×

Vacuum package fabrication of integrated circuit components

  • US 20050042839A1
  • Filed: 10/18/2004
  • Published: 02/24/2005
  • Est. Priority Date: 05/02/2003
  • Status: Active Grant
First Claim
Patent Images

1. A method for manufacturing an integrated circuit device lid, comprising the steps of:

  • forming one or more a lid cavities on the surface of a lid wafer;

    forming one or more sealing surfaces on the lid wafer disposed around the cavity; and

    forming one or more trenches in the lid wafer, wherein each trench is disposed between one of the sealing surfaces and one of the lid cavities.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×