Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
First Claim
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1. A semiconductor device comprising:
- a substrate in which penetrating holes are formed;
a semiconductor chip having electrodes;
a conductive member adhered on one side of said substrate by an adhesive material over a particular region of said one side including said penetrating holes, and electrically connected to said electrodes of said semiconductor chip on the side opposite to the surface of being adhered by said adhesive; and
external electrodes which are provided through said penetrating holes, electrically connected to said conductive member, and extending as far as outside of the other side of said substrate;
wherein a part of said adhesive material is interposed between internal wall surfaces forming said penetrating holes and said external electrodes within said penetrating holes.
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Abstract
The semiconductor device comprises an insulating film in which penetrating holes are formed, a semiconductor chip having electrodes, a wiring pattern adhered by an adhesive over a region including penetrating holes on one side of the insulating film and electrically connected to the electrodes of the semiconductor chip, and external electrodes provided on the wiring pattern through the penetrating holes and projecting from the surface opposite to the surface of the substrate on which the wiring pattern is formed. Part of the adhesive is drawn in to be interposed between the penetrating holes and external electrodes.
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Citations
1 Claim
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1. A semiconductor device comprising:
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a substrate in which penetrating holes are formed;
a semiconductor chip having electrodes;
a conductive member adhered on one side of said substrate by an adhesive material over a particular region of said one side including said penetrating holes, and electrically connected to said electrodes of said semiconductor chip on the side opposite to the surface of being adhered by said adhesive; and
external electrodes which are provided through said penetrating holes, electrically connected to said conductive member, and extending as far as outside of the other side of said substrate;
wherein a part of said adhesive material is interposed between internal wall surfaces forming said penetrating holes and said external electrodes within said penetrating holes.
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Specification