Circuit device

• US 20050040512A1
• Filed: 07/26/2004
• Published: 02/24/2005
• Est. Priority Date: 08/20/2003
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Kanto Sanyo Semiconductors Company Limited (Panasonic Holdings Corporation), Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Kitazawa, Takashi, Tsubonoya, Makoto, Shibusawa, Katsuhiko
• Granted Patent: US 7,332,803 B2
• Time in Patent Office: Days
• US Class Current: 257/692
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 23/49589 Capacitor integral with or on the leadframe
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires

Abstract

A circuit device is provided comprising leads and electrical circuitry. The circuit device has a first semiconductor element, a second semiconductor element, first leads electrically connected to the first semiconductor element or the second semiconductor element via fine metal wires and having an end thereof extending outwardly, second leads electrically connected via metal wires to both the first semiconductor element and the second semiconductor element to thus electrically connect the first and second semiconductor elements.

Claims

1. A circuit device having:

a plurality of semiconductor elements;

first leads connected to bonding pads of the semiconductor elements and forming external terminals by extending outside of a package; and

second leads interconnecting the semiconductor elements inside the package.

6. The circuit device of claim 1 or claim 2, wherein the second leads extend parallel with the direction of alignment of the first semiconductor element and second semiconductor element.

8. The circuit device of claim 1, wherein the second leads have an end thereof extending outside of the package.

9. The circuit device of claim 1, wherein the second leads have an end thereof housed inside the package.

2. A circuit device having:

a first semiconductor element and a second semiconductor element;

first leads electrically connected to the first semiconductor element or to the second semiconductor element via fine metal wires and having an end thereof extending outwardly;

second leads electrically connected to both the first semiconductor element and the second semiconductor element via fine metal wires for electrically connecting the first semiconductor element and the second semiconductor element.

3. The circuit device of claim 2, wherein the fine metal wires are connected to the second leads by causing them to jump over an upper portion of at least one of the first leads or the second leads.

4. The circuit device of claim 2, wherein prominent portions projecting upwardly from the second leads at locations where the second leads are connected to the fine metal wires.

5. The circuit device of claim 4, wherein the prominent portion comprises an inclined portion extending obliquely upward from the second leads and a planar portion extending from the inclined portion.

7. The circuit device of claim 2, wherein the second leads at locations where second leads are connected to the fine metal wires are formed to be wider than at other locations.

10. A circuit device having:

first leads;

second leads extending in the vicinity of one of the first leads and comprising a first prominent portion projecting upwardly;

third leads extending in the vicinity of another one of the first leads and comprising a second prominent portion projecting upwardly; and

a chip element attached to the first prominent portion and to the second prominent portion via brazing material so as to jump over the first leads.

11. The circuit device of claim 10, wherein the first prominent portion and the second prominent portion comprise an inclined portion extending obliquely upward from the second leads and third leads and a planar portion extending from the inclined portion.

12. The circuit device of claim 10, wherein the first prominent portion and the second prominent portion are formed to be wider than leads at other locations.

13. A circuit device having:

a first circuit element;

first leads electrically connected to the first circuit element via first fine metal wires and having an end thereof extending outwardly;

second leads connected to the first leads via second fine metal wires;

a second circuit element electrically connected to the second leads.

14. The circuit device of claim 13, wherein the first fine metal wires or the second fine metal wires jump over an upper portion of at least one of the first leads or second leads.

15. The circuit device of claim 13, wherein prominent portions projecting upward are provided in the first leads or second leads at locations where the first fine metal wires or the second fine metal wires are connected.

16. The circuit device of claim 15, wherein the prominent portion includes an inclined portion extending obliquely upward from the second leads and a planar portion extending from the inclined portion.

17. The circuit device of claim 13, wherein the first leads or the second leads at locations where the first fine metal wires or the second metal wires are connected are formed to be wider than at other locations.

18. A circuit device having:

an island, first leads having external leads formed by providing an end thereof in a periphery of the island via inner leads and projecting another end thereof from a sealing resin and a semiconductor element disposed on the island comprising;

wiring leads extending from one region on one side of a package formed of the sealing resin inside a package and from the inside of the package to another region on the one side of the package, wherein

the semiconductor element is sealed inside the package and is electrically connected to a separate circuit element via the wiring leads.

19. The circuit device of claim 18, wherein the separate circuit element is a semiconductor element or a passive element.

20. The circuit device of claim 18, wherein a plurality of semiconductor chips are stacked on the island.

21. A circuit device having a plurality of islands, first leads having external leads formed by providing an end thereof in a periphery of the plurality of islands via inner leads and projecting another end thereof from a sealing resin and a plurality of semiconductor elements disposed on the plurality of islands respectively, comprising:

wiring leads extending from one region on one side of a package formed of the sealing resin to a vicinity of the plurality of islands and from the vicinity of the plurality of islands to another region on the one side of the package, wherein

the plurality of semiconductor elements are sealed inside the package and are electrically interconnected via the wiring leads.