Sealing material tablet method of manufacturing the tablet and electronic component device

• US 20050040561A1
• Filed: 10/24/2002
• Published: 02/24/2005
• Est. Priority Date: 10/30/2001
• Status: Active Grant

• Current Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Original Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Inventors: Terada, Hiroshi, Kubo, Katsumi, Ono, Akio, Masubuchi, Hiroshi, Inagawa, Takashi, Yamada, Tateo
• Granted Patent: US 7,208,113 B2
• Time in Patent Office: Days
• US Class Current: 264/300
• CPC Class Codes: B29B 11/12 Compression moulding
• CPC Class Codes: B29C 33/58 Applying the releasing agents
• CPC Class Codes: B29C 33/64 Silicone
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/2991 Coated
• CPC Class Codes: Y10T 428/2998 including synthetic resin or polymer

Abstract

To provide a method of producing an encapsulating molding material tablet by which adhesion of an encapsulating molding material to the punch surface of a tablet forming machine can be reduced, an encapsulating molding material tablet produced by this method, and an electronic part apparatus equipped with an element encapsulated using this encapsulating molding material tablet. A method of producing an encapsulating molding material tablet in which a release agent dissolved in a solvent is fed to the punch surface of a tablet forming machine to form a release agent layer having a thickness of over 0.001 μm and less than 0.07 μm on the above-mentioned punch surface, then, an encapsulating molding material is fed to the above-mentioned tablet forming machine for molding the material, an encapsulating molding material tablet produced by this method or having a contact angle ratio of 1.15 or more and less than 1.35, and an electron part apparatus equipped with an element encapsulated using this encapsulating molding material tablet.

Claims

1. A method of producing an encapsulating molding material tablet comprising:

feeding an encapsulating molding material to a forming metal die and compression-forming the material by upper and lower punches,

wherein a release agent layer having a thickness greater than 0.001 μ

m and less than 0.07 μ

m is provided on a contact surface of at least one of the upper and lower punches with an encapsulating molding material, for compression forming.

2. The method of producing an encapsulating molding material tablet according to claim 1, wherein the release agent contains at least one of fluorine-based release agents and silicone-based release agents.

3. The method of producing an encapsulating molding material tablet according to claim 2, wherein the fluorine-based release agent is at least one of perfluoroalkyl-containing polymers and polytetrafluoroethylene.

4. The method of producing an encapsulating molding material tablet according to claim 2, wherein the silicone-based release agent is carboxyl group-modified dimethylpolysiloxane.

5. The method of producing an encapsulating molding material tablet according to claim 1, wherein a release agent dissolved in a solvent is fed to the contact surface of the upper and lower punches with an encapsulating molding material, to provide a release agent layer.

6. The method of producing an encapsulating molding material tablet according to claim 5, wherein the solvent has no flammability.

7. An encapsulating molding material tablet produced by the production method according to claim 1.

9. An electronic part apparatus equipped with an element encapsulated using the encapsulating molding material tablet according to claim 7.

10. The method of producing an encapsulating molding material tablet according to claim 1, wherein the encapsulating molding material tablet has a contact angle ratio of greater than 1.15 and less than 1.35.

11. The encapsulating molding material tablet according to claim 7, wherein the contact angle ratio is greater than 1.15 and less than 1.35.

12. The encapsulating molding material tablet according to claim 7, comprising:

(A) a thermosetting resin, (B) a hardener and (C) an inorganic filler.

14. The method of producing an encapsulating molding material tablet according to claim 2, wherein a release agent dissolved in a solvent is fed to the contact surface of the upper and lower punches with an encapsulating molding material, to provide a release agent layer.

15. The method of producing an encapsulating molding material tablet according to claim 14, wherein the solvent has no flammability.

16. An encapsulating molding material tablet produced by the production method according to claim 14.

17. An encapsulating molding material tablet produced by the production method according to claim 5.

18. An encapsulating molding material tablet produced by the production method according to claim 2.

8. An encapsulating molding material tablet having a contact angle ratio of at least 1.15 and less than 1.35.

13. The encapsulating molding material tablet according to claim 8, comprising:

(A) a thermosetting resin, (B) a hardener and (C) an inorganic filler.

19. An electronic part apparatus equipped with an element encapsulated using the encapsulating molding material tablet according to claim 8.