System for evaluating probing networks

• US 20050040837A1
• Filed: 09/28/2004
• Published: 02/24/2005
• Est. Priority Date: 04/14/1995
• Status: Active Grant

• Current Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Gleason, K. Reed, Strid, Eric W., Schappacher, Jerry B., Carlton, Dale E.
• Granted Patent: US 6,987,398 B2
• Time in Patent Office: Days
• US Class Current: 324/754.30
• CPC Class Codes: B82Y 15/00 Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
• CPC Class Codes: G01R 1/06705 Apparatus for holding or moving single probes for moving multiple probe heads or ICs under test G01R31/2886
• CPC Class Codes: G01R 1/06772 High frequency probes
• CPC Class Codes: G01R 1/073 Multiple probes
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 35/00 Testing or calibrating of apparatus covered by the other groups of this subclass
• CPC Class Codes: G01R 35/005 Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references G01R33/0035, G01R35/002 take precedence

Abstract

An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area.

Claims

1. An assembly for use in evaluating signal conditions in a probe measurement network, said probe measurement network being of the type having spaced-apart first, second, and third device-probing ends, said assembly comprising:

(a) a base having an upper face;

(b) respective first, second, and third conductive planar probing areas located on said upper face in spaced-apart relation to each other and arranged so that said first, second, and third-device probing ends can be simultaneously placed on said first, second, and third conductive planar probing areas, respectively;

(c) a reference junction; and

(d) a high-frequency transmission structure at least partially embedded in said base and connecting said first, second, and third conductive planar probing areas to said reference junction such that for each position that said device-probing ends can occupy while remaining on the corresponding areas, a high-frequency transmission line is provided by said transmission structure between said device-probing ends and said reference junction.

2. The assembly of claim 1 wherein said first, second, and third conductive planar probing areas are in mutually coplanar relation to each other.

3. The assembly of claim 1 wherein said base includes at least one dielectric area and said first, second, and third conductive planar probing areas are insulated from each other by said at least one dielectric area.

4. The assembly of claim 1 wherein said first conductive planar probing area is generally U-shaped.

5. The assembly of claim 4 wherein said second conductive planar probing area is generally U-shaped.

6. The assembly of claim 5 wherein said first and second conductive planar probing areas are arranged such that they are substantially mirror images of each other.

7. The assembly of claim 1 further including at least one high-frequency adapter provided adjacent said reference junction, said adapter enabling detachable connection of a reference channel to said reference junction.

8. The assembly of claim 1 wherein said third conductive planar probing area forms surrounds said first conductive planar probing area.

9. The assembly of claim 1 in combination with a support for supporting a device-under-test and further in combination with a positioning mechanism that enables said device-probing ends to be shifted back and forth between a first probing position on the first and second conductive probing areas and a second probing position on said device-under-test free of any requirement for removal of said device-under-test from said support.

10. The assembly of claim 9 wherein said support defines an imaginary reference plane, and further including an adjustment mechanism enabling adjustable positioning of said base relative to said support so that said probing areas extend in adjustable parallel relationship to said imaginary reference plane.

11. The assembly of claim 9 wherein said base is mounted in adjoining relationship to said support.