the transmission of generated optical power through the top coating within the same or a broader spectral range and within the same interval of tilt angles is optimized to achieve a required output power level.

2. The light-emitting diode of claim 1, wherein the light-emitting diode operates as a superluminescent light-emitting diode.

3. The light-emitting diode of claim 2, wherein the top coating comprises a top multilayered structure.

4. The light-emitting diode of claim 3, wherein the top multilayered structure is a multilayered interference reflector.

5. The light-emitting diode of claim 2, wherein the bottom mirror comprises a bottom multilayered structure.

6. The light-emitting diode of claim 5, wherein the top coating comprises a top multilayered structure.

7. The light-emitting diode of claim 5, wherein the bottom mutlilayered structure is a multilayered interference reflector.

8. The light-emitting diode of claim 7, wherein the top mirror comprises a top multilayered structure.

9. The light-emitting diode of claim 8, wherein the top multilayered structure is a top multilayered interference reflector.

10. The light-emitting diode of claim 9, wherein the cavity further comprises an antiwaveguiding cavity, wherein an average refractive index of the antiwaveguiding cavity is lower than an average refractive index of the bottom multilayered interference reflector and lower than an average refractive index of the top multilayered interference reflector, where the average refractive index of each multilayered interference reflector is defined as a square root of a weighted average of a square of the refractive indices of the constituent layers.

11. The light-emitting diode of claim 10, wherein the cavity, the bottom multilayered interference reflector, and the top multilayered interference reflector are designed such that a confinement factor of one transverse optical mode within the active element exceeds a confinement factor of each other transverse optical mode within the active element by at least a factor of five.

12. The light-emitting diode of claim 11, wherein an emission of light occurs in a single transverse optical mode.

13. The light-emitting diode of claim 5, further comprising a rear facet obtained by cleavage or etching of the substrate, the bottom mirror, the cavity, and the top coating, wherein the rear facet is tilted with respect to a substrate surface at an angle not equal to 90°

.

14. The light-emitting diode of claim 5, wherein the top mirror comprises a top multilayered structure.

15. The light-emitting diode of claim 5, further comprising a front facet obtained by cleavage or etching of the substrate, the bottom mirror, the cavity, and the top coating, wherein the front facet is tilted with respect to a substrate surface at a first angle not equal to 90°

.

16. The light-emitting diode of claim 15, further comprising a rear facet obtained by cleavage or etching of the substrate, the bottom mirror, the cavity, and the top coating, wherein the rear facet is tilted with respect to a substrate surface at a second angle not equal to 90°

.

17. The light-emitting diode of claim 16, wherein a cross-section of the epitaxially grown structure has a shape of a trapezoid.

18. The light-emitting diode of claim 16, wherein a cross-section of the epitaxially grown structure has a shape of a parallelogram.

19. The light-emitting diode of claim 16, wherein the bottom mirror and the top coating are designed to reflect maximum optical power back to the cavity.

20. The light-emitting diode of claim 19, wherein the first angle and the second angle are chosen to provide a maximum output of optical power through the front facet.

21. The light-emitting diode of claim 1, wherein at least a portion of the diode is formed of a first material selected from the group consisting of:

a) a III-V semiconductor material; and

b) an alloy of at least two III-V semiconductor materials.

22. The light-emitting diode of claim 21, wherein the light-emitting diode operates as a superluminescent light-emitting diode.

23. The light-emitting diode of claim 22, wherein the bottom mirror comprises a bottom multilayered structure.

24. The light-emitting diode of claim 22, wherein the top coating comprises a top multilayered structure.

25. The light-emitting diode of claim 24, wherein the bottom mirror comprises a bottom multilayered structure.

26. The light-emitting diode of claim 21, wherein the first material is a binary compound comprising a first element and a second element;

wherein the first element is selected from the group consisting of;

i) Al;

ii) Ga; and

iii) In;

and the second element is selected from the group consisting of;

i) N;

ii) P;

iii) As; and

iv) Sb.

27. The light-emitting diode of claim 26, wherein the light-emitting diode operates as a superluminescent light-emitting diode.

28. The light-emitting diode of claim 21, wherein at least a portion of the diode is formed of a second material selected from the group consisting of:

a) AlN

b) GaN;

c) InN; and

d) an alloy of materials selected from the group consisting of AlN;

GaN; and

InN.

29. The light-emitting diode of claim 28, wherein the light-emitting diode operates as a superluminescent light-emitting diode.

30. The light-emitting diode of claim 21, wherein the bottom mirror comprises a bottom multilayered structure.

31. The light-emitting diode of claim 21, wherein the top coating comprises a top multilayered structure.

32. The light-emitting diode of claim 31, wherein the bottom mirror comprises a bottom multilayered structure.

33. The light-emitting diode of claim 31, further comprising a rear facet obtained by cleavage or etching of the substrate, the bottom mirror, the cavity, and the top coating, wherein the rear facet is tilted with respect to a substrate surface at an angle not equal to 90°

.

34. The light-emitting diode of claim 1, wherein the bottom mirror comprises a bottom multilayered structure.

35. The light-emitting diode of claim 33, wherein the top coating comprises a top multilayered structure.

36. The light-emitting diode of claim 34, wherein the top mirror comprises a top multilayered structure.

37. The light-emitting diode of claim 1, wherein the top coating comprises a top multilayered structure.

38. The light-emitting diode of claim 37, wherein the top multilayered structure is a top multilayered interference reflector.

39. The light-emitting diode of claim 34, wherein the bottom mutlilayered structure is a multilayered interference reflector.

40. The light-emitting diode of claim 39, wherein the top mirror comprises a top multilayered structure.

41. The light-emitting diode of claim 40, wherein the top multilayered structure is a top multilayered interference reflector.

42. The light-emitting diode of claim 41, wherein the cavity further comprises an antiwaveguiding cavity, wherein an average refractive index of the antiwaveguiding cavity is lower than an average refractive index of the bottom multilayered interference reflector and lower than an average refractive index of the top multilayered interference reflector, where the average refractive index of each multilayered interference reflector is defined as a square root of a weighted average of a square of the refractive indices of the constituent layers.

43. The light-emitting diode of claim 42, wherein the cavity, the bottom multilayered interference reflector, and the top multilayered interference reflector are designed such that a confinement factor of one transverse optical mode within the active element exceeds a confinement factor of each other transverse optical mode within the active element by at least a factor of five.

44. The light-emitting diode of claim 43, wherein an emission of light occurs in a single transverse optical mode.

45. The light-emitting diode of claim 1, further comprising a front facet obtained by cleavage or etching of the substrate, the bottom mirror, the cavity, and the top coating, wherein the front facet is tilted with respect to a substrate surface at a first angle not equal to 90°

.

46. The light-emitting diode of claim 45, further comprising a rear facet obtained by cleavage or etching of the substrate, the bottom mirror, the cavity, and the top coating, wherein the rear facet is tilted with respect to a substrate surface at a second angle not equal to 90°

.

47. The light-emitting diode of claim 46, wherein a cross-section of the epitaxially grown structure has a shape of a trapezoid.

48. The light-emitting diode of claim 46, wherein a cross-section of the epitaxially grown structure has a shape of a parallelogram.

49. The light-emitting diode of claim 46, wherein the bottom mirror and the top coating are designed to reflect maximum optical power back to the cavity.

50. The light-emitting diode of claim 49, wherein the first angle and the second angle are chosen to provide a maximum output of optical power through the front facet.

130. The light-emitting diode of claim 4, wherein the bottom mirror is a bottom multilayered structure.

131. The light-emitting diode of claim 38, wherein the bottom mirror is a bottom multilayered structure.

51. A light-emitting system comprising:

a) a phosphorous-containing medium;

b) an external mirror; and

c) a semiconductor tilted cavity light-emitting diode comprising;

i) a substrate;

ii) a top coating;

iii) a cavity comprising a p-n junction element and located between the top coating and the substrate wherein the p-n junction element is an active element which generates light when a forward bias is applied; and

iv) a bottom mirror located between the cavity and the substrate;

wherein a direction of propagation of light within the p-n junction element and a direction normal to the plane of the p-n junction form a tilt angle;

wherein the diode is designed to emit light in an ultraviolet spectral region;

wherein the phosphorous-containing medium, which is located between the diode and the external mirror, partially absorbs light in the ultraviolet spectral region, and emits visible light due to photoluminescence; and

wherein the external mirror is semi-transparent to visible light and is non-transparent to light in the ultraviolet spectral region.

52. The light-emitting system of claim 51, wherein the cavity, the bottom mirror, and the top coating are designed such that a transmission of generated optical power within a spectral range and within an interval of tilt angles through the bottom mirror to the substrate is minimized, and the transmission of generated optical power through the top coating within the same or a broader spectral range and within the same interval of tilt angles is optimized to achieve a required output power level.

53. The light-emitting system of claim 51, wherein the light-emitting diode operates as a superluminescent light-emitting diode.

54. The light-emitting system of claim 53, wherein the top coating comprises a top multilayered structure.

55. The light-emitting system of claim 53, wherein the bottom mirror comprises a bottom multilayered structure.

56. The light-emitting system of claim 53, wherein at least a portion of the superluminescent light-emitting diode is composed of a material selected from the group consisting of:

a) AlN;

b) GaN;

c) InN; and

d) an alloy of materials selected from the group consisting of AlN;

GaN; and

InN.

57. The light-emitting system of claim 51, wherein the top coating comprises a top multilayered structure.

58. The light-emitting system of claim 51, wherein the bottom mirror comprises a bottom multilayered structure.

59. The light-emitting system of claim 51, wherein at least a portion of the diode is composed of a material selected from the group consisting of:

a) AlN;

b) GaN;

c) InN; and

d) an alloy of materials selected from the group consisting of AlN;

GaN; and

InN.

60. A light-emitting system comprising:

a) an external mirror; and

b) a tilted cavity semiconductor laser comprising;

i) a substrate;

ii) a bottom mirror contiguous with the substrate wherein the bottom mirror is a multilayered interference reflector;

iii) a cavity comprising a p-n junction element and contiguous with the bottom mirror on a side opposite the substrate wherein the p-n junction element is an active element which generates light when a forward bias is applied; and

iv) a top mirror contiguous with the cavity from a side opposite to the bottom mirror wherein the top mirror is a multilayered interference reflector;

wherein a direction of propagation of light within the p-n junction element and a direction normal to the junction plane forms a tilt angle.

61. The light-emitting system of claim 60, wherein the cavity, the bottom mirror, and the top mirror are designed such that:

A) the tilt angle of the resonant tilted optical mode is smaller than an angle of total internal reflectance at a semiconductor/air interface;

B) the top mirror is partially etched to allow the output of generated laser light through the top mirror;

C) the external mirror is semi-transparent for generated laser light;

D) the external mirror is placed such that generated laser light coming out through the top mirror is partially reflected from the external mirror and comes back to the cavity thus providing an additional feedback for the generated laser light; and

E) the additional feedback provides additional stabilization of the wavelength of laser radiation.

62. A semiconductor tilted cavity laser comprising:

a) a substrate;

b) a top mirror;

c) a cavity comprising a p-n junction element and located between the top mirror and the substrate wherein the p-n junction element is an active element which generates light when a forward bias is applied;

d) a bottom mirror located between the cavity and the substrate;

e) a front facet obtained by cleavage or etching of the substrate, the bottom mirror, the cavity and the top mirror; and

f) a rear facet obtained by cleavage or etching of the substrate, the bottom mirror, the cavity, and the top mirror;

wherein the front facet or the rear facet is tilted with respect to a substrate surface at a tilt angle not equal to 90°

;

wherein a direction of propagation of light within the p-n junction element and the direction normal to the junction plane forms a tilt angle.

63. The tilted-cavity laser of claim 62, wherein the bottom mirror is a bottom multilayered interference reflector and the top mirror is a top multilayered interference reflector.

64. The tilted-cavity laser of claim 62, wherein the front facet is tilted with respect to the substrate surface at a first angle not equal to 90°

and the rear facet is tilted with respect to the substrate surface at a second angle not equal to 90°

.

65. The tilted-cavity laser of claim 64, wherein the cross-section of the epitaxially grown structure has a shape of a trapezoid.

66. The tilted-cavity laser of claim 64, wherein the cross-section of the epitaxially grown structure has a shape of a parallelogram.

67. The tilted-cavity laser of claim 64, wherein the cavity, the top mirror, the bottom mirror, and the tilt angle of the at least one facet are designed such that a positive feedback exists for one tilted optical mode, which propagates normally to the front facet and to the rear facet.

68. A mode-locked tilted cavity laser comprising:

a) a substrate;

b) a bottom multilayered interference reflector contiguous with the substrate;

c) a cavity comprising at least one p-n junction element and contiguous with the bottom multilayered interference reflector on a side opposite the substrate wherein the p-n junction element comprises at least a first element section and a second element section, wherein the first element section includes an active element which generates light when a forward bias is applied and the second element section includes an absorber which absorbs light when a reverse bias is applied;

d) a top multilayered interference reflector contiguous with the cavity on a side opposite the bottom multilayered interference reflector, wherein the top multilayered interference reflector is partially etched such that it comprises a first top reflector section and a second top reflector section;

e) a first p-contact mounted on the first top reflector section on a side opposite the cavity;

f) a second p-contact mounted on the second top reflector section on a side opposite the cavity; and

g) an n-contact mounted on the substrate on a side opposite the bottom multilayered interference reflector;

wherein a direction of propagation of light within the p-n junction element and the direction normal to the junction plane forms a tilt angle;

wherein a forward bias is applied between the first p-contact and the n-contact; and

wherein a reverse bias is applied between the second p-contact and the n-contact.

69. The mode-locked tilted cavity laser of claim 68, wherein the cavity, the bottom multilayered interference reflector, and the top multilayered interference reflector are designed such that a resonant optical mode, having a certain wavelength and propagating at a certain tilt angle, has a first absolute value of the electric field strength at the p-n junction element, and any optical modes at a different wavelength or propagating at a different angle have a second absolute value of the electric field strength at the p-n junction element, wherein the second absolute value is smaller than the first absolute value of the resonant optical mode.

70. The mode-locked tilted cavity laser of claim 68, wherein the cavity, the bottom multilayered interference reflector, and the top multilayered interference reflector are designed such that a resonant optical mode, having a certain wavelength and propagating at a certain tilt angle, has a first value of the leakage losses to the substrate and to at least one contact layer, and any optical modes at a different wavelength or propagating at a different angle have a second value of the leakage losses to the substrate and to at least one contact layer, wherein the second value is larger than the first value of the resonant optical mode.

71. A mode-locked tilted cavity laser comprising:

a) a substrate;

b) a first multilayered interference reflector contiguous with the substrate;

c) an absorbing element contiguous with the first multilayered interference reflector on a side opposite the substrate;

d) a second multilayer intereference reflector contiguous with the absorbing element on a side opposite the first multilayered interference reflector;

e) a cavity contiguous with the second multilayered interference reflector on a side opposite the absorbing element;

f) a third multilayered interference reflector contiguous with the cavity on a side opposite the second multilayered interference reflector;

g) a first contact contiguous with the substrate on a side opposite the first multilayered interference reflector;

h) a second contact mounted as an intracavity contact and contiguous with the absorbing element on a side opposite the first multilayered interference reflector;

i) a third contact placed with respect to the third multilayered interference reflector on a side opposite the cavity;

j) a first p-n junction element placed within the absorbing element;

k) at least one second p-n junction element placed within an element selected from the group consisting of;

i) the second multilayered interference reflector;

ii) the cavity;

iii) the third multilayered interference reflector; and

iv) any combination of i) through iii);

l) a first bias element between the first contact and the second contact providing a reverse bias at the first p-n junction element; and

m) a second bias element between the second contact and the third contact providing a forward bias at the first p-n junction element;

wherein a direction of propagation of light within the p-n junction element and the direction normal to the junction plane forms a tilt angle.

72. The tilted cavity laser of claim 71, wherein the cavity, the first multilayer intereference reflector, the second multilayered interference reflector, and the third multilayered interference reflector are optimized such that a resonant optical mode, having a certain wavelength and propagating at a certain tilt angle, has a first absolute value of the electric field strength at the second p-n junction element, and any optical modes at a different wavelength or propagating at a different angle have a second absolute value of the electric field strength at the second p-n junction element, wherein the second absolute value is smaller than the first absolute value of the resonant optical mode.

73. The tilted cavity laser of claim 71, wherein the cavity, the first multilayer intereference reflector, the second multilayered interference reflector, and the third multilayered interference reflector are optimized such that a resonant optical mode, having a certain wavelength and propagating at a certain tilt angle, has a first value of the leakage losses to the substrate and to at least one contact layer, and any optical modes at a different wavelength or propagating at a different angle have a second value of the leakage losses to the substrate and to at least one contact layer, wherein the second value is larger than the first value of the resonant optical mode.

74. The tilted cavity laser of claim 71, wherein the second multilayered interference reflector is optimized such that an electric field strength of the resonant optical mode within the absorbing element provides a bleaching effect.

75. A mode-locked tilted cavity laser comprising:

a) a substrate;

b) a bottom multilayered interference reflector contiguous with the substrate;

c) a cavity contiguous with the bottom multilayered interference reflector on a side opposite the substrate;

d) a top multilayered interference reflector contiguous with the cavity on a side opposite the bottom multilayered interference reflector;

e) an absorbing element contiguous with the top multilayered interference reflector on a side opposite the cavity;

f) a bottom contact contiguous with the substrate on a side opposite the bottom multilayered interference reflector;

g) a top contact contiguous with the absorbing element on a side opposite the top multilayered interference reflector;

h) at least one p-n junction element placed within an element selected from the group consisting of;

i) the bottom multilayered interference reflector;

ii) the cavity;

iii) a top multilayered interference reflector; and

iv) any combination of i) through iii) above;

i) a bias element between the bottom contact and the top contact that provides a forward bias to a p-n junction within the p-n junction element;

wherein the absorbing element comprises a high density of defects which enable non-radiative recombination of electron-hole pairs and is selected from the group consisting of;

i) a metamorphic layer obtained via lattice-mismatched growth and containing a high density of extended or point defects;

ii) a layer containing dislocated quantum dots;

iii) a layer containing dislocated quantum wires;

iv) a layer grown at a low temperature;

v) a layer containing metallic precipitates; and

vi) any combination of i) through v).

76. A mode-locked tilted cavity laser comprising:

a) a substrate;

b) a bottom multilayered interference reflector contiguous with the substrate;

c) a cavity comprising at least one p-n junction element and contiguous with the bottom multilayered interference reflector on a side opposite the substrate wherein the p-n junction element comprises;

i) a first element section including an active element which generates light when a forward bias is applied; and

ii) a second element section including an absorber which absorbs light when a reverse bias is applied;

d) a top multilayered interference reflector contiguous with the cavity on a side opposite the bottom multilayered interference reflector, wherein the top multilayered interference reflector is partially etched such that it comprises a first top reflector section and a second top reflector section;

wherein a direction of propagation of light within the p-n junction element and a direction normal to the junction plane forms a tilt angle;

e) a first p-contact mounted on the first top reflector section on a side opposite the cavity;

f) a second p-contact mounted on the second top reflector section on a side opposite the cavity; and

g) an n-contact mounted on the substrate on a side opposite the bottom multilayered interference reflector;

wherein a forward bias is applied between the first p-contact and the n-contact; and

wherein a reverse bias is applied between the second p-contact and the n-contact.

77. The mode-locked tilted cavity laser of claim 76, wherein the cavity, the bottom multilayered interference reflector, and the top multilayered interference reflector are designed such that a resonant optical mode, having a certain wavelength and propagating at a certain tilt angle, has a first value of the leakage losses out of the cavity into the substrate and to at least one contact layer, and any optical modes at a different wavelength or propagating at a different angle have a second value of the leakage losses into the substrate and to at least one contact layer, wherein the second value is larger than the first value for the resonant optical mode.

78. The mode-locked tilted cavity laser of claim 76, wherein the cavity, the bottom multilayered interference reflector, and the top multilayered interference reflector are designed such that a resonant optical mode, having a certain wavelength and propagating at a certain tilt angle, has a first absolute value of the electric field strength at the p-n junction element, and any optical modes at a different wavelength or propagating at a different angle have a second absolute value of the electric field strength at the p-n junction element, wherein the second value is smaller than the first value for the resonant optical mode.

79. A mode-locked tilted cavity laser comprising:

a) a substrate;

b) a first multilayered interference reflector contiguous with the substrate;

c) an absorbing element contiguous with the first multilayered interference reflector on a side opposite the substrate;

d) a second multilayer intereference reflector contiguous with the absorbing element on a side opposite the first multilayered interference reflector;

e) a cavity contiguous with the second multilayered interference reflector on a side opposite the absorbing element;

f) a third multilayered interference reflector contiguous with the cavity on a side opposite the second multilayered interference reflector;

g) a first contact contiguous with the substrate on a side opposite the first multilayered interference reflector;

h) a second contact mounted as an intracavity contact and contiguous with the absorbing element on a side opposite the first multilayered interference reflector;

i) a third contact placed with respect to the third multilayered interference reflector on a side opposite the cavity;

j) a first p-n junction element placed within the absorbing element;

k) a second p-n junction element placed within an element selected from the group consisting of;

i) the second multilayered interference reflector;

ii) the cavity;

iii) the third multilayered interference reflector; and

iv) any combination of i) through iii);

l) a first bias element between the first contact and the second contact, which provides a reverse bias at the first p-n junction element; and

m) a second bias element between the second contact and the third contact, which provides a forward bias at the first p-n junction element;

wherein a direction of propagation of light within the p-n junction element and the direction normal to the junction plane forms a tilt angle.

80. The mode-locked tilted cavity laser of claim 79, wherein the cavity, the first multilayer intereference reflector, the second multilayered interference reflector, and the third multilayered interference reflector are optimized such that a resonant optical mode, having a certain wavelength and propagating at a certain tilt angle, has a first value of the leakage losses out of the cavity into the substrate and to at least one contact layer, and any optical modes at a different wavelength or propagating at a different angle have a second value of the leakage losses to the substrate and to at least one contact layer, wherein the second value is larger than the first value for the resonant optical mode;

and

wherein the second multilayered interference reflector is optimized such that an electric field strength of the resonant optical mode within the absorbing element provides a bleaching effect.

81. The mode-locked tilted cavity laser of claim 79, wherein the cavity, the first multilayer intereference reflector, the second multilayered interference reflector, and the third multilayered interference reflector are optimized such that a resonant optical mode, having a certain wavelength and propagating at a certain tilt angle, has a first absolute value of the electric field strength in the second p-n junction element, and any optical modes at a different wavelength or propagating at a different angle have a second absolute value of the electric field strength in the second p-n junction element, wherein the second value is smaller than the first value for the resonant optical mode;

and

wherein the second multilayered interference reflector is optimized such that an electric field strength of the resonant optical mode within the absorbing element provides a bleaching effect.

82. A semiconductor tilted cavity optoelectronic device comprising:

a) a substrate;

b) a cavity;

c) at least one multilayered interference reflector contiguous with the cavity; and

d) at least one p-n junction element wherein a direction of propagation of light within the p-n junction element and a direction normal to the junction plane forms a tilt angle;

wherein the cavity and the multilayered interference reflector are designed such that a reflectivity dip of the cavity and a reflectivity maximum of the multilayered interference reflector coincide at an optimum tilt angle, and draw apart as the angle changes.

83. The device of claim 82, wherein leaky losses of the tilted optical mode to the substrate and to at least one contact layer are at a minimum at a certain wavelength of light and increase away from this wavelength thus providing wavelength-selective leaky losses of the tilted optical modes such that the semiconductor tilted cavity optoelectronic device is wavelength-stabilized.

84. The device of claim 82, wherein:

an averaged refractive index of the high-finesse cavity and an averaged refractive index of the multilayered interference reflector differ by at least 2%;

the averaged refractive index of the cavity is defined as a square root of a weighted average of a square of the refractive indices of the layers of the cavity; and

the averaged refractive index of the multilayered interference reflector is defined as a square root of a weighted average of a square of the refractive indices of the layers of the multilayered interference reflector.

85. The device of claim 82, wherein a group velocity of propagation of the resonant optical mode in a plane of the p-n junction is slower than a group velocity of the optical mode in a conventional edge-emitting laser formed of the same materials.

86. The device of claim 85, wherein an effective tilt angle of propagation of a resonant tilted optical mode is larger than an angle of a total internal reflection at a semiconductor/air interface by less than 2 degrees.

87. The device of claim 82, wherein the substrate is contiguous with the multilayered interference reflector on a side opposite the cavity.

88. The device of claim 82, wherein the substrate is contiguous with the cavity on a side opposite the multilayered interference reflector.

89. The device of claim 82, wherein a dielectric layer is deposited on top of a structure of the semiconductor to provide a fine tuning of the resonant wavelength.

90. The device of claim 82, further comprising at least one bias element, which provides a bias to the p-n junction element.

91. The device of claim 90, wherein the device is selected from the group consisting of:

a) a diode laser, wherein the p-n junction element comprises a p-n junction, where light is generated when a forward bias is applied;

b) a resonant cavity photodetector, wherein the p-n junction element comprises a p-n junction, to which a reverse bias is applied, and a photocurrent is generated when light is absorbed; and

c) a resonant optical amplifier, wherein the p-n junction element comprises a p-n junction, such that light is amplified when a forward bias is applied.

92. The device of claim 91, wherein the device is a resonant cavity photodetector, further comprising a front facet obtained by cleavage or etching of the substrate, the cavity and at least one multilayered interference reflector, wherein the front facet forms a surface tilted with respect to a plane of the p-n junction at an angle not equal to 90°

, and wherein the cavity and the multilayered interference reflector are designed such that light coming in through the front facet is resonantly coupled with a tilted optical mode and is absorbed at the p-n junction to generate a photocurrent.

93. The device of claim 91, further comprising a front facet obtained by cleavage or etching of the substrate, the cavity, and at least one multilayered interference reflector, and a rear facet obtained by cleavage or etching of the substrate, the cavity, and at least one multilayered interference reflector;

wherein the front facet is covered by an antireflecting coating and the rear facet is covered by a highly reflecting coating;

wherein the cavity, the multilayered interference reflector, and the antireflecting coating are designed such that light in a resonant optical mode which impinges at the front facet within the cavity and the multilayered interference reflector undergoes total internal reflection;

wherein light in a resonant optical mode, which has a minimum leakage loss to the substrate compared to optical modes at other wavelengths, has a leaky component, which leaks to the substrate and comes out through the front facet; and

wherein a major part of the optical power coming out of the laser comes out through the leaky component of the resonant optical mode.

94. The device of claim 93, wherein the major part comprises more than 90% of the optical power.

95. The device of claim 93, wherein the front facet is etched to form a surface tilted with respect to a plane of the p-n junction at an angle not equal to 90°

, and wherein a direction of the propagation of generated laser light coming out of the device in a leaky mode through the front facet is controlled by a tilt angle of the front facet.

96. The device of claim 82, wherein the p-n junction element is located within the cavity.

97. The device of claim 82, wherein the p-n junction element is located within the multilayered interference reflector.

98. The device of claim 82, wherein at least a portion of the device is composed of a first material selected from the group consisting of:

a) a III-V semiconductor material and

b) an alloy of at least two III-V semiconductor materials.

99. The device of claim 98, wherein the first material is a binary compound comprising a first element and a second element;

wherein the first element is selected from the group consisting of;

i) Al;

ii) Ga; and

iii) In; and

wherein the second element is selected from the group consisting of;

i) N;

ii) P;

iii) As; and

iv) Sb.

100. The device of claim 98, wherein at least a portion of the device is composed of a second material selected from the group consisting of:

a) AlN;

b) GaN;

c) InN; and

d) an alloy of materials selected from the group consisting of AlN;

GaN; and

InN.

101. The device of claim 87, further comprising an n-contact contiguous with the substrate on a side opposite the multilayered interference reflector.

102. The device of claim 101, further comprising a p-contact contiguous with the cavity on a side opposite the multilayered interference reflector.

103. The device of claim 101, wherein the n-contact is made intentionally rough to enhance a scattering and absorption of light in all optical modes at the n-contact, such that a reflection of a leaky component of the optical mode back to the cavity is suppressed.

104. The device of claim 101, wherein the n-contact is highly reflecting such that the optical modes leaking into the substrate and reaching the n-contact are partially reflected back, which results in an additional modulation of a leaky loss as a function of the wavelength of the optical mode and thus enhances a wavelength selectivity of the tilted cavity optoelectronic device.

105. The device of claim 88, further comprising an n-contact contiguous with the substrate on a side opposite the cavity.

106. The device of claim 105, further comprising a p-contact contiguous with the multilayered interference reflector on a side opposite the cavity.

107. The device of claim 105, wherein the n-contact is intentionally rough to enhance a scattering and absorption of the light in all optical modes at the n-contact, such that a reflection of a leaky component of the optical mode back to the cavity is suppressed.

108. The device of claim 105, wherein the n-contact is highly reflecting such that the optical modes leaking into the substrate and reaching the n-contact are partially reflected back, which results in an additional modulation of a leaky loss as a function of the wavelength of the optical mode and thus enhances a wavelength selectivity of the tilted cavity optoelectronic device.

109. The device of claim 82, wherein the at least one multilayered interference reflector comprises a first multilayered interference reflector and a second multilayered interference reflector.

110. The device of claim 109, wherein the cavity is sandwiched between the first multilayered interference reflector and the second multilayered interference reflector and wherein the substrate is contiguous with the first multilayered interference reflector on a side opposite the cavity.

111. The device of claim 110 further comprising:

a) an n-contact contiguous with the substrate on a side opposite the first multilayered interference reflector; and

b) a p-contact contiguous with the second multilayered interference reflector on a side opposite the cavity.

112. The device of claim 111, wherein the device is a tilted cavity resonant optical amplifier, further comprising two trenches etched in the second multilayered interference reflector;

wherein incoming light comes in through the first trench;

wherein the cavity, the first multilayered interference reflector, and the second multilayered interference reflector are designed such that leaky losses of the tilted optical mode to the substrate and to at least one contact layer are at a minimum at a certain wavelength of light and increase away from this wavelength thus providing wavelength-selective leaky losses of the tilted optical modes such that the tilted cavity resonant optical amplifier is wavelength-stabilized;

wherein incoming light is coupled with the resonant tilted optical mode;

wherein amplified light in the resonant tilted optical mode comes out through the second trench.

113. The device of claim 112, wherein an effective tilt angle of the propagation of the resonant tilted optical mode with respect to the direction normal to the p-n junction plane is less than an angle of the total internal reflection at a semiconductor-air interface.

114. The device of claim 111, wherein the p-n junction element is located within the cavity.

115. The device of claim 111, wherein the p-n junction element is located within the first multilayered interference reflector.

116. The device of claim 111, wherein the p-n junction element is located within the second multilayered interference reflector.

117. The device of claim 82, wherein the multilayered interference reflector further comprises a periodic structure.

118. The device of claim 117, wherein a period of the periodic structure comprises a first layer having a first thickness and a first refractive index and a second layer having a second thickness and a second refractive index.

119. The device of claim 118, wherein a period of the periodic structure further comprises:

a) a third layer having a third thickness and a third refractive index; and

b) a fourth layer having a fourth thickness and a fourth refractive index;

wherein the first refractive index is lower than the second refractive index and the fourth refractive index;

wherein the third refractive index is lower than the second refractive index and the fourth refractive index;

wherein the layers in a period of the periodic structure are placed in a sequence comprising the first layer followed by the second layer followed by the third layer followed by the fourth layer;

wherein the second layer, sandwiched between the first layer and the third layer, forms a first effective high-finesse cavity within the multilayered interference reflector;

wherein the fourth layer, sandwiched between the third layer and a first layer of a neighboring period, forms a second effective high-finesse cavity within the multilayered interference reflector; and

wherein a thickness and a refractive index of each layer, from the first layer through the fourth layer, are selected such that a spectral position of a dip of the first effective high-finesse cavity within the multilayered interference reflector, defined in a reflectivity spectrum of light defined at an optimum tilt angle, is different from a spectral position of a dip of the second effective high-finesse cavity within the multilayered interference reflector, defined in a reflectivity spectrum of light defined at an optimum tilt angle.

120. The device of claim 82, wherein the multilayered interference reflector further comprises:

a sequence of elements, wherein each element comprises at least one first layer having a first refractive index and at least one second layer having a second refractive index wherein the second refractive index is larger than the first refractive index; and

a layered structure comprising at least one third layer in at least one of the elements, which has a smaller thickness than any other layer of the multilayered interference reflector having the same refractive index as the third layer.

121. The device of claim 120, wherein the layered structure comprises a single third layer.

122. The device of claim 121, wherein the third layer has the second refractive index, and is the layer most remote from the cavity.

123. The device of claim 121, wherein the third layer has the first refractive index and is the layer closest to the cavity.

124. The device of claim 120, wherein the layered structure comprises two third layers.

125. The device of claim 124, wherein the first third layer is the most remote layer from the high-finesse cavity and the second third layer is the closest layer to the high-finesse cavity.

126. The device of claim 125, wherein first third layer comprises the second refractive index, and the second third layer comprises the first refractive index.

127. The device of claim 120, wherein the thickness of the third layer is smaller by a factor ranging from 0.3 to 0.8.

128. A method of fine tuning a resonant wavelength of a semiconductor tilted cavity optoelectronic device comprising a substrate, a cavity, at least one multilayered interference reflector contiguous with the cavity, and at least one p-n junction element wherein a direction of propagation of light within the p-n junction element and a direction normal to the junction plane forms a tilt angle, wherein the cavity and the multilayered interference reflector are designed such that a reflectivity dip of the cavity and a reflectivity maximum of the multilayered interference reflector coincide at an optimum tilt angle, and draw apart as the angle changes, and wherein a design is optimized such that the leaky losses of the tilted optical mode to the substrate and at least one of the contact layers is at a minimum at a certain wavelength of light and increases away from this wavelength thus providing wavelength-selective leaky losses of the tilted optical modes such that the semiconductor tilted cavity optoelectronic device is wavelength-stabilized, the method comprising the steps of:

a) epitaxially growing an epitaxial structure;

b) fabricating the tilted cavity optoelectronic device;

c) measuring the resonant wavelength of the fabricated optoelectronic device;

d) calculating a necessary thickness of an additional dielectric layer based on the measured resonant wavelength and on a required resonant wavelength; and

e) depositing the dielectric layer of the thickness calculated in step d) on top of the optoelectronic device.

129. A semiconductor tilted cavity laser comprising:

a) a substrate;

b) a top mirror;

c) a cavity comprising a p-n junction element and located between the top mirror and the substrate wherein the p-n junction element is an active element which generates light when a forward bias is applied;

d) a bottom mirror located between the cavity and the substrate;

e) a front facet formed by cleavage or etching the substrate, the bottom mirror, the cavity, and the top mirror;

f) a rear facet formed by cleavage or etching the substrate, the bottom mirror, the cavity, and the top mirror; and

g) a top contact, wherein a direction of a stripe forming the top contact is tilted in a lateral plane and is rotated such that an angle between the stripe and the facets is different than 90 degrees;

wherein a direction of propagation of light within the p-n junction element and the direction normal to the junction plane forms a tilt angle in a a vertical plane; and

wherein feedback exists only for an optical mode which is additionally tilted in the lateral plane with respect to the direction of the stripe.