Keypad assembly

• US 20050042012A1
• Filed: 09/17/2004
• Published: 02/24/2005
• Est. Priority Date: 09/19/2002
• Status: Active Grant

• Current Assignee: Siemens AG
• Original Assignee: Siemens Information And Communication Networks, Inc.
• Inventors: Weselake, Kenneth, Ward, Isaac
• Granted Patent: US 7,106,222 B2
• Time in Patent Office: Days
• US Class Current: 400/481
• CPC Class Codes: B29C 49/00 Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
• CPC Class Codes: B29C 51/00 Shaping by thermoforming , i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor blow moulding of tubular preforms B29C49/00, deforming of tubular or hollow preforms B29C67/0014
• CPC Class Codes: B29L 2031/3431 Telephones, Earphones
• CPC Class Codes: G06F 3/0202 Constructional details or processes of manufacture of the input device
• CPC Class Codes: G06F 3/04886 by partitioning the display area of the touch-screen or the surface of the digitising tablet into independently controllable areas, e.g. virtual keyboards or menus
• CPC Class Codes: H01H 13/702 with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
• CPC Class Codes: H01H 2201/02 Piezo element
• CPC Class Codes: H01H 2209/014 composed of different layers; Lubricant in between
• CPC Class Codes: H01H 2209/016 Protection layer, e.g. for legend, anti-scratch
• CPC Class Codes: H01H 2217/024 Profile on actuator
• CPC Class Codes: H01H 2219/02 programmable
• CPC Class Codes: H01H 2221/002 integral with membrane
• CPC Class Codes: H01H 2221/09 Flexible integral part of housing
• CPC Class Codes: H01H 2227/034 Regulation of operating force
• CPC Class Codes: H03K 17/9643 using a plurality of detectors, e.g. keyboard
• CPC Class Codes: H04M 1/23 Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof by improving visibility H04M1/22
• CPC Class Codes: H04M 1/72403 with means for local support of applications that increase the functionality
• CPC Class Codes: H04M 1/72427 for supporting games or graphical animations
• CPC Class Codes: H04M 1/7243 with interactive means for internal management of messages
• CPC Class Codes: H04M 1/72445 for supporting Internet browser applications
• CPC Class Codes: H04M 2250/70 : methods for entering alphabetical characters, e.g. multi-tap or dictionary disambiguation methods for entering alphabetical characters per se G06F3/0237

Abstract

A keypad assembly utilizes touch-detecting apparatus such as force sensors or touchpad assemblies for registering key presses. In exemplary embodiments, the keypad assembly is suitable for use in electronic devices such as a mobile telephones, calculators, hand-held computers, or the like, having single piece molded housings wherein the keypad assembly is at least partially encapsulated within the housing.

Claims

1. A keypad assembly, comprising:

a substrate;

a force sensor disposed on the substrate; and

an encapsulation layer molded onto the substrate over the force sensor, the substrate and force sensor being at least partially encapsulated by the encapsulation layer so that the force sensor is sandwiched between the substrate and encapsulation layer,

wherein the force sensor is suitable for sensing a force applied to the encapsulation layer over to the force sensor for registering a key press to the keypad assembly.

2. The keypad assembly as claimed in claim 1, wherein force registration by the force sensor is adjustable for canceling preload forces placed on the force sensor by molding of the encapsulation layer.

3. The keypad assembly as claimed in claim 1, wherein the encapsulation layer is molded of a generally resilient material.

4. The keypad assembly as claimed in claim 1, further comprising a key shape molded into the encapsulation layer over the force sensor for indicating a key of the keypad assembly.

5. The keypad assembly as claimed in claim 1, further comprising indicia applied to the encapsulation layer over the force sensor for indicating a key of the keypad assembly.

39. The keypad assembly as claimed in claim 1, wherein the force sensor comprises a piezoelectric force cell.

6. A keypad assembly, comprising:

a means for sensing a force;

means for supporting the force sensing means; and

means, molded onto the supporting means, for encapsulating the substrate and force sensing means, the force sensing means being sandwiched between the encapsulating means and the supporting means,

wherein the force sensing means is suitable for sensing a force applied to the encapsulating means over to the force sensing means for registering a key press to the keypad assembly.

7. The keypad assembly as claimed in claim 6, wherein force registration by the force sensing means is adjustable for canceling preload forces placed on the force sensing means by molding of the encapsulating means.

8. The keypad assembly as claimed in claim 6, wherein the encapsulating means is molded of a generally resilient material.

9. The keypad assembly as claimed in claim 6, further comprising means for identifying the key of the keypad assembly.

10. An electronic device, comprising:

a keypad including a substrate and a force sensor disposed on the substrate; and

a housing molded onto the substrate so that the force sensor is at least partially encapsulated by

the housing, the force sensor being sandwiched between the housing and the substrate for

at least substantially eliminating spaces between the housing and the force sensor and the

force sensor and the substrate, wherein the force sensor is suitable for sensing a force applied to a portion of the housing over to

the force sensor for registering a key press of the keypad.

11. The electronic device as claimed in claim 10, wherein force registration by the force sensor is adjustable for canceling preload forces placed on the force sensor by molding of the housing.

12. The electronic device as claimed in claim 10, wherein the housing is molded of a generally resilient material.

13. The electronic device as claimed in claim 10, further comprising a key shape molded into the housing over the force sensor.

14. The electronic device as claimed in claim 10, further comprising indicia applied to the housing over the force sensor.

40. The electronic device as claimed in claim 10, wherein the force sensor comprises a piezoelectric force cell.

15. A mobile telephone, comprising:

a keypad including a substrate and a force sensor disposed on the substrate; and

a housing molded onto the substrate so that the force sensor is at least partially encapsulated by

the housing so that spaces between the housing and force sensor and the force sensor and

the substrate are at least substantially eliminated, wherein the force sensor is suitable for detecting a force applied to a portion of the housing over

to the force sensor for registering a key press of the keypad.

16. The mobile telephone as claimed in claim 15, wherein force registration by the force sensor is adjustable for canceling preload forces placed on the force sensor by molding of the housing.

17. The mobile telephone as claimed in claim 15, wherein the housing is molded of a generally resilient material.

18. The mobile telephone as claimed in claim 15, further comprising a key shape molded into the housing over the force sensor.

19. The mobile telephone as claimed in claim 15, further comprising indicia applied to the housing over the force sensor.

41. The mobile telephone as claimed in claim 15, wherein the force sensor comprises a piezoelectric force cell.

20-31. -31. (Canceled)

32. A method for manufacturing a keypad assembly, comprising:

assembling a keypad, the keypad including a substrate having a force sensor disposed thereon for

sensing a force applied thereto and registering a key press; and

overmolding an encapsulation layer onto the keypad so that the substrate and force sensor are at

least partially encapsulated within the encapsulation layer, the force sensor being

sandwiched between the housing and the substrate for at least substantially eliminating

spaces between the housing and the force sensor and the force sensor and the substrate.

34. The method as claimed in claim 32, further comprising adjusting force registration by the force sensor for canceling preload forces placed on the force sensor by molding of the encapsulation layer.

35. The method as claimed in claim 32, wherein the step of overmolding the encapsulation layer onto the keypad comprises molding a key shape into the encapsulation layer over the force sensor.

36. The method as claimed in claim 32, further comprising applying indicia to the encapsulation layer over the force sensor.

37. The method as claimed in claim 32, wherein the step of overmolding the encapsulation layer comprises molding a housing of an electronic device, the encapsulation layer forming a portion of the housing.

33. (Canceled)

38. (Canceled)

42. A keypad assembly, comprising:

a substrate;

a force sensor disposed on the substrate; and

an encapsulation layer molded onto the substrate over the force sensor without formation of a compressible key dome, the substrate and force sensor being at least partially encapsulated by the encapsulation layer so that the encapsulation layer is in continuous contact with the force sensor,

wherein the force sensor is suitable for sensing a force applied to the encapsulation layer over to the force sensor for registering a key press to the keypad assembly.

43. The keypad assembly as claimed in claim 42, wherein force registration by the force sensor is adjustable for canceling preload forces placed on the force sensor by molding of the encapsulation layer.

44. The keypad assembly as claimed in claim 42, wherein the encapsulation layer is molded of a generally resilient material.

45. The keypad assembly as claimed in claim 42, further comprising a key shape molded into the encapsulation layer over the force sensor for indicating a key of the keypad assembly.

46. The keypad assembly as claimed in claim 42, further comprising indicia applied to the encapsulation layer over the force sensor for indicating a key of the keypad assembly.

47. A keypad assembly, comprising:

a substrate;

a force sensor disposed on the substrate; and

an encapsulation layer molded onto the substrate over the force sensor, the substrate and force

sensor being at least partially encapsulated by the encapsulation layer so that the force

sensor is sandwiched between the housing and the substrate for eliminating spaces

between the encapsulating layer and force sensor and the force sensor and the substrate, wherein the force sensor is suitable for sensing a force applied to the encapsulation layer over the

force sensor for registering a key press to the keypad assembly.

48. The keypad assembly as claimed in claim 47, wherein force registration by the force sensor is adjustable for canceling preload forces placed on the force sensor by molding of the encapsulation layer.

49. The keypad assembly as claimed in claim 47, wherein the encapsulation layer is molded of a generally resilient material.

50. The keypad assembly as claimed in claim 47, further comprising a key shape molded into the encapsulation layer over the force sensor for indicating a key of the keypad assembly.

51. The keypad assembly as claimed in claim 47, further comprising indicia applied to the encapsulation layer over the force sensor for indicating a key of the keypad assembly.